Texas Instruments TPS62866 User manual

User’s Guide

TPS62866EVM-051 Evaluation Module

ABSTRACT

The TPS62866EVM-051 facilitates the evaluation of the TPS62866 6-A, step-down converter with DCS-Control™

in a tiny 1.05-mm by 1.78-mm WCSP package with 0.35-mm pitch. The EVM outputs a 0.9-V output voltage with

1% accuracy from input voltages between 2.4 V and 5.5 V. The TPS62866 is a highly efficient and tiny solution

for point-of-load (POL) converters for space-constrained applications, such as artificial intelligence chips, camera

modules, solid state drives (SSDs), and optical modules.

Table of Contents

1 Introduction.............................................................................................................................................................................2

2 Setup........................................................................................................................................................................................2

3 TPS62866EVM-051 Test Results............................................................................................................................................3

4 Board Layout...........................................................................................................................................................................3

5 Schematic and List of Materials............................................................................................................................................ 5

6 Software User Interface..........................................................................................................................................................6

7 Revision History......................................................................................................................................................................9

List of Figures

Figure 4-1. Top Assembly............................................................................................................................................................ 3

Figure 4-2. Top Layer...................................................................................................................................................................3

Figure 4-3. Signal Layer 1........................................................................................................................................................... 3

Figure 4-4. Signal Layer 2........................................................................................................................................................... 3

Figure 4-5. Signal Layer 3........................................................................................................................................................... 4

Figure 4-6. Signal Layer 4........................................................................................................................................................... 4

Figure 4-7. Bottom Layer............................................................................................................................................................. 4

Figure 4-8. TPS62866EVM-051 Angled View..............................................................................................................................4

Figure 4-9. TPS62866EVM-051 Overhead View.........................................................................................................................4

Figure 5-1. TPS62866EVM-051 Schematic.................................................................................................................................5

Figure 6-1. Quick Connection Overview...................................................................................................................................... 6

Figure 6-2. GUI Home Screen..................................................................................................................................................... 7

Figure 6-3. GUI Settings Screen..................................................................................................................................................8

Figure 6-4. GUI Register Map Screen......................................................................................................................................... 9

List of Tables

Table 1-1. Performance Specification Summary..........................................................................................................................2

Table 5-1. TPS62866EVM-051 List of Materials..........................................................................................................................5

www.ti.com Table of Contents

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TPS62866EVM-051 Evaluation Module 1

1 Introduction

The TPS62866 is a synchronous, step-down converter in a 1.05- x 1.78- x 0.5-mm wafer chip-scale package

(WCSP).

1.1 Performance Specification

Table 1-1 provides a summary of the TPS62866EVM-051 performance specifications.

Table 1-1. Performance Specification Summary

SPECIFICATION TEST CONDITIONS MIN TYP MAX UNIT

Input voltage 2.4 5 5.5 V

Output voltage setpoint 0.9 V

Output current 0 6000 mA

1.2 Modifications

The EVM can support variance of the whole IC family. Additional input and output capacitors can be added.

2 Setup

This section describes how to properly use the TPS62866EVM-051.

2.1 Input/Output Connector Descriptions

J1, Pin 1 and 2 – VIN Positive input connection from the input supply for the EVM

J1, Pin 3 and 4 – S+/S- Input voltage sense connections. Measure the input voltage at this point.

J1, Pin 5 and 6 – GND Input return connection from the input supply for the EVM

J2, Pin 1 and 2 – VOUT Output voltage connection

J2, Pin 3 and 4 – S+/S- Output voltage sense connections. Measure the output voltage at this point.

J2, Pin 5 and 6 – GND Output return connection

J3, Pin 5 – VBUS The VBUS pin of this header is used to bias the SCL and SDA nodes of I²C interface

via a resistor.

J3, Pin 6 – GND The GND pin of this header is used to connect the grounds of the IC and the I²C

interface.

J3, Pin 9 – SCL The pin of this header should be connected to the SCL of the I²C interface.

J3, Pin 10 – SDA The pin of this header should be connected to the SDA of the I²C interface.

JP1 – VID/PG VID/ PG pin jumper. Always place the jumper across VID/ PG and LOW pins before

start-up. This sets the output voltage and device address. After startup, VOUT reflects

the value set on VOUT Register 1 if the jumper is placed across VID/ PG and LOW

pins. VOUT follows the value set on VOUT Register 2 if the jumper is placed across

VID/ PG and HIGH pins.

JP2 – EN EN pin input jumper. Place the jumper across ON and EN to turn on the IC. Place the

jumper across OFF and EN to turn off the IC.

2.2 Setup

To operate the EVM, set jumpers JP1 and JP2 to the desired position per Section 2.1. Connect the input supply

to J1 and connect the load to J2.

Introduction www.ti.com

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3 TPS62866EVM-051 Test Results

The TPS62866EVM-051 was used to take all the data in the TPS62866 data sheet (SLVSEI1). See the device

data sheet for the performance of this EVM.

4 Board Layout

This section provides the TPS62866EVM-051 board layout and illustrations in Figure 4-1 through Figure 4-7.

The Gerbers are available on the EVM product page: TPS62866EVM-051

Figure 4-1. Top Assembly Figure 4-2. Top Layer

Figure 4-3. Signal Layer 1 Figure 4-4. Signal Layer 2

www.ti.com TPS62866EVM-051 Test Results

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TPS62866EVM-051 Evaluation Module 3

Figure 4-5. Signal Layer 3 Figure 4-6. Signal Layer 4

Figure 4-7. Bottom Layer

Figure 4-8. TPS62866EVM-051 Angled View Figure 4-9. TPS62866EVM-051 Overhead View

Board Layout www.ti.com

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5 Schematic and List of Materials

This section provides the TPS62866EVM-051 schematic and list of materials.

5.1 Schematic

Figure 5-1 illustrates the EVM schematic.

GND

VOUT VOUT

VIN SW

VIN

S+S+

S-S-

GND GND

68uF

TPS628660AYCGR

VOS A3

VSET/VID A2

AGND A1

GND B1

GND B2

GND B3

SW C1

SW C2

SW C3

VIN

SCL

SDA

VID/PG

SDA

SCL

GND GNDGND GNDGND

GND

USB2ANY comunication interface connector

VIN

VBUS

1 2

3 4

5 6

7 8

9 10

GND

ON VIN

VID/PG

GND

VBUS

EN EN

OFF

GND

86.6k

2.00k

SCL SDA

I2C interface communication with USB2ANY:

VBUS is not required to be connected

USB2ANY interface has an internal 3.3V VBUS supply

22µF

JP2

JP1 100k

220nH

10µF

2.4V to 5.5V 0.4V to 1.675V

Figure 5-1. TPS62866EVM-051 Schematic

5.2 List of Materials

Table 5-1 lists a list of materials for this EVM.

Table 5-1. TPS62866EVM-051 List of Materials

DESIGNATOR QTY DESCRIPTION PART NUMBER MANUFACTURER

C1, C5 2 Capacitor, ceramic, 10 µF, 6.3 V, ±20%, X7R, 0603 CL10B106MQ8NRNC Samsung Electro-Mechanics

C2, C3 2 Capacitor, ceramic, 22 µF, 6.3 V, ±20%, X7R, 0805 GRM21BZ70J226ME44L Murata

C8 1 Capacitor, tantalum, 68 µF, 20 V, ±10%, 7343 T495D686K020ATE150 Kemet

L1 1 Inductor, 220 nH, 16.8 A, 5.8 mΩ, SMD, 4040 XAL4020-221MEB Coilcraft

R1 1 Resistor, 86.6 kΩ, 1%, 0.1 W, 0603 Std Std

R2 1 Resistor, 100 kΩ, 1%, 0.1 W, 0603 Std Std

R3, R4 2 Resistor, 2.0 kΩ, 1%, 0.1 W, 0603 Std Std

U1 1 6-A Step-Down Converter with I²C Interface and Wide

Output Voltage Range, YCG0015ACAC (DSBGA-15)

TPS628660AYCGT Texas Instruments

www.ti.com Schematic and List of Materials

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TPS62866EVM-051 Evaluation Module 5

6 Software User Interface

6.1 Software Setup

A graphical user interface (GUI) is available from the TPS62866 design and development page, which allows

simple and convenient programming of the device through the TI USB2ANY (https://www.ti.com/tool/USB2ANY)

interface board. Alternatively, you can use any I2C-standardized programming tool or I2C host to configure the

device. Mind the I2C pins specification, such as timing parameters and proper pullup resistors, specified in the

TPS62864/6 2.4-V to 5.5-V Input, 4-A and 6-A Synchronous Step-Down Converter with I2C Interface in WCSP

Package Data Sheet.

6.2 Interface Hardware Setup

Connect the USB2ANY adapter to the PC using the supplied USB cable. Attach the EVM connector, J3 to

the USB2ANY adapter using the supplied 10-pin ribbon cable. The ribbon cable connector is keyed to prevent

incorrect installation.

Figure 6-1 shows a quick adapter connection overview.

Host

Computer

USB Cable

USB

Interface

Adapter

Green LED

Indicates

Power

10-Pin

Ribbon

Cable

EVM Board

USB Interface Adaptor Quick Connection Diagram

Figure 6-1. Quick Connection Overview

Software User Interface www.ti.com

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6.3 User Interface Operation

Upon start-up, the GUI automatically connects to the EVM. If not, then click on the "Connect" button in the

lower-left corner of the GUI window. Ensure the I2C Slave Address is correct. The following sections give a short

overview of the three main GUI screens.

6.3.1 Home Screen

The Home screen provides a short overview of the TPS6286x0 devices. To start evaluating the device, click the

Start button. Click the I2C Slave Address button to change the address, and the default I2C address is 0x40.

All the links related to the device are all indicated on the bottom portion of the window.

Figure 6-2. GUI Home Screen

www.ti.com Software User Interface

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TPS62866EVM-051 Evaluation Module 7

6.3.2 Settings Screen

The Settings screen provides control over the VOUT and CONTROL Registers. The Status Register is available

in this window as well. Real-time updates are possible if the Auto Read function is set to As fast as possible in

the Register Map page.

Figure 6-3. GUI Settings Screen

Software User Interface www.ti.com

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6.3.3 Register Map Screen

The Register Map screen shows bit values of all parameters. In this section, single registers can be read or

written to the device (if applicable). Refer to the register map in the TPS62864/6 2.4-V to 5.5-V Input, 4-A

and 6-A Synchronous Step-Down Converter with I2C Interface in WCSP Package Data Sheet for a detailed

description of the TPS62866 registers.

Figure 6-4. GUI Register Map Screen

7 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision * (July 2019) to Revision A (July 2021) Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added Software User Interface section.............................................................................................................. 6

www.ti.com Software User Interface

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TPS62866EVM-051 Evaluation Module 9

STANDARD TERMS FOR EVALUATION MODULES

1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance

with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not

finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For

clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions

set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,

or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production

system.

2Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License

Agreement.

2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by

neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have

been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications

or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control

techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)

business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit

User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty

period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or

replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be

warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day

warranty period.

WARNING

Evaluation Kits are intended solely for use by technically qualified,

professional electronics experts who are familiar with the dangers

and application risks associated with handling electrical mechanical

components, systems, and subsystems.

User shall operate the Evaluation Kit within TI’s recommended

guidelines and any applicable legal or environmental requirements

as well as reasonable and customary safeguards. Failure to set up

and/or operate the Evaluation Kit within TI’s recommended

guidelines may result in personal injury or death or property

damage. Proper set up entails following TI’s instructions for

electrical ratings of interface circuits such as input, output and

electrical loads.

NOTE:

EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION

KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

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