Aries Embedded M100PFEVP User manual

M100PFEVP Hardware Manual
Release 1
ARIES Embedded GmbH
October 17, 2019


CONTENTS
1 About this manual 1
1.1 Imprint .................................................. 1
1.2 Disclaimer ................................................ 1
1.3 Copyright ................................................. 1
1.4 Registered Trademarks .......................................... 1
1.5 Care and Maintenance .......................................... 2
1.6 Change Log ............................................... 2
2 Overview 3
2.1 Block Diagram .............................................. 4
2.2 Feature Set ................................................ 4
2.3 Dimensions ................................................ 5
2.4 Parts Location .............................................. 6
2.5 Handling Recommendations ....................................... 6
3 Resources 7
3.1 Ethernet .................................................. 7
3.2 UART ................................................... 7
3.3 USB-OTG ................................................ 7
3.4 CAN ................................................... 8
3.5 JTAG (P8) ................................................ 8
3.6 Pmod Module Connectors ........................................ 8
3.7 HSMC Connector (J2) .......................................... 9
3.8 Samtec Connector ............................................ 12
4 Appendix 17
4.1 Schematics ................................................ 17
4.2 Layout Diagram ............................................. 27
i

ii

CHAPTER
ONE
ABOUT THIS MANUAL
1.1 Imprint
Adress:
ARIES Embedded GmbH
Schöngeisinger Str. 84
D-82256 Fürstenfedbruck
Germany
Phone:
+49 (0) 8141/36 367-0
Fax:
+49 (0) 8141/36 367-67
1.2 Disclaimer
ARIES Embedded does not guarantee that the information in this document is up-to-date, correct, complete or of good
quality. Liability claims against ARIES Embedded, referring to material or non-material related damages caused,
due to usage or non-usage of the information given in this document, or due to usage of erroneous or incomplete
information, are exempted, as long as there is no proven intentional or negligent fault of ARIES Embedded. ARIES
Embedded explicitly reserves the rights to change or add to the contents of this Preliminary User’s Manual or parts of
it without notification.
1.3 Copyright
This document may not be copied, reproduced, translated, changed or distributed, completely or partially in any form
without the written approval of ARIES Embedded GmbH.
1.4 Registered Trademarks
The contents of this document may be subject of intellectual property rights (including but not limited to copyright,
trademark, or patent rights). Any such rights that are not expressly licensed or already owned by a third party are
reserved by ARIES Embedded GmbH.
1

M100PFEVP Hardware Manual, Release 1
1.5 Care and Maintenance
• Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain minerals that will
corrode electronic circuits. If your device does get wet, allow it to dry completely.
• Do not use or store the device in dusty, dirty areas. Its moving parts and electronic components can be damaged.
• Do not store the device in hot areas. High temperatures can shorten the life of electronic devices, damage
batteries, and warp or melt certain plastics.
• Do not store the device in cold areas. When the device returns to its normal temperature, moisture can form
inside the device and damage electronic circuit boards.
• Do not attempt to open the device.
• Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and fine mechanics.
• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.
• Do not paint the device. Paint can clog the moving parts and prevent proper operation.
• Unauthorized modifications or attachments could damage the device and may violate regulations governing
radio devices.
1.6 Change Log
Revision Date Revised Comment
1.0 05.09.2019 aw Initial creation
2 Chapter 1. About this manual

CHAPTER
TWO
OVERVIEW
M100PFEVP represents the flexible Evaluation Platform for working with the M100PF SoM for PolarFire FPGAs.
The system helps developers to have a smooth start with the M100PF SoMs, it can be used for designing IP, developing
software as well as implementing prototypes.
3

M100PFEVP Hardware Manual, Release 1
2.1 Block Diagram
2.2 Feature Set
For supporting development projects and fast prototyping in the best possible way M100PFEVP supplies:
• 2x Gigabit Ethernet on a RJ45 connector
• USB on a mini-USB connector
• 2x UART on a DUSB-9 connector each
• 2x CAN on a DUSB-9 connector each
• TFT with Touch
• HSMC extension connector
• 3x PMOD extension connectors
• microSD-card slot
• JTAG pin header
• flexible supply voltage 7V to 36V DC
4 Chapter 2. Overview

M100PFEVP Hardware Manual, Release 1
2.3 Dimensions
2.3. Dimensions 5

M100PFEVP Hardware Manual, Release 1
2.4 Parts Location
The available functional blocks can be found on the baseboard as follows:
2.5 Handling Recommendations
The populated Samtec connectors require certain mechanical force to insert the SoM into its mating baseboard con-
nectors. To avoid mechanical damage to the components populated on M100PF it is strongly recommended not to
apply mechanical force on the Ball Grid Array (BGA) components. The BGA components are marked as shaded in
the figure below:
6 Chapter 2. Overview
Table of contents
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