Panasonic 2SA2163 User manual

Transistors

Publication date: May 2005 SJC00336AED

2SA2163

Silicon PNP epitaxial planar type

For high frequency ampliﬁ cation



Features

 Features



High transition frequency f

 High transition frequency f

High transition frequency fT

High transition frequency f



Optimum for high-density mounting and downsizing of the equipment for

 Optimum for high-density mounting and downsizing of the equipment for 

Ultraminiature leadless package

0.6 mm

1.0 mm (height 0.39 mm)



Absolute Maximum Ratings

 Absolute Maximum Ratings 

= 25

a = 25

Parameter

Symbol

Rating

Unit

Collector-base voltage (Emitter open)

CBO

−

Collector-emitter voltage (Base open)

CEO

−

Emitter-base voltage (Collector open)

EBO

−

Collector current

−

Collector power dissipation

100

Junction temperature

125

Storage temperature

stg

Tstg

−

55 to

125



Electrical Characteristics

 Electrical Characteristics 

= 25

a = 25

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Base-emitter voltage

VBE

CE =

−

10 V, I

−

1 mA

−

0.7

− 0.7−

Collector-base cutoff current (Emitter open)

CBO

−

10 V, I

= 0

E = 0

−

0.1

− 0.1−

Collector-emitter cutoff current (Base open)

CEO

CE =

−

20 V, I

= 0

−

100

Emitter-base cutoff current (Collector open)

EBO

−

5 V, I

= 0

−

Forward current transfer ratio

hFE

CE =

−

10 V, I

−1

220



Collector-emitter saturation voltage

CE(sat)

−

10 mA, I

−

1 mA

−

0.1

− 0.1−

Transition frequency

−

10 V, I

= 1 mA, f = 200 MHz

E = 1 mA, f = 200 MHz

150

300

MHz

Noise ﬁ gure

−

10 V, I

= 1 mA, f = 5 MHz

E = 1 mA, f = 5 MHz

2.8

4.0

Reverse transfer impedance

−

10 V, I

= 1 mA, f = 2 MHz

E = 1 mA, f = 2 MHz

Ω

Reverse transfer capacitance (Common emitter)

−

10 V, I

= 1 mA, f = 10.7 MHz

E = 1 mA, f = 10.7 MHz

1.2

2.0

Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.

Marking Symbol: 6J

Unit: mm

1: Base

2: Emitter

3: Collector ML3-N2 Package

0.60±0.05

1.00±0.05

0.39+0.01

−0.03

0.25±0.05 0.25±0.05

0.50±0.05

0.65±0.01

0.15±0.05

0.35±0.01

0.05±0.03

This product complies with the RoHS Directive (EU 2002/95/EC).

2SA2163

SJC00336AED



 T

a I



 V



 V

CE(sat)



 I

hFE



 I

C C



 V

0 40 12080

120

2SA2163_PC-Ta

Collector power dissipation PC (mW)

Ambient temperature Ta (°C)

0−0.4 −0.8 −1.2

−10

−20

−30

2SA2163_IC-VCE

Collector current IC (mA)

Collector-base voltage VCB (V)

VCE = −10 V

Ta = 85°C

25°C−25°C

0−4−8−12

−4

−8

−12

−16

−20

2SA2163_IC-VCE

Collector current IC (mA)

Collector-emitter voltage VCE (V)

IB = 200 µA

180 µA

160 µA

140 µA

120 µA

100 µA

Ta = 25°C

− 0.1 −1−10 −100

− 0.01

− 0.1

−1

Collector current IC (mA)

Collector-emitter saturation voltage VCE(sat) (V)

2SA2163_VCE(sat)-IC

IC /IB = 10

Ta = 85°C

25°C

−25°C

− 0.1 −1−10 −100

120

160

Collector current IC (mA)

Forward current transfer ratio hFE

2SA2163_hFE-IC

VCE = −5 V

Ta = 85°C

25°C

−25°C

0 10 20 30

0.1

Collector-base voltage VCB (V)

2SA2163_Cob-VCB

Collector output capacitance

(Common base, input open circuited) Cob (pF)

f = 1 MHz

Ta = 25°C

This product complies with the RoHS Directive (EU 2002/95/EC).

Request for your special attention and precautions in using the technical information and

semiconductors described in this book

(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and

regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples

of the products, and no license is granted under any intellectual property right or other right owned by our company or any other

company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other

company which may arise as a result of the use of technical information described in this book.

(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office

equipment, communications equipment, measuring instruments and household appliances).

Consult our sales staff in advance for information on the following applications:

–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-

ucts may directly jeopardize life or harm the human body.

–Any applications other than the standard applications intended.

(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-

provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

Standards in advance to make sure that the latest specifications satisfy your requirements.

(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita

Electric Industrial Co., Ltd.

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