Texas Instruments Bq20z70EVM-001 User manual

User's GuideSLUU242A – May 2006 – Revised June 2006

bq20z70EVM-001 SBS 1.1 Impedance Track™TechnologyEnabled Battery Management Solution Evaluation Module

This EVM is a complete evaluation system for the bq20z70/bq29330/bq29412 batterymanagement system. The EVM includes one bq20z70/bq29330/bq29412 circuitmodule, a current sense resistor, two thermistors, an EV2300 PC interface board forgas gauge interface, a PC USB cable, and Windows™-based PC software. The circuitmodule includes one bq20z70 IC, one bq29330 IC, one bq29412 IC, and all otheronboard components necessary to monitor and predict capacity, perform cell balancing,monitor critical parameters, protect the cells from overcharge, over discharge, shortcircuit, and overcurrent in 2-, 3- or 4-series cell Li-ion or Li-polymer battery packs. Thecircuit module connects directly across the cells in a battery. With the EV2300 interfaceboard and software, the user can read the bq20z70 data registers, program the chipsetfor different pack configurations, log cycling data for further evaluation, and evaluatethe overall functionality of the bq20z70/bq29330/bq29412 solution under differentcharge and discharge conditions.

Contents1 Features ............................................................................................. 32 bq20z70/bq29330-Based Circuit Module ........................................................ 33 bq20z70/bq29330 Circuit Module Schematic ................................................... 44 Circuit Module Physical Layouts and Bill of Materials ......................................... 45 EVM Hardware and Software Setup ............................................................ 106 Troubleshooting Unexpected Dialog Boxes ................................................... 107 Hardware Connection ............................................................................ 108 Operation ........................................................................................... 129 Calibration Screen ................................................................................ 1510 Pro (Advanced) Screen .......................................................................... 1711 Related Documentation from Texas Instruments ............................................. 18

List of Figures

1 bq20z70EVM-001 Layout (Silk Screen) ......................................................... 52 Top Assembly ....................................................................................... 53 Top Layer ............................................................................................ 54 Bottom Layer ........................................................................................ 65 Bottom Assembly ................................................................................... 66 Schematic ........................................................................................... 97 bq20z70/bq29330 Circuit Module Connection to Cells and System Load/Charger ...... 118 SBS Data Screen ................................................................................. 139 Data Flash Screen, 1st Level Safety Class .................................................... 1410 Calibration Screen ................................................................................ 1611 Pro (Advanced) Screen .......................................................................... 18

List of Tables

1 Ordering Information ............................................................................... 32 Bill of Materials ...................................................................................... 7

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3 Performance Specification Summary ........................................................... 104 Circuit Module to EV2300 Connections ........................................................ 11

Impedance Track is a trademark of Texas Instruments.Windows is a trademark of Microsoft Corporation.

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1 Features

1.1 Kit Contents

1.2 Ordering Information

2 bq20z70/bq29330-Based Circuit Module

2.1 Circuit Module Connections

Features

•Complete evaluation system for the bq20z70 SBS 1.1-compliant advanced gas gauge with ImpedanceTrack™ Technology, bq29330 analog front end (AFE) and protection IC, and bq29412 independentovervoltage protection IC•Populated circuit module for quick setup•PC software and interface board for easy evaluation•Software that allows data logging for system analysis

•bq20z70/bq29330/bq29412 circuit module•EV2300 PC interface board•Software CD with the evaluation software•Connection cable to interface board•Set of support documentation•EV2300 USB interface board

Table 1. Ordering Information

EVM PART NUMBER CHEMISTRY CONFIGURATION CAPACITY

bq20z70EVM-001 Li-ion 2, 3, or 4 cell Any

The bq20z70/bq29330/bq29412-based circuit module is a complete and compact example solution of abq20z70 and bq29330 circuit for battery management and protection of Li-ion or Li-polymer packs. Thecircuit module incorporates a bq20z70 battery monitor IC, bq29330 AFE and protection IC, bq29412independent overvoltage protection IC, and all other components necessary to accurately predict thecapacity of 2-, 3-, or 4-series cells.

Contacts on the circuit module provide the following connections:•Direct connection to the cells: 1N (BAT–), 1P, 2P, 3P, 4P (BAT+)•To the serial communications port (SMBC, SMBD, VSS)•The system load and charger connect across PACK+ and PACK–•To the system present pin (SYS PRES)

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2.2 Pin Descriptions

3 bq20z70/bq29330 Circuit Module Schematic

3.1 Schematic

3.2 Choosing Particular Precharge Mode

3.3 Testing Fuse-Blowing Circuit

4 Circuit Module Physical Layouts and Bill of Materials

bq20z70/bq29330 Circuit Module Schematic

PIN NAME DESCRIPTION1N –ve connection of first (bottom) cell1P +ve connection of first (bottom) cell2P +ve connection of second cell3P +ve connection of third cell4P +ve connection of fourth (top) cellSMBC Serial communication port clockSMBD Serial communication data portVSS Pack negative terminalPACK– Pack negative terminalSYS PRES System present pin (if low, system is present)PACK+ Pack positive terminal

This section contains information for modifying and choosing a precharge mode forbq20z70/bq29330/bq29412 implementation.

The schematic follows the bill of materials in this user's guide.

The chipset supports both a charger that has a precharge mode and one that does not. The EVM bydefault supports a charger that does not have a precharge mode. This is configured by grounding thePMS pin with a resistor. R12 and Q2 are used as the precharge current path in order to sustain sufficientPack+ voltage when the battery voltage is too low to power up the bq29330 IC.

If the charger has a precharge function, R12 and FET Q2 are not used. The PMS pin must be pulled highto disable ZVCHG output. The charge FET Q1 is used as the precharge FET, and the charger mustcontrol the precharge current and voltage.

Note: The configuration at PMS pin is a hardware level control. Once the bq20z70 is up and running, thefirmware may change the precharge settings. Please refer to bq20z70 datasheet for further information.

To prevent the loss of board functionality during the fuse-blowing test, the actual chemical fuse is notprovided in the circuit. FET Q4 drives TP3 low if a fuse-blow condition occurs; so monitoring TP3 can beused to test this condition.

This section contains the board layout, bill of materials, and assembly drawings for the bq20z70/ bq29330/bq29412 circuit module.

Note: For the battery pack designer: D3 is not recommended, and should be shorted out if theDSG FET does not have built-in zener diode protection.

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4.1 Board Layout

Circuit Module Physical Layouts and Bill of Materials

This section shows the dimensions, PCB layers, and assembly drawing for the bq20z70/bq29330 module.

Figure 1. bq20z70EVM-001 Layout (Silk Screen)

Figure 2. Top Assembly

Figure 3. Top Layer

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Circuit Module Physical Layouts and Bill of Materials

Figure 4. Bottom Layer

Figure 5. Bottom Assembly

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4.2 Bill of Materials

Circuit Module Physical Layouts and Bill of Materials

Table 2. Bill of MaterialsCount Ref Des Value Description Size Part No. MFR

20 C1–C11, C14,C16–C20, 0.1 µF Capacitor, ceramic, 0.1 µF, 50 V, X7R, 20% 0603 STD AnyC22–C24

1 C12 0.22 µF Capacitor, ceramic, 0.22 µF, 25 V, X7R, 20% 0603 STD Any

3 C13, C15, C27 1.0 µF Capacitor, ceramic, 1.0 µF, 25 V, X7R, 20% 0805 STD Any

2 C21, C26 0.47 µF Capacitor, ceramic, 0.47 µF, 16 V, X7R, 20% 0603 STD Any

1 C25 2.2 µF Capacitor, ceramic, 2.2 µF, 10 V, X7R, 20% 0805 STD Any

4 D1, D3, D4, D6 BAS16 Diode, Switching, 150-mA, 75-V, 350 mW SOT23 BAS16 Vishay-Liteon

2 D2, D5 AZ23C5V6 Diode, dual, zener, 5.6V, 300mW SOT23 AZ23C5V6 Vishay-Telefunken

1 J1 22-05-3041 Header, friction lock assembly, 4-pin right angle 0.400 x 0.500 22-05-3041 Molex

2 Q1, Q3 FDS6690A MOSFET, N-ch, Logic Level, Power Trench, 30 SO8 FDS6690A FairchildV, 11 A, 12.5 m Ω

1 Q2 Si4435DY MOSFET, P-ch, 30 V, 8 A, 20 m ΩSO8 Si4435DY Siliconix

1 Q4 NDS331N MOSFET, N-ch, 20 V, 1.3 A, 0.16 ΩSOT23 NDS331N Fairchild

1 Q5 BSS138 MOSFET, N-ch, 50 V, 0.22 A, 6 ΩSOT23 BSS138 Fairchild

12 R1–R5, 100 Resistor, chip, 100 Ω, 1/16 W, 5% 0603 STD STDR21–R24, R31,R32, R36

2 R11, R19 3M Resistor, chip, 3 M Ω, 1/16 W, 5% 0603 STD STD

1 R12 301 Resistor, chip, 301 Ω, 1 W, 1% 2512 WSL-2512-301 Vishay

3 R13, R15, R18 5.1K Resistor, chip, 5.1 k Ω, 1/16 W, 5% 0603 STD STD

3 R14, R25, R30 1M Resistor, chip, 1 M Ω, 1/16 W, 5% 0603 STD STD

1 R16 100K Resistor, chip, 100 k Ω, 1/16 W, 5% 0603 STD STD

1 R17 0.010 Resistor, chip, 0.010 Ω, 1 W, 1% 2512 WSL-2512-010 Vishay75ppm

1 R20 10K Resistor, chip, 10 k Ω, 1/16 W, 5% 0603 STD STD

2 R26, R34 8.45K Resistor, chip, 8.45 k Ω, 1/16 W, 1% 0603 STD STD

2 R27, R33 61.9K Resistor, chip, 61.9 k Ω, 1/16 W, 1% 0603 STD STD

3 R28, R29, R35 220K Resistor, chip, 220 k Ω, 1/16 W, 5% 0603 STD STD

6 R6–R10, R37 1K Resistor, Chip 1 k Ω, 1/16W, 5% 0603 STD STD

2 RT1, RT2 10K Thermistor, 10 k Ω0.095 x 0.150 NTC103AT Sematec

2 TB1, TB3 ED1515 Terminal block, 3 pin, 6 A, 3,5 mm 0.41 x 0.25 ED1515 OST

1 TB2 ED1514 Terminal block, 2 pin, 6 A, 3,5 mm 0.27 x 0.25 ED1514 OST

1 TP1 GND Test point, White, Thru Hole Color Keyed 0.100 ×0.100 in 5002 Keystone

1 TP2 VCC Test point, White, Thru Hole Color Keyed 0.100 ×0.100 in 5002 Keystone

1 TP3 ~FUSE Test point, White, Thru Hole Color Keyed 0.100 ×0.100 in 5002 Keystone

1 U1 IC, voltage protection for 2, 3, or 4 cell Li-Ion, MSOP-08 BA29412DT3R TI2nd protection, 4.45 OVP ±25 mV (DCT3)

1 U2 IC, 2, 3, or 4 cell series protection control AFE TSSOP-30 bq29330DBT TI

1 U3 IC, SBS 1.1-Compliant GG Enabled with TSSOP-20 bq20z70PW TIImpedance Track™ technology, use with thebq29330

Connector

2 J5 mate Connector, Female, 0.100 centers Molex 22-01-3407

8 N/A Terminals, crimp, tin Molex 08-50-0114

N/A Wire, insulated 24 AWG. red, 18 inches ( ±3 inches) (USB_5V) Alpha 1854-3

N/A Wire, insulated 24 AWG. white, 18 inches ( ±3 inches) (SCL) Alpha 1854-1

N/A Wire, insulated 24 AWG. black, 18 inches ( ±3 inches) (GND) Alpha 1854-2

N/A Wire, insulated 24 AWG. brown, 18 inches ( ±3 inches) (SDA) Alpha 1854-7

1 N/A Heatsink, 1 inch Any Any

Notes:

1. These assemblies are ESD sensitive; observe ESD precautions.

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Circuit Module Physical Layouts and Bill of Materials

Table 2. Bill of Materials (continued)Count Ref Des Value Description Size Part No. MFR

2. This assembly must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.

3. This assembly must comply with workmanship standards IPC-A-610 Class 2.

4. Reference designators marked with an asterisk (**) cannot be substituted. All other components can be substituted with equivalent MFG'scomponents.

5. Make one SMBus connector wire assembly for each assembly produced, from J5 mate, 4-24 AWG wires, and crimp terminals. Wire colorsfor pin numbers are listed below. The wire assembly shall have a J5 mate on each end.

•Red – Pin 4 (Signal USB_5V)•Brown – Pin 3 (Signal Data)•White – Pin 2 (Signal Clock)•Black – Pin 1 (GND)6. RT1/RT2 should be assembled horizontally laying flat against the board edge with the sensing tip out.

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Note: For the battery pack designer:D3 is not recommended,

and should be shorted out if the DSG FET does not

have built-in zener diode protection.

4.3 bq20z70/bq29330/bq29412 Circuit Module Performance Specification Summary

Circuit Module Physical Layouts and Bill of Materials

Figure 6. Schematic

This section summarizes the performance specifications of the bq20z70/ bq29330/bq29412 circuit module.

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5 EVM Hardware and Software Setup

5.1 System Requirements

5.2 Software Installation

6 Troubleshooting Unexpected Dialog Boxes

7 Hardware Connection

7.1 Connecting the bq20z70/bq29330/bq29412 Circuit Module to a Battery Pack

EVM Hardware and Software Setup

Table 3. Performance Specification Summary

Specification Min Typ Max Units

Input voltage Pack+ to Pack- 6 15 25 VCharge and discharge current 0 2 7 A

This section describes how to install the bq20z70EVM-001 PC software, and how to connect the differentcomponents of the EVM.

The bq20z70EVSW requires Windows 2000 or Windows XP. Drivers for Windows 98SE are provided, butMicrosoft no longer supports Windows 98; and there may be issues in Windows 98 with USB driversupport. The EV2300 USB drivers have been tested for Windows 98SE, but no assurance is made forproblem-free operation with specific system configurations.

Find the latest software version in the bq20z70 tool folder on power.ti.com . Use the following steps toinstall the bq20z70EVSW software:1. Copy the files from the CD into the temporary directory you selected, in the folder "bq20z70 EV SWInstall", double-click on bqEVSWSetup00.09.32.exe and follow the installer instructions to complete thebq20z70 EVSW installation.2. If the EV2300 was not previously installed, after bq20z70 EVSW installation, a TI USB DRIVERINSTALLER will pop up. Click "Yes" for the agreement message and follow its instructions.3. Plug the EV2300 into a USB port.4. The Win98 Driver can be found in the archive Win98EV2300Drivers-DocUpdateDec1703.zip under the"EV2300 Drivers" folder.

If files were downloaded from the Web:1. Open the archive containing the installation package, and copy its contents in a temporary directory.2. Follow the preceding steps 1 - 4.

Ensure that the files were extracted from the zip file using the Preserve Folder names option.

Ensure that all the files were extracted from the zip file.

The user that is downloading the files must be logged in as the administrator.

The driver is not signed, so the administrator must allow installation of unsigned drivers in the operatingsystem policy.

The bq20z70EVM-001 comprises three hardware components: the bq20z70/bq29330/bq29412 circuitmodule, the EV2300 PC interface board, and the PC.

Figure 7 shows how to connect the bq20z70/bq29330/bq29412 circuit module to the cells and systemload/charger.

The cells should be connected in the following order:1. 4-Cell Pack: 1N (BAT-), 1P, and 2P (see Section 2.1 for definitions).

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