HP ProDesk 400 G2.5 Installation instructions

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PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 400 G2.5 SFF Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Cooler fan 82g,system fan 72g,PSU fan 32.4g

186.4g

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

T-15

Micro shear

YN-3

Screw driver

PH2

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel. (see Figure 1-2)

2. Remove front bezel. (see Figure 3)

3. Disconnect cooler cable then remove the cooler from board. (see Figure4-5)

4. Remove the HDD (see Figure 6-8)

5. Remove the Slim ODD (see Figure 9-10)

6. Unplug all cable conn. from PCA. (see Figure 11)

7. Remove the PCA(see Figure 12-13)

8. Remove the DIMM. (see Figure 14)

9. Remove the CPU. (see Figure 15-16)

10. Remove the Battery. (see Figure 17)

11. Remove the FIO module from chassis. (see Figure 18-19)

12. Remove the SD card reader from chassis. (see Figure 20-21)

13. Remove the speaker from chassis. (see Figure 22-23)

14. Remove Sys fan from chassis. (see Figure 24-25)

15. Remove the PSU from chassis. (see Figure 26-27)

16. Remove the PSU chassis and remove the PSU board. (see Figure 28-38)

17. Remove the Electrolytic Capacitors from PSU board. (see Figure 39-40)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure1 Release Thumb screw on the access panel.

Figure2 Griping the tab at the end of access panel, pull

towards the rear and remove from unit.

Figure3 Pull 3 pcs bezel hooks and remove the front bezel

from chassis.

Figure4 Unplug the cooler cable from PCA

Figure5 Release 4 screws from cooler and remove it

(screw driver T15)

Figure6 Disconnect the SATA and power cables from

HDD

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Figure7 Release the HDD screws

(screw driver T15)

Figure8 Remove the HDD form chassis

Figure9 Push the latch and release the Slim ODD.

Figure10 Remove the Slim ODD form chassis.

Figure11 Unplug all cable conn. from PCA.

Figure12 Release 6 pcs screws from PCA

(screw driver T15)

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Figure13 Remove PCA from chassis

Figure14 Push the hooks on both sides and then pick up

the memory

Figure15 Rotate the handle and open it up

Figure16 Remove the CPU from board

Figure17 Remove the battery from the PCA

Figure18 Release the screw of the FIO cable

(screw driver T15)

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Figure 19 Push the plastic hook and rotation the FIO

module inside. Remove the FIO module from chassis

Figure20 Release the SD card reader screw

(screw driver T15)

Figure21 Remove the SD Card reader from chassis

Figure22 Release two screws of speaker

Figure23 Remove the speaker form chassis

Figure24 Release 2 pcs screws from system fan.

(screw driver PH2)

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Figure28 Remove screw for top cover

(screw driver PH2)

Figure29 Remove case cover

Figure25 Remove the system fan from chassis

Figure26 Release 4 pcs screws of PSU and remove it

(screw driver T15)

Figure27 Pull up the PSU and remove it

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Figure30 Remove FG screw

(screw driver PH2)

Figure31 Disconnect fan connector

Figure32 Disconnect the L/N wire connector

Figure33 Cut the cable tie

(Micro shear YN-3)

Figure34 Remove PCB screw

Figure35 Remove plastic cover

Figure36 Remove AC inlet

Figure37 Remove the FAN

(screw driver PH2)

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Figure38 Cut output cable

(micro shear YN-3)

Figure39 Remove capacitors use solder iron

Figure40 Remove of Electrolytic Capacitors greater than

2.5cm in diameter or height (C801)

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