Renesas ISL81601EVAL2Z User manual

Rev.0.00 Mar 2018

User’s Manual

ISL81601EVAL2Z

User’s Manual: Evaluation Board

Industrial Analog and Power

UG160 Rev.0.00 Page 2 of 19

Mar 23, 2018

UG160

Rev.0.00

Mar 23, 2018

ISL81601EVAL2Z

Evaluation Board

USER’S MANUAL

1. Overview

The ISL81601EVAL2Z evaluation board (shown in Figure 5 on page 8) features the ISL81601, a 60V high voltage

synchronous buck-boost controller that offers external soft-start, independent enable functions, and integrates

UV/OV/OC/OT protection. Programmable switching frequency ranging from 100kHz to 600kHz helps to optimize

inductor size while the strong gate driver delivers up to 20A for the buck-boost output.

1.1 Key Features

• Wide input range: 32V to 60V

• Bi-directional operation

• High light-load efficiency in pulse skipping DEM operation

• Programmable soft-start

• Optional DEM/PWM operation

• Optional CC/HICCUP OCP protection

• Supports prebias output with soft-start

• PGOOD indicator

• OVP, OTP, and UVP protection

1.2 Specifications

The ISL81601EVAL2Z evaluation board is designed for high current applications. The current rating of the

ISL81601EVAL2Z is limited by the FETs and inductor selected. The ISL81601EVAL2Z electrical ratings of are

shown in Table 1.

1.3 Ordering Information

1.4 Related Literature

• For a full list of related documents, visit our website

•ISL81601 product page

Table 1. Electrical Rating

Parameter Rating

Input Voltage 32V to 60V

Switching Frequency 200kHz

Output Voltage 48V

Output Current 5A

OCP Set Point Minimum 5.5A at ambient room temperature

Part Number Description

ISL81601EVAL2Z High Voltage BUCK-BOOST Controller Evaluation Board

UG160 Rev.0.00 Page 3 of 19

Mar 23, 2018

ISL81601EVAL2Z 1. Overview

Figure 1. ISL81601EVAL2Z Block Diagram

ISL81601

EXTBIAS

VDD

SS/TRK

RT/SYNC

FB_OUT

PGND

VIN

EN/UVLO

SGND

VCC5V

COMP

ISEN-

ISEN+ CS-

CS+/VINSEN

PHASE2

LG1

PWM_MODE

PHASE1

UG1

BOOT1

UG2

BOOT2

LG2

OC_MODE

VDD

PLL_COMP

VIN

VOUT

FB_IN

CLKOUT

DITHER

IMON_IN

IMON_OUT

PGOOD

CLKEN

BSTEN

UG160 Rev.0.00 Page 4 of 19

Mar 23, 2018

ISL81601EVAL2Z 2. Functional Description

2. Functional Description

The ISL81601VAL2Z is the same test board used by Renesas application engineers and IC designers to evaluate the

performance of the ISL81601 HTSSOP IC. The board provides an easy and complete evaluation of all the IC and

board functions.

As shown in Figure 4 on page 6, 32V to 60V VIN is supplied to J1 (+) and J2 (-). The regulated 48V output on J4 (+)

and J5 (-) can supply up to 5A to the load. Due to the high power efficiency, the evaluation board can run at 5A

continuously without airflow at room temperature ambient conditions.

Test points TP1 through TP28 provide easy access to the IC pin and external signal injection terminals.

As shown in Table 2 on page 5, connector J8 provides selection of either Forced PWM mode (shorting Pin 1 and Pin 2)

or DEM mode (shorting Pin 2 and Pin 3). Connector J9 provides selection of either constant current limit (shorting Pin

1 and Pin 2) or HICCUP OCP(shorting Pin 2 and Pin 3). Connector J3 provides an option to disable the converter by

shorting its Pin 1 and Pin 2.

2.1 Recommended Testing Equipment

The following materials are recommended for testing:

• 0V to 60V power supply with at least 10A source current capability

• Electronic loads capable of sinking current up to 10A

• Digital Multimeters (DMMs)

• 100MHz quad-trace oscilloscope

2.2 Operating Range

The input voltage range is from 32V to 60V for an output voltage of 48V. If the output voltage is set to a lower

value, the minimum VIN can be reset to a lower value by changing the ratio of R2 and R3. The minimum EN

threshold that VIN can be set to is 4.5V.

The rated load current is 5A with the OCP point set at minimum 5.5A at ambient room temperature conditions. The

operating temperature range of this board is from -40°C to +85°C. Note that airflow is needed for higher

temperature ambient conditions.

2.3 Bi-Directional Operation

Refer to Figure 2 for proper setup. Float the FBI pin (J7) and set the mode to PWM before powering on the board.

The rated voltage of the super capacitor must be higher than 48V.

(1) Adjust the input voltage higher than 36V. Switch on the input power source.

(2) Switch off the input power source after the super capacitor is fully charged.

Figure 2. Proper Set-Up for Bi-Directional Operation

DC ISL81601EVAL2Z

VIN

GND

VOUT

GND

Load

UG160 Rev.0.00 Page 5 of 19

Mar 23, 2018

ISL81601EVAL2Z 2. Functional Description

2.4 Quick Test Guide

(1) Jumper J8 provides the option to select PWM or DEM. Jumper J9 provides the option to select Constant

current limit or HICCUP. Refer to Table 2 for the operating options. Ensure that the circuit is correctly

connected to the supply and electronic loads prior to applying any power. Refer to Figure 4 on page 6 for

proper setup.

(2) Turn on the power supply.

(3) Adjust input voltage VIN within the specified range and observe the output voltage. The output voltage

variation should be within 3%.

(4) Adjust the load current within the specified range and observe the output voltage. The output voltage variation

should be within 3%.

(5) Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, refer

to Figure 3 for proper test setup.

Table 2. Operating Options

Jumper Position Function

3 EN-GND Disable output

EN Floating Enable output

IN Floating Enable input current limit

IIN-VCC5 Disable input current limit

7 FBI-GND Disable VIN limit

FBI Floating Enable VIN limit

8Pin 1-2 PWM

Pin 2-3 DEM

9 Pin 1-2 Constant current limit

Pin 2-3 HICCUP

Figure 3. Proper Probe Set-Up to Measure Output Ripple and Phase Node Ringing

Output Capacitor

or MOSFET

UG160 Rev.0.00 Page 6 of 19

Mar 23, 2018

ISL81601EVAL2Z 2. Functional Description

Figure 4. Proper Test Setup

VIN

Load

UG160 Rev.0.00 Page 7 of 19

Mar 23, 2018

ISL81601EVAL2Z 3. PCB Layout Guidelines

3. PCB Layout Guidelines

Careful attention to layout requirements is necessary for successful implementation of an ISL81601 based DC/DC

converter. The ISL81601 switches at a very high frequency; therefore the switching times are very short. At these

switching frequencies, even the shortest trace has significant impedance. The peak gate drive current also rises

significantly in an extremely short time. Transition speed of the current from one device to another causes voltage

spikes across the interconnecting impedances and parasitic circuit elements. These voltage spikes can degrade

efficiency, generate EMI, and increase device voltage stress and ringing. Careful component selection and proper PC

board layout minimizes the magnitude of these voltage spikes.

Three sets of components are critical when using the ISL81601 DC/DC converter:

• Controller

• Switching power components

• Small signal components

The switching power components are the most critical to the layout because they switch a large amount of energy,

which tends to generate a large amount of noise. The critical small signal components are those connected to sensitive

nodes or those supplying critical bias currents. A multilayer printed circuit board is recommended.

Complete the following steps to optimize the PCB layout.

(1) The input capacitors, buck FETs, inductor, boost FETs, and output capacitor should be placed first. Isolate these

power components on dedicated areas of the board with their ground terminals adjacent to one another. Place the

input and output high frequency decoupling ceramic capacitors very close to the MOSFETs.

(2) If signal components and the IC are placed separately from the power train, it is recommended to use full ground

planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise, use separate

ground planes for the power ground and the small signal ground. Connect the SGND and PGND together close to

the IC. DO NOT connect them together anywhere else.

(3) The loop formed by the input capacitor, the buck top FET, and the buck bottom FET must be kept as small as

possible. Also, the loop formed by the output capacitor, the boost top FET, and the boost bottom FET must also be

kept as small as possible.

(4) Ensure the current paths from the input capacitor to the buck FETs, the power inductor, the boost FETs, and the

output capacitor are as short as possible with maximum allowable trace widths.

(5) Place the PWM controller IC close to the lower FETs. The low-side FETs gate drive connections should be short

and wide. The IC should be placed over a quiet ground area. Avoid switching ground loop currents in this area.

(6) Place the VDD bypass capacitor very close to the VDD pin of the IC and connect its ground end to the PGND pin.

Connect the PGND pin to the ground plane by a via. Do not connect the PGND pin directly to the SGND EPAD.

(7) Place the gate drive components (BOOT diodes and BOOT capacitors) together near the controller IC.

(8) Place the output capacitors as close to the load as possible. Use short, wide copper regions to connect output

capacitors to the load to avoid inductance and resistance.

(9) Use copper filled polygons or wide, short traces to connect the junction of the buck or boost upper FET, buck or

boost lower FET, and output inductor. Keep the buck and boost PHASE nodes connection to the IC short. DO

NOT unnecessarily oversize the copper islands for the PHASE nodes. Because the phase nodes are subjected to

very high dv/dt voltages, the stray capacitor formed between these islands and the surrounding circuitry will tend

to couple switching noise.

(10) Route all high speed switching nodes away from the control circuitry.

(11) Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. All small signal

grounding paths including feedback resistors, current monitoring resistors and capacitors, soft-starting capacitors,

loop compensation capacitors and resistors, and EN pull-down resistors should be connected to this SGND plane.

(12) Use a pair of traces with minimum loop for the input or output current sensing connection.

(13) Ensure the feedback connection to the output capacitor is short and direct.

UG160 Rev.0.00 Page 8 of 19

Mar 23, 2018

ISL81601EVAL2Z 3. PCB Layout Guidelines

3.1 ISL81601VAL2Z Evaluation Board

Figure 5. ISL81601VAL2Z Evaluation Board (Top)

Figure 6. ISL81601VAL2Z Evaluation Board (Bottom)

UG160 Rev.0.00 Page 9 of 19

Mar 23, 2018

ISL81601EVAL2Z 3. PCB Layout Guidelines

3.2 ISL81601VAL2Z Circuit Schematic

Figure 7. Schematic

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UG160 Rev.0.00 Page 10 of 19

Mar 23, 2018

ISL81601EVAL2Z 3. PCB Layout Guidelines

3.3 Bill of Materials

Qty Reference Designator Description Manufacturer Manufacturer Part

1 PWB-PCB, ISL81601EVAL2Z,

REVA, ROHS

IMAGINEERING INC ISL81601EVAL2ZREVAPCB

1 C33 CAP-AEC-Q200, SMD, 0603,

0.01µF, 50V, 10%, X7R,

ROHS

TDK CGA3E2X7R1H103K080AE

16 C1, C2, C5, C6, C7, C8, C9,

C10, C18, C19, C20, C21,

C22, C23, C24, C25

CAP-AEC-Q200, SMD, 1210,

4.7µF, 100V, 10%, X7S, ROHS

TDK CGA6M3X7S2A475K200AE

1 C39 CAP-AEC-Q200, SMD, 0603,

0.022µF, 25V, 10%, X7R,

ROHS

TDK CGJ3E2X7R1E223K080AA

1 C36 CAP-AEC-Q200, SMD, 0603,

0.033µF, 25V, 10%, X7R,

ROHS

TDK CGJ3E2X7R1E333K080AA

2 C14, C45 CAP-AEC-Q200, SMD, 0603,

0.047µF, 25V, 10%, X7R,

ROHS

TDK CGJ3E2X7R1E473K080AA

4 C12, C13, C41, C42 CAP-AEC-Q200, SMD, 0603,

0.01µF, 100V, 10%, X7R,

ROHS

MURATA GCM188R72A103KA37D

2 C16, C46 CAP-BOARDFLEX, SMD,

0603, 0.1µF, 100V, 10%, X7R,

ROHS

MURATA GRJ188R72A104KE11D

2 C31, C32 CAP, SMD, 0805, 10µF, 16V,

10%, X7S, ROHS

MURATA GRM21BC71C106KE11L

3 C11, C15, C43 CAP, SMD, 0603, 1000pF,

50V, 10%, X7R, ROHS

AVX 06035C102KAT2A

1 C40 CAP, SMD, 0603, 220pF, 50V,

10%, X7R, ROHS

MURATA GRM188R71H221KA01D

3 C29, C48, C53 CAP, SMD, 0603, 470pF,

100V, 5%, C0G, ROHS

TDK C1608C0G2A471J

2 C30, C37 CAP, SMD, 0603, 0.47µF, 25V,

10%, X7R, ROHS

MURATA GRM188R71E474KA12D

1 C34 CAP, SMD, 0603, 820pF, 50V,

10%, X7R, ROHS

KEMET C0603C821K5RACTU

0 C17, C28, C35, C38, C44,

C47, C49, C50, C51, C52

CAP, SMD, 0603,

DNP-PLACE HOLDER, ROHS

4 C3, C4, C26, C27 CAP, RADIAL, 12.5x26.5,

220µF, 100V, 20%,

ALUM.ELEC., 5mm, ROHS

UNITED CHEMI-CON EKZN101ELL221MK25S

1 L1 COIL-PWR INDUCTOR, SMD,

17.15mm, 22µH, 20%, 12A,

21mΩ, ROHS

VISHAY IHLP6767GZER220M11

27 TP1, TP2, TP4-TP28 CONN-COMPACT TEST PT,

VERTICAL, WHT, ROHS

KEYSTONE 5007

2 J3, J6 CONN-HEADER, 1x2,

BRKAWY 1x36, 2.54mm,

ROHS

BERG/FCI 68000-236HLF

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