HP ProLiant ML370G4 SAS Assembly instructions
HP-00007-01, Appendix 3 28-Feb-2004
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
HP ProLiant ML370G4_SAS 2-Way 2 Processor Server
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10
square cm 11
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
0
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated
displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
2
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials 0
HP-00007-01, Appendix 3 28-Feb-2004
Page 2
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Philips Screw Driver #2
Flat Head Screw Driver Small
Flat Head Screw Driver Large
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 System Board Battery – Remove the top cover and locate the battery on the system
board. With a small flat head screw driver remove the battery and discard properly.
2 2.5CM Capacitors – Remove the power supply(s) from the system. With #2 Philips screw
driver remove the screws securing the top cover then locate the capacitors and pry from
the PCB with a large flat head screw driver and discard properly.
3 SAS Controller Battery – Unplug and remove the SAS controller from the system then with
a flat head screw driver remove the battery and discard properly.
4
5
6
7
8
9
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
Attachment 1 – Disassembly Diagram
Attachment 2 – System Battery Location
Attachment 3 – Capacitor Locations
Attachment 4 – SAS Battery Location
HP-00007-01, Appendix 3 28-Feb-2004
Page 3
Battery located
on SAS controller
that is plugged
into the system
board Item #15
Battery located
on system
board
Item #15
2 Capacitors
located in P/S
Item #10
Attachment 1
Attachment 2
HP-00007-01, Appendix 3 28-Feb-2004
Page 4
Attachment 3
Attachment 4
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