CONTENTS V
5.
CALIBRATION ADJUSTMENT PROCEDURE 5-1
5.1 GENERAL INFORMATION 5-1
5.2 RECOMMENDED CALIBRATION ADJUSTMENT EQUIPMENT 5-1
5.3 ENTERING THE CALIBRATION PROCEDURE 5-2
5.4 OPERATING THE CAUBRATION PROCEDURE 5-3
5.5 CONTRAST CALIBRATION ADJUSTMENT PROCEDURE 5-4
5.6 SCOPE CALIBRATION ADJUSTMENT PROCEDURE 5-4
5.6.1 HARDWARE SCOPE CAUBRATION ADJUSTMENTS 5-4
5.6.2 CLOSED CASE SCOPE CALIBRATION ADJUSTMENTS 5-8
5.7 METER CAUBRATION ADJUSTMENT PROCEDURE 5-15
5.8 CALIBRATION ADJUSTMENT PROCEDURE SUMMARY 5-24
6. DISASSEMBLING THE SCOPEMETER 6-1
6.1
GENERAL INFORMATION 6-1
6.2. DISASSEMBLY PROCEDURE 6-1
6.2.1 REMOVING THE BATTERY PACK 6-2
6.2.2 OPENING THE SCOPEMETER 6-2
6.2.3 REMOVING THE ANALOG A2 PCB. TO ENABLE HARDWARE
SCOPE CAUBRATION ADJUSTMENTS 6-4
6.2.4 REMOVING THE DIGITAL A1 PCB 6-4
7.
CORRECTIVE MAINTENANCE 7-1
7,1 DIAGNOSTIC TESTING AND TROUBLESHOOTING 7-1
7.1.1 INTRODUCTION 7-1
7.1.2 TROUBLESHOOTING TECHNIQUES 7-1
7.1.3 DISPLAY AND ERROR MESSAGES 7-2
7.1.4 MAIN TESTS 7-5
7.1.5 TROUBLESHOOTING 7-7
7.1.6 DIGITAL At PCB TROUBLESHOOTING 7-7
7.1.7 ANALOG A2 PCB TROUBLESHOOTING 7-28
72 REPLACEMB^TS 7-40
7.2.1 STANDARD PARTS 7-40
7.2.2 SPECIAL PARTS 7-40
7.2.3 TRANSISTORS AND INTEGRATED CIRCUITS 7-40
7.2.4 STATIC-SENSITIVE COMPONENTS 7-40
7.2.5 REPLACEMENT OF PARTS 7-42
7.3 SOLDERING TECHNIQUES 7.5I
7-3-1 GENERAL SOLDERING TECHNIQUES 7-51
7.3.2 SOLDERING MICRO-MINIATURE SEMICONDUCTORS 7-51