Quantum Q250 Product manual

Q200

Series™

Intelligent Disk Drives

Technical Reference Manual

For Q250, Q280

Disk Drives

Q200

SERIES

INTELLIGENT DISK DRIVES

Q250jQ280

DISK

DRIVES

Technical

Reference

Manual

Publication

No.

81-45528

REV

PREFACE

This

manual

contains

technical

reference

information

describing

the

Q250

and

Q280

rigid

disk

drives.

Information

intended

for

technicians

and

engineers

evaluating

maintaining

the

drives,

integrating

them

into

systems.

Quantum

reserves

the

right

make

changes

and/or

improvements

its

products

without

incurring

any

obligation

incorporate

such

changes

improvements

units

previously

sold

shipped.

Additional

information

the

Q250

and

Q280

given

the

following~manuals:

Publication

No.

Quantum

81-45233

Quantum

81-45416

ANSI

X3.131-1986

Title

Q250/Q280

Disk

Drives.

OEM

Manual

Q200

Series

Programmer's

Manual

Small

Computer

System

Interface

(SCSI)

Quantum

publications

may

requested

from

your

Quantum

Sales

Representative,

may

ordered

from

Quantum

the

same

manner

spare

parts.

Publication

81-45528

Rev.

KL587

UL/CSA/VDE

recognition

granted

under

File

No.

E78016

CSA

certification

granted

under

File

Nos.

LR496896-8

and

LR496896-11

VDE

certification

granted

per

File

No.

11342-3250-1002

WARRANTY

Model

Q250

and

Q280

disk

drives

are

warranted

against

defects

material

and

workmanship

for

period

one

year

from

date

shipment.

The

warranty

includes

parts

and

labor.

This

limited

~arranty

and

further

details

can

obtained

from

your

Quantum

sales

representative.

All

requests

for

service

should

directed

the

Quantum

service

center

your

area.

PATENTS

The

product

described

herein

covered

u.S.

Patent

No.

4,538,193,

and

the

subject

allowed

pending

patent

applications

from

which

u.S.

Patents

are

expected

issue

1987.

1987

Quantum

Corporation.

All

rights

reserved.

Q200

Series

and

DisCache

are

trademarks

Quantum

Corporation.

AIRLOCK

registered

trademark

Quantum

Corporation.

Printed

U.S.A.

TAB

L E o F

CON

TEN

T S

PREFACE . .

SECTION

INTRODUCTION . . . .

1-1

1.1

1.2

Features

. . . . . .

Logic

Conventions

. . . . . . . .

1-1

. . . . . . . .

1-2

SECTION

PRINCIPLES

OPERATION

2-1

2.1

Head

Disk

Assembly

(HDA)

. . . . . .

......

2-1

2.1.1

Base

casting

Assembly.

. . .

......

2-1

2.1.2

Disk

Stack

Assembly.

. . . .

.......

2-2

2.1.3

Rotary

positioner

Assembly

(Actuator)

.......

2-2

2.1.4

Headstack

Assembly.

. . . . . . . . . .

2-2

2.1.S

Automatic

Actuator

Lock

(AIRLOCK)

.........

2-2

2.1.6

Drive

Motor.

. . . . .

.........

2-2

2.1.7

Air

Filtration.

...

. .

.........

2-3

2.2

Drive

Electronics.

..............

2-4

2.2.

Disk

Format

. . . . . . . . .

.......

2-4

2.2.2

Simplified

Explanation--Block

Diagram

.......

2-4

2.2.3

SCSI

Bus

Physical

Interface.

......

2-8

2.2.4

SCSI

Bus

Signal

Descriptions

............

2-10

2.2.S

SCSI

Bus

Timing.

......

. .

2-11

2.2.6

Power

Requirements.

. . .

......

2-14

2.2.7

Shorting

Plug

Options.

...........

2-16

2.2.8

Flex

Circuit

....................

2-19

2.3

PCB

Functional

Elements.

...........

2-19

2.3.1

Power-On-Reset

(POR)

and

Warm

Reset

........

2-19

2.3.2

Motor

Control

Circuit

...............

2-20

2.3.3

Electronic

Return

Spring.

. . .

.....

2-21

2.3.4

S080

SCSI

Bus

Controller.

. . .

......

2-21

2.3.S

Servo

Control,

AMC

and

Servo

AGC.

. . .

2-23

2.3.6

Actuator

Positioning

circuit.

.....

2-27

2.3.7

Read/Write

Circuit.

. . . . . . . . . . . .

2-27

2.3.8

FYLO

Timing

Controller

IC,

and

xtal

Oscillators

2-29

2.3.9

DICEY

Data

Controller

IC.

........

2-30

2.3.10

Microprocessor

and

EPROM

.........

2-32

2.4

Power-Up

Sequence/Recalibration.

..........

2-32

2.S

Read

Command

Sequence.

. . . . . . . .

......

2-33

2.6

write

Command

Sequence.

...........

2-33

SECTION

ENGINEERING

DRAWINGS

. .

3-1

iii

SECTION

APPLICATIONS . . . . . . . .

4-1

4.1

Special

Considerations.

. . . . .

....

4-1

4.1.1

-REQ/-ACK

Handshake.

......

4-1

4.1.2

Hints

for

Software

Driver

writers

...

4-3

4.2

Errors

and

Media

Defects.

. . . . . . . .

...

4-5

4 • 2 • 1

Errors.

. . . . . . . . . . . . . .

....

4 - 5

4.2.2

Allocating

Replacement

Sectors.

.......

4-6

4.2.3

Creating

the

Defect

Lists.

. . . . . .

4-8

4.2.4

Updating

the

Drive

Using

the

Defect

Lists

.....

4-9

4.3

Grounding,

Electrostatic

Discharges,

and

EMI

. .

...

4-10

SECTION

MAINTENANCE.

. . . •

5-1

5.1

Maintenance

Precautions.

. . . . . . . . .

...

5-1

5.2

Level

Maintenance.

. . . . . . . . .

.....

5-1

5.3

Level

Maintenance.

. . .

............

5-2

5.4

Connector

Maintenance.

. . . .

.........

5-2

5.5

PCB

Waveforms

and

Techniques.

. . . . . . . .

.•

5-2

5.5.1

Special

Test

Equipment

...............

5-2

5.5.2

Techniques

and

Waveform

Descriptions

........

5-3

5.5.3

Test

Connector

Signals.

. . . . . .

5-4

SECTION

PARTS

LISTS

...

6.1

Spare

Parts

List

....

6.2

Reference

Parts

List(s)

. .

6-1

6-2

2-1

2-2

2-3

2-4

2-5

2-6

2-7

2-8

2-9

2-10

2-11

2-12

2-13

2-14

2-15

2-16

2-17

3-1

3-2

3-3

3-4

3-5

3-6

3-7

3-8

3-9

3-10

3-11

3-12

4-1

4-2

4-3

4-4

4-5

5-1

5-2

5-3

LIS

T o F

FIG

RES

Exploded

View

. . . . . .

......

. .

2-1

Inside

View

Drive,

Showing

Air

Filtration.

. . . . . .

2-3

Disk

Format:

Wedges,

Sectors,

and

Tracks.

. . . . . . . .

2-5

Electronics

Block

Diagram

............

2-6

Connector.

. . . . . .

.....

2-9

SCSI

Bus.

Typical

Circuit

Signal

Line

.......

2-10

SCSI

Bus

Timing

Diagram

. . . . • . . . . . . . . . . . .

2-13

Drive

Startup

Current

Profile

. . . .

......

2-16

General

PCB

Layout;

Plug,

Terminator

and

.........

2-17

Connector

Locations

· . . . . . . . . 2

-2

5080

Conceptual

Block

Diagram.

. . . .

5080

Interface

Diagram

. . . . . . .

Servo

AMC

and

ADC

Circuit

Waveforms.

Read

Circuit

Waveforms

. . . . . . . . .

· . . . . . . .

2-22

· .

2-25

· . . .

2-28

DICEY

Block

Diagram.

. . . . .

...

· . . . . .

2-31

Power-Up

Sequence.

.. ..

. . . . . · . . . . .

2-34

Read

Command

Sequence.

. .

...

. · .

2-35

write

Command

Sequence

. . . . .

. · . . . . . .

2-36

Printed

Circuit

Board

Parts

Locations

(PCB-7)

· ·

3-2

Schematic,

PCB-7,

Sheet

1 · · · · · · · ·

3-3

Schematic,

PCB-7,

Sheet

2 · · · · · · · · · · · ·

3-4

Schematic,

PCB-7,

Sheet

3 · · · · · · · · · · · · · · · ·

3-5

Printed

Circuit

Board

Parts

Locations

(PCB-8)

· ·

3-6

Schematic,

PCB-8,

Sheet

1 · · · · · · · · ·

3-7

Schematic,

PCB-8,

Sheet

2 · · · · · · · · · · · · · · · ·

3-8

Schematic,

PCB-8,

Sheet

3 · · · · · · · · · · · · · ·

3-9

Printed

Circuit

Board

Parts

Locations

(PCB-9)

· · · · · ·

3-10

Schematic,

PCB-9,

Sheet

1 · · · · · · · · ·

3-11

Schematic,

PCB-9,

Sheet

2 · · · · · · · · ·

3-12

Schematic,

PCB-9,

Sheet

3 · · · · · · · · · ·

3-13

-REQ/-ACK

Handshake.

Q250/Q280

Target

Sends

Data

. .

4-2

Buffer

Full

and

Empty

Ratios.

. . . . . . . . . . . . . .

4-3

In-Line

Sparing

Defective

Sectors.

. .

...

4-7

In-Line

Sparing

Overflow

Defective

Sectors

. . . . . .

4-7

Sparing

Field-Found

Defective

Sectors.

. . . . . . . .

4-8

Test

Waveforms(1)

Test

Waveforms(2)

Test

Waveforms(3)

· . . . .

5-6

· .

5-7

· . . . . .

5-8

2-1

2-2

2-3

4-1

5-1

LIS

T o F

TAB

L E S

Assignments.

.....

Power

Requirements

. . . .

...

Microprocessors

and

Buffer

RAM.

. . . . .

Available

Spare

and

Defective

Sectors

Test

Connector

Signals

. .

2-9

. . . • . •

2-15

· • •

2-32

· . .

4-8

· . •

5-5

1.1

Features

Q250

and

Q280

drives

feature

on-board,

ANSI-standard,

Small

Computer

System

Interface

(SCSI)

controllers,

and,

with

the

exception

plug-in

EPROM

IC,

both

models

use

the

same

printed

circuit

board

(PCB).

These

drives

require

operational

adjustments.

All

electronics

except

the

spindle

motor,

headstack,

flex

circuit,

heads,

and

actuator

rotor

are

contained

the

PCB. A

single

mounted

the

flex

circuit

inside

the

sealed

assembly.

The

following

features

the

Q250/Q280

drives

enable

high

data

throughput:

Seeks

are

initiated

immediately--other

commands

are

processed

simultaneously.

KByte

FIFO

data

buffer

balances

the

transfer

data

and

from

the

SCSI

bus

well

and

from

the

drive.

Optional

DisCache

increases

data

buffer

size

KBytes.

(See

the

Q200

Series

Programmers

Manual

for

details

concerning

this

option.)

Cylinder

and

head

skewing

scheme

minimizes

latency

when

accessing

data

sequentially

across

cylinder

boundaries.

Defect

management

scheme

minimizes

seeks

spare

sectors.

Multiple

block

transfer

64K-1

blocks,

each

with

Kbytes.

o RLL

1,7

(run-length-Iimited)

encoding

increases

data

density

the

disks.

1-1

SCSI

commands

relieve

the

host

system

many

tasks,

such

defect

management,

error

correction,

and

physical

sector

addressing.

Programmable

options

allow

users

flexible

ways

handle

defects

initially

and

throughout

the

product's

life.

For

example,

(1)

defective

sectors

can

automatically

reassigned

without

the

need

reformat,

(2)

data

can

corrected

with

Reed-Solomon

error

correcting

code

(ECC) ,

(3)

all

error

detection

and

correction

can

handled

the

host

computer.

The

ECC

can

correct

one

burst

error

bits,

detect

three

burst

errors

bits

each.

Q200

Series

drives

employ

hard-sectored

format

with

servo

data

factory-written

wedges

between

all

sectors

all

surfaces.

Thus,

thermal

and

mechanical

effects

which

tend

misalign

heads

the

headstack

assembly

are

minimized,

comparison

with

other

drives

which

use

dedicated

servo

surface.

addition,

conservative

linear

bit

and

track

densities

ensure

high

data

integrity.

Logical

block

sizes

512,

1024,

and

2048

bytes

are

supported.

1.2

Logic

Conventions

Signals

the

SCSI

bus

are

all

true

asserted

when

they

are

low

level,

and

false

non-asserted

when

they

are

high

level.

this

document,

the

names

such

signals

are

always

preceded

minus,

"-ACK,"

and

the

timing

diagrams

are

drawn

show

the

signals

asserted

when

they

are

low,

they

might

observed

with

oscilloscope.

other

signals,

the

PCB,

are

indicated

follows:

Signal

Type

Asserted

when

low

Asserted

when

high

Differential

Analog

Examples

-paR

+POR

Asserted

when

+READ

SIG

positive

than

-READ

SIG

WRITE

CURRENT,

5 V

Note

that

the

ANSI

Standard

for

SCSI,

ANSI

X3.131-1986

uses,

for

example,

"-ACK"

when

listing

connector

connections,

but

describes

the

signals

"ACK"

the

text,

and

shows

positive

true

signals

"+ACK"

timing

diagrams.

1-2

SECTION

PRINCIPLES

OPERATION

2.1

Head

Disk

Assembly

(HDA)

2.1.1

Base

Casting

Assembly

The

single

piece,

aluminum

alloy

base

casting

provides

mounting

surface

for

the

rest

the

drive

mechanism,

PCB,

and

shock

mount

brackets.

See

Figure

2-1

for

relative

locations.

'\~'ST

~:K

ASSEMBLY

HEADS

ACTUATOR

UPPER

AND

LOWER

MAGNETS

FACEPLATE

DISK

CLAMP

MAGNETIC

DISK

! I!

/t:tD

MOUNTING

HOLES

Figure

2-1:

Exploded

View

2-1

RECIRCULATION

FIL

TER

BASE

CASTING

PRINTED CIRCUIT

BOARD

MOUNTING

BRACKET

/~/

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