HP Chromebox G2 Assembly instructions

EL-MF877-00 Page 1

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Product End-of-Life Disassembly Instructions

Product Category: Other Products

Marketing Name / Model

[List multiple models if applicable.]

HP Chromebox G2

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

M/B, Power/B

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screw Driver

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. remove bottom rubber cover foot x4, screw*4, and bottom cover sub-assy.

2. remove side cover screw*2, and side cover sub-assy.

3. remove bottom shielding screw*4, pull out DC cable, and bottom shielding sub-assy.

4. remove SSD screw*1, WLAN screw*1, pull out WLAN cable, and SSD/WLAN sub-assy.

5. remove DDR shielding can, and DDR RAM sub-assy.

6. remove MB screw*4, pull out power board cable, and MB sub-assy.

7. remove Top shielding screw*4, and Top shielding sub-assy.

8. remove power board screw*2, and power board sub-assy.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Total part disassembly

3.22 Remove bottom cover rubber, bottom cover screw and disassembly

EL-MF877-00 Page 3

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3.23 Remove side cover screw and disassembly

3.24 Remove bottom shielding screw and DC cable and disassembly

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.25 Remove SSD & WLAN all screw & WLAN cable and disassembly

3.26 Remove DDR shielding can and DDR RAM disassembly

EL-MF877-00 Page 5

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3.27 Remove MB all screw & power board cable and disassembly

3.28 Remove top shielding all screw and disassembly

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.29 Remove power board all screw and disassembly

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