JETWAY NP591 User manual
Technical Manual
Of
Intel Braswell Series CPU
Based
SBC
NO.G03-NP591-F
Revision: 1.0
Release date: November 12, 2015
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
iii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iv
USER’S NOTICE .......................................................................................................................v
MANUAL REVISION INFORMATION .......................................................................................v
ITEM CHECKLIST .....................................................................................................................v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ................................................................................1
1-2 SPECIFICATION .........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................6
2-2 CONNECTORS AND HEADERS................................................................................12
2-2-1 CONNECTORS .............................................................................................12
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................20
3-2 BIOS MENU SCREEN ................................................................................................21
3-3 FUNCTION KEYS .......................................................................................................21
3-4 GETTING HELP ..........................................................................................................22
3-5 MEMU BARS............................................................................................................... 22
3-6 MAIN MENU ................................................................................................................23
3-7 ADVANCED MENU.....................................................................................................24
3-8 CHIPSET MENU..........................................................................................................34
3-9 SECURITY MENU .......................................................................................................36
3-10 BOOT MENU...............................................................................................................37
3-11 SAVE & EXIT MENU...................................................................................................38
TABLE OF CONTENT
iv
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition 2015-11-12
Item Checklist
Motherboard
User’s Manual
CD for motherboard utilities
Cable(s)
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Braswell series SoC Processor, with low power consumption
never denies high performance
Onboard optional 2GB/4GB DDR3L 1600 MHz DRAM
Support 1 * SATAIII (6Gb/s) device
Onboard 1* full-size Mini-PCIE slot
Onboard 1* M.2 slot (M-key 2242 SATA interface for SSD device)
Integrated with 1 * 24-bit dual channel LVDS header
Support DP 1.1 output (Max. resolution 2560*1600@60Hz)
Support USB 3.0 data transport demand
Support CPU Over-Temperature protection
Support CPU Over-Current/Under Voltage protection
Support DRAM Over-Current/Under Voltage protection
Compliance with ErP standard
Support Watchdog function
2
1-2 Specification
Spec Description
Design Pico Form Factor;8-layer SBC;
PCB size: 100 mm x 72 mm
Embedded CPU
Intel® Braswell SoC CPU*
*CPU model varies from different IPC options. Please consult your
dealer for more information of onboard CPU.
Memory Onboard optional 2GB/4GB un-buffered DDR3L 1600 MHz
DRAM
Expansion Slot 1* Full-size Mini-PCIE slot (MPE)
Storage 1* SATAIII port
1*M.2 M-key 2242 slot(M2)
LAN Chip
Integrated with Intel® i211AT PCI-E Gigabit LAN chip
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip Realtek ALC662 2-CH HD Audio Codec integrated
Audio driver and utility included
BIOS 64Mbit Flash ROM
Rear I/O
1* 12V DC-in power jack
2* USB 3.0 port
1* Display port (HDMI port optional by order)
1* RJ-45 LAN port
Internal I/O
1* 2-Pin Internal 12V DC-in power connector
1* SATA Power-out connector
1* Front panel audio header
1* 9-pin USB 2.0 header (Expansible to 2* USB 2.0 ports)
2* Serial port header (COM1 support RS232/RS422/RS485)
1* Front panel header
1* LAN LED activity header
1* LVDS header
1* LVDS inverter
3
* Note: 1. Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and higher USB
speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB controllers within platforms.
However, legacy operating systems (OS) may not natively recognize XHCI controllers. You might need to
pre-install XHCI driver while desiring to install a non-xHCI OS (ex.Windows* 7) on Intel platforms which do not
include EHCI controllers. Please contact your representative for more details. 2. Braswell SOC will support
memory speed at 1600 MHz and 1066 MHz only. If 1333 MHz DIMM is installed, it will run at 1066 MHz. It is not
validated while installing 1066MHz DIMM with this SOC.
1-3 Layout Diagram
Rear IO Panel Diagram:
*Note: Display port may be replaced by HDMI port option by customized order.
Warning!
The board has a DC 12V power connector (DCIN) in I/O back panel and an internal ATX12V
(ATX2P) power connector. User can only connect one type of compatible power supply to one
of them to power the system.
12V DC-in
Power Jack
*
Display Port
USB 3.0 Ports
RJ-45 LAN Port
4
Internal Diagram-Front Side:
*Note: Display port may be replaced by HDMI port option by customized order.
Onboard
2G/4GB
DRAM
RJ-45
LAN Port
Front Panel
Audio Header
USB 2.0 Headers
LVDS
Header
USB 3.0 Ports
SATA III Port
LVDS
INVERTER
*Display Port
12V DC-in
Power Jack
M.2
SATA Slot
Front Panel Header
AT_MODE
JP2
Internal12V Power
Connector
JP6
LANLED Header
SATA Power-out Connector
JP1
JP4
JP5
Full-size
Mini-PCIE Slot
COM2
Serial Port Header
COM1
Serial Port Header
5
Internal Diagram-Back Side:
Warning: CPU is the most important part of the board and very fragile to any possible harm. Make
sure that there is no damage to the CPU during any installation procedures!
Intel CPU
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