Texas Instruments BOOSTXL-SENSORS BoosterPack User manual

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

User's Guide

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in

Module

The Sensors BoosterPack™ kit (BOOSTXL-SENSORS) is an easy-to-use plug-in module for adding digital

sensors to your LaunchPad™ development kit design. SimpleLink™ microcontroller (MCU) LaunchPad

development kit developers can use this BoosterPack plug-in module to start developing sensor

applications using the onboard gyroscope, accelerometer, magnetometer, pressure, ambient temperature,

humidity, ambient light, and infrared temperature sensors.

Figure 1. BOOSTXL-SENSORS BoosterPack™ Plug-in Module

Contents

1 Getting Started............................................................................................................... 3

2 Hardware...................................................................................................................... 4

3 Software Examples.......................................................................................................... 8

4 Additional Resources ...................................................................................................... 19

5 Schematics.................................................................................................................. 25

List of Figures

1 BOOSTXL-SENSORS BoosterPack™ Plug-in Module................................................................. 1

2 BOOSTXL-SENSORS Overview .......................................................................................... 4

3 BoosterPack Plug-in Module Pinout....................................................................................... 4

4 Setting up COM Port Configuration for the LaunchPad Development Kit .......................................... 10

5 Programming Sensor Software With the GUI .......................................................................... 10

6 Sensor GUI Layout......................................................................................................... 11

7 GUI Sensor Tile ............................................................................................................ 12

8 GUI Integrated EnergyTrace Measurements........................................................................... 13

9 Board Movement Window................................................................................................. 14

10 Translation Along the X Axis.............................................................................................. 14

11 Translation Along the Y Axis.............................................................................................. 14

12 Translation Along the Z Axis.............................................................................................. 14

13 Rotation Around the X Axis............................................................................................... 15

14 Rotation Around the Y Axis............................................................................................... 15

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15 Rotation Around the Z Axis ............................................................................................... 16

16 No Movement............................................................................................................... 16

17 Light Sensing in the Gesture Recognition Window.................................................................... 17

18 TI Resource Explorer Cloud .............................................................................................. 19

19 CCS Cloud .................................................................................................................. 20

20 Directing the Project>Import Function to the Demo Project.......................................................... 21

21 When CCS Has Found the Project ...................................................................................... 22

22 TI Drivers Software Examples in TI Resource Explorer .............................................................. 23

23 Schematics.................................................................................................................. 25

List of Tables

1 OPT3001 Pinout ............................................................................................................. 5

2 TMP007 Pinout............................................................................................................... 5

3 BMI160 Pinout ............................................................................................................... 6

4 BMM150 Pinout.............................................................................................................. 6

5 BME280 Pinout .............................................................................................................. 7

6 Hardware Change Log...................................................................................................... 7

7 Software Examples.......................................................................................................... 8

8 IDE Minimum Requirements for MSP-EXP432P401R.................................................................. 8

9 IDE Minimum Requirements for MSP-EXP430FR5994 ................................................................ 8

10 Source File and Folders .................................................................................................... 9

11 Source Files and Folders.................................................................................................. 17

12 Source Files and Folders.................................................................................................. 18

Trademarks

BoosterPack, LaunchPad, SimpleLink, Code Composer Studio, MSP432, EnergyTrace, MSP430Ware,

MSP430, E2E are trademarks of Texas Instruments.

ARM, Keil, µVision are registered trademarks of ARM Ltd.

Bluetooth is a registered trademark of Bluetooth SIG.

IAR Embedded Workbench is a registered trademark of IAR Systems AB.

Bosch is a registered trademark of Robert Bosch LLC.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

All other trademarks are the property of their respective owners.

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Getting Started

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

1 Getting Started

1.1 Introduction

The Sensors BoosterPack kit (BOOSTXL-SENSORS) is an easy-to-use plug-in module for adding digital

sensors to the LaunchPad development kit design. SimpleLink MCU LaunchPad development kit

developers can use this BoosterPack plug-in module to start developing sensor applications using the

onboard gyroscope, accelerometer, magnetometer, pressure, ambient temperature, humidity, ambient

light, and infrared temperature sensors. (Only the PCB footprint is provided for the infrared temperature

sensor due to TMP007 device end-of-life.)

1.2 Key Features

• Inertial measurement unit (IMU) sensor – accelerometer and gyroscope

• Magnetometer

• Environmental sensor: pressure, ambient temperature, and humidity

• Ambient light sensor

• PCB footprint for the infrared temperature sensor (device not populated due to end-of-life)

• Works with TI LaunchPad development kits

1.3 What's Included

1.3.1 Kit Contents

• 1x BOOSTXL-SENSORS BoosterPack plug-in module

• 1x quick start guide

1.3.2 Software Examples

• SimpleLink MSP-EXP432P401R LaunchPad development kit + BOOSTXL-SENSORS demos (see

Section 3)

– Raw sensor data output + GUI

– TI RTOS sensor output + GUI

• MSP-EXP430FR5994 LaunchPad development kit + BOOSTXL-SENSORS demos (see Section 3)

– TI RTOS sensor output + GUI

1.4 Next Steps: Looking Into the Provided Code

After the EVM features have been explored, the fun can begin. It's time to open an integrated

development environment (IDE) and start looking at the code examples. Section 3 describes the example

projects available to make it easy to understand the provided software.

Hardware

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

2 Hardware

Figure 2 shows an overview of the BoosterPack plug-in module.

Figure 2. BOOSTXL-SENSORS Overview

2.1 Hardware Features

2.1.1 BoosterPack Pinout

Figure 3 shows the pinout of the BoosterPack plug-in module.

Figure 3. BoosterPack Plug-in Module Pinout

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Hardware

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

The Sensors BoosterPack plug-in module adheres to the 40-pin LaunchPad development kit and

BoosterPack plug-in module pinout standard. A standard was created to aid compatibility between

LaunchPad development kits and BoosterPack plug-in modules across the TI ecosystem.

The 40-pin standard on the BOOSTXL-SENSORS is compatible with the 20-pin standard that is used by

other LaunchPad development kits like the MSP-EXP430G2 LaunchPad development kit. This allows for

40-pin BoosterPack plug-in modules to be used with 20-pin LaunchPad development kits.

The BOOSTXL-SENSORS BoosterPack plug-in module has both male and female headers to support

stacking on top. You must take careful consideration when stacking other BoosterPack plug-in modules

near the Sensors BoosterPack plug-in module as heat, shade, and electromagnetic fields can adversely

affect the sensors readings.

More information about compatibility can also be found at www.ti.com/launchpad.

2.1.2 TI OPT3001 Light Sensor

The OPT3001 is a digital ambient light sensor (ALS) that measures the intensity of light as visible by the

human eye. Covering the sensor with a finger or shining a flashlight on it changes the output of the

OPT3001. The digital output is reported over an I2C- and System Management Bus (SMBus)-compatible,

2-wire serial interface. The reference designator for the OPT3001 is U1. Table 1 lists the pin connections

of the OPT3001.

More information on the OPT3001 light sensor can be found at www.ti.com/product/opt3001.

(1) Pin is multiplexed with the I2C communication lines of the TMP007,

BMI160, and BME280.

Table 1. OPT3001 Pinout

BoosterPack Header Connection Pin Function

J1.9(1) I2C SCL

J1.10(1) I2C SDA

J2.11 OPT3001 Interrupt

2.1.3 TI TMP007 Temperature Sensor

The TMP007 is a digital infrared (IR) thermopile contactless temperature sensor with integrated math

engine that measures the temperature of an object without having to be in direct contact. Placing your

hand over the sensor increases the sensor output. The digital output is reported over an I2C- and SMBus-

compatible, 2-wire serial interface. The reference designator for the TMP007 is U5. Table 2 lists the pin

connections of the TMP007.

NOTE: The TMP007 infrared temperature sensor is no longer populated on this BoosterPack board,

and only the PCB footprint is provided due to the end-of-life status of the device.

(1) Pin is multiplexed with the I2C communication lines of the OPT3001,

BMI160, and BME280.

Table 2. TMP007 Pinout

BoosterPack Header Connection Pin Function

J1.9(1) I2C SCL

J1.10(1) I2C SDA

J2.12 TMP007 Interrupt

Hardware

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2.1.4 Bosch®BMI160 Inertial Measurement Sensor

The Bosch BMI160 inertial measurement unit is a 6-axis digital accelerometer and gyroscope sensor that

measures gravitational forces exerted on the EVM as well as speed of rotation in degrees per second. The

BMI160 can synchronize its own accelerometer and gyroscope data as well as with an external device

such as a geomagnetic sensor. Rotating the board about its axis increases the gyroscope output of the

sensor, and changing the orientation of the board with respect to the earth changes its accelerometer

output (for example, with the X arrow toward the earth, the X value of the accelerometer is positive). The

BMI160 has a secondary I2C interface for connecting additional Bosch sensors such as the BMM150

geomagnetic sensor. The digital output of both sensors is reported over an I2C- and SMBus-compatible 2-

wire serial interface. The reference designator for the BMI160 is U3. Table 3 lists the pin connections of

the BMI160.

More information on the BMI160 inertial measurement unit can be found at www.bosch-

sensortec.com/en/bst/products/all_products/bmi160.

(1) Pin is multiplexed with the I2C communication lines of the OPT3001,

TMP007, and BME280

Table 3. BMI160 Pinout

BoosterPack Header Connection Pin Function

J1.5 BMI160 Interrupt 1

J1.9(1) I2C SCL

J1.10(1) I2C SDA

J2.13 BMI160 Interrupt 2

2.1.5 Bosch BMM150 Geomagnetic Sensor

The Bosch BMM150 geomagnetic sensor is a 3-axis digital magnetometer sensor that measures the

strength of magnetic fields in microtesla for e-compass applications. The BMM150 can be used in

combination with the BMI160 for 9-axis sensing. Placing a magnet near the sensor increases the sensor

output. The BMM150 is connected to the BMI160 as a secondary I2C device, and all of its sensor data is

passed to the BMI160 to be reported out over an I2C- and SMBus-compatible, 2-wire serial interface. The

reference designator for the BMM150 is U2. Table 4 lists the pin connections of the BMM150.

More information on the BMM150 geomagnetic sensor can be found at www.bosch-

sensortec.com/en/bst/products/all_products/bmm150.

Table 4. BMM150 Pinout

BoosterPack Header Connection Pin Function

J1.8 BMM150 Interrupt

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Hardware

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

2.1.6 Bosch BME280 Environmental Sensor

The Bosch BME280 integrated environmental unit is a digital pressure, ambient temperature and relative

humidity sensor. Changes in the environment surrounding the sensor cause changes in the sensor output.

The digital output of the sensor is reported over an I2C- and SMBus-compatible, 2-wire serial interface.

The reference designator for the BMI160 is U3. Table 5 lists the pin connections of the BME280.

More information on the BME280 environmental sensor can be found at www.bosch-

sensortec.com/en/bst/products/all_products/bme280.

(1) Pin is multiplexed with the I2C communication lines of the OPT3001,

TMP007, and BMI60.

Table 5. BME280 Pinout

BoosterPack Header Connection Pin Function

J1.9(1) I2C SCL

J1.10(1) I2C SDA

2.2 Power

The board was designed to be powered by the attached LaunchPad development kit.

2.2.1 LaunchPad Development Kit Default Power

This is the default power configuration for the BOOSTXL-SENSORS. In this configuration, power is

provided through the 3V3 (J1.1) pin on the BoosterPack plug-in module headers. The 3V3 pin powers

everything on the Sensors BoosterPack plug-in module.

2.3 Design Files

2.3.1 Hardware

Schematics can be found in Section 5. All design files including schematics, layout, bill of materials

(BOM), Gerber files, and documentation are available on the BOOSTXL-SENSORS Hardware Design

Files on the download page.

2.3.2 Software

All design files including TI-TXT object-code firmware images, software example projects, and

documentation are available in the software folders that are specific to each LaunchPad development kit.

To see which LaunchPad development kits feature BOOSTXL-SENSORS examples, visit the download

page.

2.3.3 Quick Start Guide

A quick start guide is available for download.

2.4 Hardware Change Log

Table 6 lists the hardware revision history.

Table 6. Hardware Change Log

PCB Revision Description

Rev 1.0 Initial release

Rev 1.1 Updates for CE

Software Examples

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BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

3 Software Examples

The following software examples are included with the SimpleLink MSP-EXP432P401R and

MSPEXP430FR5994 LaunchPad development kits for the Sensors BoosterPack plug-in module (see

Table 7). These examples can be found in the MSP-EXP432P401R Software Examples and MSP-

EXP430FR5994 Software Examples zip folders.

Table 7. Software Examples

Demo Name LaunchPad /

BoosterPack Required Description More Details

BOOSTXL- SENSORS_SensorGUI_

MSP432P401R MSP-EXP432P401R /

BOOSTXL-SENSORS Demonstrates how to sample data from the five

onboard digital sensors and communicate that

over UART in a JSON payload Section 3.1

BOOSTXL-SENSORS_TI-RTOS_

SensorGUI_MSP432P401R MSP-EXP432P401R /

BOOSTXL-SENSORS Demonstrates how to sample data from the five

onboard digital sensors and communicate that

over UART in a JSON payload Section 3.2

BOOSTXL-SENSORS_TI-RTOS_

SensorGUI_MSP430FR5994 MSP-EXP430FR5994 /

BOOSTXL-SENSORS Demonstrates how to sample data from the five

onboard digital sensors and communicate that

over UART in a JSON payload Section 3.3

To use any of the software examples with the LaunchPad development kit, you must have an integrated

development environment (IDE) that supports the MSP432P401R and MSP430FR5994 devices (see

Table 8).

Table 8. IDE Minimum Requirements for MSP-EXP432P401R

Code Composer Studio™ IDE IAR Embedded Workbench®for ARM IDE ARM®Keil®µVision®IDE

v7.1.0 v7.80.3 MDK-ARM v5

Table 9. IDE Minimum Requirements for MSP-EXP430FR5994

Code Composer Studio™ IDE IAR Embedded Workbench®for ARM IDE

v6.1.3 v6.30

For more details on how to get started quickly, and where to download the latest CCS, IAR, and Keil IDEs,

see Section 4.

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Software Examples

SLAU666B–June 2016–Revised May 2018

BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module

3.1 BOOSTXL-SENSORS_SensorGUI_MSP432P401R

This section describes the functionality and structure of the BOOSTXL-

SENSORS_SensorGUI_MSP432P401R demo that is included in the MSP-EXP432P401R Software

Examples, or more easily accessible through the SimpleLink MSP432™ SDK (see Section 4.6).

3.1.1 Source File Structure

The project is split into multiple files (see Table 10). This makes it easier to navigate and reuse parts of it

for other projects.

Table 10. Source File and Folders

Name Description

msp432_startup_ccs.c SimpleLink MSP432 MCU family interrupt vector table for CGT

Library: driverlib Device driver library (MSP432DRIVERLIB)

src/bme280.c Driver for communicating with the environmental sensor

src/bme280_support.c Support driver for communicating with the environmental sensor

src/bmi160.c Driver for communicating with the IMU and magnetometer sensors

src/bmi160_support.c Support driver for communicating with the IMU and magnetometer sensors

src/demo_sysctl.c Delay function for MSP432 MCU

src/i2c_driver.c Driver for I2C communication with the sensors

src/main.c The main function of the demo, interrupt service routines, global variables, and more

src/opt3001.c Driver for communicating with the ambient light sensor

src/tmp007.c Driver for communicating with the infrared temperature sensor

src/uart_driver.c Driver for UART communication with the PC GUI

3.1.2 Working With the GUI

The Sensor GUI allows for quick visualizations of the sensors data and testing of applications.

3.1.2.1 Getting Started

1. Download the BOOSTXL-SENSORS_GUI+ET zip file, and extract its contents.

2. Launch BOOSTXL-SENSORS_GUI+ET.

3. Plug your MSP432P401R LaunchPad development kit with Sensors BoosterPack plug-in module into a

USB port. And click the icon in the lower left corner of the GUI.

• If needed, go to "Options" and select the proper COM Port for the Application UART and the baud

rate as 115200 (see Figure 4).

NOTE: For Windows, you can find the port number by opening Device Manager and looking for

"XDS110 Class Application/User UART" under "Ports (COM & LPT)". It will be listed as

COMnn, where nn is the number of the port.

Software Examples

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Figure 4. Setting up COM Port Configuration for the LaunchPad Development Kit

4. Click "File" and click "Program Device". The firmware should download to the LaunchPad development

kit (see Figure 5).

Figure 5. Programming Sensor Software With the GUI

5. You should now be seeing live sensor data from the LaunchPad development kit plus the BoosterPack

plug-in module.

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