HP Z1 G2 Assembly instructions

Product End-of-Life Disassembly Instructions

Product Category: Workstations

Marketing Name / Model

[List multiple models if applicable.]

HP Z1 Workstation G2

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries CR 2032

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LM270WQ1-SDG1

Cathode Ray Tubes (CRT)

N/A

Capacitors / condensers (Containing PCB/PCT)

N/A

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

N/A

External electrical cables and cords

N/A

Gas Discharge Lamps

N/A

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

N/A

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations. N/A

Components and waste containing asbestos

N/A

Components, parts and materials containing

refractory ceramic fibers

adaptor

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

N/A

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screw driver

T15

Description #2 Screw driver

Description #3 Screw driver

Description #4 Screw driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. [system parts] Remove the stand

2. [system] Remove TOP bezel

3. [System] remove memory FAN

4. [System] Remove the HDD

5. [System] Remove Cpu thermal module

6. [System]Remove ODD

7. [System]Remove site IO board

8. [System] Remove rear IO board

9. [System]Remove EMI CAN

10. [System]Remove speaker

11. [System] Remove MXM power connector

12. [System] Remove PSU

13. [System] Remove hinge& panel IO cable

14. [System]Remover antenna

15. [System] Remove MXM module

16. [System] remove PCIE card

17. [System] Remove MB

18. [System] Remove CPU bracket/CPU

19. [System] Remove memory

20. [System] remove spring

21. [System]Remove front bezel

22. [System]Remove web camera module

23. [System]remove latch

24. [System]remove touch plan

25. System]PSU

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

[System Parts]

1) Remove the stand

a) Ready for stand remove

b)take off stand cover

c) Use T15 screw driver to

disassemble the stand screw

d) Take the stand leaving from Chassis

e) stand disassembly finish

2) Remove TOP bezel

a)push left and right side latch

b) Open the top bezel

c) disassembly LVDS cable

d) Pull the antenna aux cable out of

PCIe short card

e) Pull the antenna main cable out of

PCIe short card

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

h)Pull the connector out of PCA

i) Use T15 screw driver to

disassemble the screw

j) Use T15 screw driver to disassemble

the screw

k) Use T15 screw driver to disassemble

the screw

l) remove Front bezel

m) disassembly finish

3)remove memory FAN

a)Push memory latch.

Then, pull up the memory fan

b) disassembly finish

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

4) Remove the HDD

a) Ready for HDD disassembly

b)push HDD handle

pull up the HDD carrier

Pull HDD out of carrier latch

Remove connector

Disassembly SATA connector from

c) Use T15 screw driver to

disassemble the screw

Remove sensor from clip

c) Use T8 screw driver to

disassemble the screw

b) disassembly finish

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

5)Remove Cpu thermal module

a) Use T15 screw driver to

disassemble the screw

b)remove CPU thermal

C)disassembly finish

6)Remove ODD

a)disassembly SATA connector

b)push ODD latch

c)remove ODD

a) Press ODD carrier latch then pull

it out.

b) disassembly finish

7)Remove site IO board

a) Use T15 screw driver to

disassemble the screw

b)remove site io card

c) disassembly finish

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

8)Remove rear IO board

a) Use T15 screw driver to disassemble

the screw

b)remove rear IO

c)pull out connector from rear IO

board

d) disassembly finish

9)Remove EMI CAN

a) Use T15 screw driver to

disassemble the screw

b)push out connector

c) disassembly finish

10)Remove speaker

a) Use T15 screw driver to

disassemble the screw

b)remove left and right speaker

d) disassembly finish

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

11)Remove MXM power connector

a) Use T15 screw driver to

disassemble the screw

Remove MXM power connector

12)Remove PSU

a)push handle latch

b) Turn the latch of PSU to

downward

C)disassembly connector

d)remove PUS

e) disassembly finish

13)Remove hinge& panel IO cable

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

a) Use T15 screw driver to disassemble the screw

b)disassembly panel IO cable

14)Remover antenna

a) Use T15 screw driver to

disassemble the screw

b) remove aux antenna

c)remove main antenna

15)Remove MXM module

a)press MXM latch

b)remove MXM module

c) Use T15 screw driver to

disassemble the screw

d)remove MXM heatsink

e)remove MXM card

16)remove PCIE card

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01

a) Pull the antenna aux cable out of

PCIe short card

b) c) Use T6 screw driver to

disassemble the screw

c)remove WLAN card module

d) Use T6 screw driver to

disassemble the screw

e) disassembly finish

17)Remove MB

a)ready for MB disassembly

b)remove connector from MB

C)remove LVDS cable from MB

d)remove backlight cable from MB

e)remove panel IO cable from MB

e)remove panel IO cable from

f)remove speaker IO cable from MB

g) Use T15 screw driver to disassemble

the screw

EL-MF877-00 Page 10

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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