HP FF 12904E Installation instructions

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Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP FF 12904E Switch Chassis(JH262A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as

defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sqcm

Batteries All types including standard alkaline and lithium

coin or button style batteries 0

Mercury-containing components For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm Includes background illuminated displays with gas

discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardantsweighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers 0

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Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Screw driver 2#

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Remove all of the labels 2.

2. Unscrew the screws on angle 3, and then remove angle 3.

3. Unscrew the screws on the blank panel 4&5&6, and then remove the blank panel 4&5&6.

4. Remove the power blank panel 7.

5. Unscrew the screws on the wire bracket 8, and then remove the wire bracket 8.

6. Remove part 8-2 form part 8-1.

7. Remove part 8-3 form part 8-2.

8. Remove part 9 form subrack 10.

9. Unscrew the screws on chassis 1 and part 12, and then remove subrack 10.

10. Unscrew the screws on part 11, and then remove part 11.

11. Unscrew the screws on the PCB 12, and then remove the PCB 12.

12. Remove insulating plate 11-2 form part 11-1.

13. Unscrew the screws on the PCB 12-1, and then remove guide pin 12-2.

14. Remove part 13 from chassis 1.

15. Unscrew the screws on chassis 1, and then remove rib 14.

16. Remove insulating plate 14-2 from rib 14-1.

17. Remove insulating plate 15 from chassis 1.

18. Unscrew the screws on PCB 13-1, and then remove PCB 13-1 from part 13-2.

19. Unscrew the screws on PCB 13-1, and then remove the guide 13-3 from PCB 13-1.

20. Remove shielding fingers 4-2&5-2&7-2 and films 4-3&5-3 from the blank panel 4&5&7.

21. Unscrew the screws on part 6-2, and then remove part 6-2.

22. Unscrew the screws on blank panel 6-1, and then remove part 6-3&6-4.

23. Unscrew the screws on part 6-4-1, and then remove part 6-4-1&6-4-2&6-4-3.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

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Figure 1Treatments to the product（front view）

Figure 2 Treatments to the product (rear view)

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Figure 3 Treatments to the product (rear view)

Figure 4 Treatments to the PCB

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Figure 5 Treatments to the product（front view）

Figure 6Treatments to part 13

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Figure 7 Treatments to blank panel

Figure 8 Treatments to blank panel

Figure 9Treatments to prat 6-4

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3.3 Material of the facility built

Facility Components Material Weight(g) Weight percentage Selective treatment for materials

and components Details

1 Fe 6376.0 24.34% Fe recycling

2 PC 19.9 0.07% Pla recycling

3 Fe 340.4 1.29% Fe recycling

4 4-1 Fe 237.2*4 3.62% Fe recycling

4-2 Be-Cu 3.0*4 0.04% Cu recycling

4-3 PC 5.7*4 0.08% Pla recycling

5 5-1 Fe 300.0*2 2.29% Fe recycling

5-2 Be-Cu 1.0*2 0.01% Cu recycling

5-3 PC 2.1*2 0.02% Pla recycling

6 6-1 Fe 642.8*6 14.72% Fe recycling

6-2 PC 14.2*6 0.33% Pla recycling

6-3 Zn,Fe 24.0*6 0.55% Zn recycling

Fe recycling

6-4 Zn,Fe 281.5*6 6.45% Zn recycling

Fe recycling

7 7-1 Fe 86.2*4 1.32% Fe recycling

7-2 Be-Cu 0.4*4 0.01% Cu recycling

8 8-1 Zn 23.9*8 0.73% Zn recycling

8-2 Zn 70.1*4 1.07% Zn recycling

8-3 Fe 0.5*8 0.02% Fe recycling

9 PC, Cu 88.6 0.34% Pla recycling

Cu recycling

10 Fe 9134.0 34.86% Fe recycling

11 11-1 Al 28.6 0.11% Al recycling

11-2 PC 0.1 0.01% Pla recycling

12 12-1 Complex PCB 1220.6 4.65% The surface of PCB is greater

than 10 square centimeters;

12-2 Fe 9.0 0.03% Fe recycling

13 13-1 Complex PCB 283.0 1.07% The surface of PCB is greater

than 10 square centimeters;

13-2 Fe 321.3 1.23% Fe recycling

13-3 Zn 32.3 0.12% Zn recycling

14 14-1 Al 78.8*2 0.60% Al recycling

14-2 PC 1.2 0.01% Pla recycling

15 PC 0.6 0.01% Pla recycling

4.0 Revised record

Date Version Author Modify content

2015.05.20 V0 Zhao Jiawen Initial version

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