HP Elite t655 Assembly instructions

EL-MF877-00 Page 1

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP Elite t655 Thin Client

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for

the disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU

directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on

the plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective

treatment, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. An “X” in the list of components and parts indicates the

product contains the component or part requiring selective treatment

Item Description

Components and parts requiring selective

treatments

Quantity of

items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) with a surface greater than 10 sq

☒Main board (MB) PCB

☒Solid state drive (SSD) PCB

☐Wireless WAN module (WWAN) PCB

☐Touch module PCB

☒Power supply PCB

☒External Keyboard (KB)

☒External Mouse

☐Others: _____________

Batteries, excluding Li-Ion batteries. This includes

standard alkaline, coin or button style batteries

☒RTC/CMOS battery

☐Others: _____________

Li-Ion batteries. Includes all Li-Ion batteries if more

than one is provided with the product (such as a

detachable notebook keyboard battery, etc.)

Li-ion battery(ies) are attached to the product by:

☐screws

☐snaps

☐adhesive

☐other. Explain

Mercury-containing components. For example,

mercury in lamps, display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm. Includes background illuminated

displays with gas discharge lamps

☐Panel LCD

EL-MF877-00 Page 2

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Item Description

Components and parts requiring selective

treatments

Quantity of

items

included

in product

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

☐Power Supply capacitor(s) or condenser(s)

External electrical cables and cords

☒AC power cord

☐Audio, video or data cables

☐Other: _________

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

(not including external electrical cables and cords,

PCBs or PCAs already listed as a separate item

above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner.

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

Components containing chlorofluorocarbons (CFC),

hydrochlorofluorocarbons (HCFC) or

hydrofluorocarbons (HFC), hydrocarbons (HC)

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

PH0X50 screw

driver

Screwdriver

T15 screw

driver

Heatgun

N/A

Suction cup

N/A

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure.

EL-MF877-00 Page 3

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

1. Remove Rear Cover

2. Remove access panel

3. Remove “+”M2 screws of option kit and option board

4. Remove “+”M2 screws of Rear-brkt

5. Remove T8-SSD screw and module

6. Remove shielding can

7. Remove DIMM

8. Remove speaker conn

9. Unfasten T15-M3 screws and disassembly MB

10. Remove speaker

11. Unfasten “+” M2 screws and internal antenna

12. Unfasten “+” M3 screws and internal antenna

13. Unfasten “+” M2 screws

14. Remove VESA cover by hand

15. Remove Bend cover by hand

NOTE - For disassembly instructions of the external power supply (EPS), external keyboard (KB) external mouse and external

cables and cords, refer to the links below:

•Generic External Power Supply (EPS)

•Generic Keyboard

•Generic Mouse

•Generic cables and cords

3.2 Location of components requiring selective treatment. The photos and/or graphics below identify the location of the parts

or components requiring selective treatment within the main unit. For End-of-Life product disassembly instructions of external

accessories including external power supply (EPS), external keyboard (KB) external mouse and external cables and cords, refer

to the following URL: End-of-Life Product Disassembly Instructions (hp.com)

STEP 1. Remove Rear Cover

STEP 2. Remove access panel

STEP 3. Remove “+”M2 screws of option kit and option

board

STEP 4. Remove “+”M2 screws of Rear-brkt

Releasing latch

Pusing latch

Disassembly Access Panel

Overall

EL-MF877-00 Page 4

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

STEP 5. Remove T8-SSD screw and module

STEP 6. Remove shielding can

STEP 7. Remove DIMM

STEP 8. Remove speaker conn

STEP 9. Unfasten T15-M3 screws and disassembly MB

STEP 10. Remove speaker

STEP 11. Unfasten “+” M2 screws and internal antenna

STEP 12. Unfasten “+” M3 screws and internal antenna

Overall

Unfasten screw x4

Unfasten screw x5

Disassembly Rear-brkt

Overall

Unfasten screw

Disassembly module

Disassembly Shielding can

Unplug SPK cconn

Unfasten screw x4

Disassembly MB

Unfasten screw x2

Disassembly SPK

EL-MF877-00 Page 5

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

STEP 13. Unfasten “+” M2 screws

STEP 14. Remove VESA cover by hand

STEP 15. Remove Bend cover by hand

Overall

Detail

Overall Detail

Overall

Detail

Unfasten screw x2

Disassembly VESA-CVR

Disassembly Bend-CVR

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