Texas Instruments TMAG5170D User manual
User’s Guide
TMAG5170DEVM
ABSTRACT
This user’s guide describes the characteristics, operation, and use of the TMAG5170D evaluation module
(EVM). This EVM is designed to evaluate the performance of the TMAG5170D. Throughout this document,
the terms evaluation board, evaluation module, and EVM are synonymous with the TMAG5170DEVM. This
document includes a schematic, reference printed circuit board (PCB) layouts, and a complete bill of materials
(BOM).
Table of Contents
1 Overview..................................................................................................................................................................................2
1.1 Kit Contents........................................................................................................................................................................2
1.2 Related Documentation From Texas Instruments.............................................................................................................. 2
2 Hardware................................................................................................................................................................................. 3
2.1 Features............................................................................................................................................................................. 3
3 Operation.................................................................................................................................................................................3
3.1 Quick Start Setup............................................................................................................................................................... 3
3.2 EVM Operation...................................................................................................................................................................4
4 Schematics, PCB Layout, and Bill of Materials................................................................................................................. 12
4.1 Schematics.......................................................................................................................................................................13
4.2 PCB Layout...................................................................................................................................................................... 15
4.3 Bill of Materials.................................................................................................................................................................17
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1 Overview
The TMAG5170D is a dual-die, 3-axis linear Hall-effect sensor. This device integrates three independent Hall
sensors in X, Y, and Z axes on each die. A precision analog signal-chain along with integrated 12-bit ADC
digitizes the measured analog magnetic field values. The device can be configured further to select one of three
magnetic field ranges that suits the magnet strength and component placements during system calibration.
Table 1-1. TMAG5170D Device Summary
PRODUCT SENSITIVITY RANGE OPTIONS
TMAG5170DA2 ±75 mT, ±150 mT, ±300 mT
TMAG5170DA1 is not yet available and is not currently installed on the EVM.
1.1 Kit Contents
Table 1-2 lists the contents of the EVM kit. Contact the nearest Texas Instruments Product Information Center if
any component is missing.
Table 1-2. Kit Contents
ITEM QUANTITY
TMAG5170DEVM 1
3D-printed Rotate & Push module 1
Handheld magnet 1
1.2 Related Documentation From Texas Instruments
This user's guide is available from the TI website under literature number SBAU420. Any letter appended to the
literature number corresponds to the document revision that is current at the time of the writing of this document.
Newer revisions are available from www.ti.com or the Texas Instruments' Literature Response Center at (800)
477-8924 or the Product Information Center at (972) 644-5580. When ordering, identify the document by both
title and literature number. Table 1-3 lists documentation related to the EVM. Click the links in Table 1-3 for
further information. The device name links to the product web folder on www.ti.com. The literature number links
to the document PDF.
Table 1-3. Related Documentation
DOCUMENT TITLE
DOCUMENT LITERATURE
NUMBER
TMAG5170D-Q1 data sheet SLYS052
TI-SCB user's guide SLAU839
TMAG5170 EVM Quick Start Video —
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2 Hardware
The EVM is an easy-to-use platform for evaluating the main features and performance of the TMAG5170D.
The EVM includes a graphical user interface (GUI) used to read and write registers, as well as view and save
measurement results. Also included is a 3D-printed Rotate & Push module to test the common functions of angle
measurement and push button with a single device.
The EVM is intended to provide basic functional evaluation of the devices. The layout is not intended to be a
model for the target circuit, nor is the model laid out for electromagnetic compatibility (EMC) testing. The EVM
has both sensitivity variations of the TMAG5170D installed, and may be broken into two separate boards as
needed. The EVM is intended to interface with the TI-SCB, but may be used as a stand-alone device if desired.
2.1 Features
• Snap-apart PCB for TMAG5170DA2 sensitivity evaluation
• GUI support to read and write device registers, as well as view and save measurement results
• 3D-printed Rotate & Push module
• Micro-USB connector for power supply
3 Operation
3.1 Quick Start Setup
To set up and use the EVM, follow these steps:
1. Download and install the PAMB Windows® USB driver: http://www.ti.com/lit/zip/sbac253
2. Attach the EVM to the Sensor Control Board (TI-SCB) (see Figure 3-1).
3. Connect the EVM to a PC using a USB cable.
a. Insert the micro USB cable into the TI-SCB Controller onboard USB receptacle J2.
b. Plug the other end of the USB cable into a PC.
4. Access the GUI from the following link in either a Firefox™ or Google Chrome™ browser:
a. TMAG5170DEVM GUI: https://dev.ti.com/gallery/search/TMAG5170D
5. Configure the device through the register map settings:
a. Click Write Config to Both
b. Set OPERATING_MODE within the DEVICE_CONFIG register to "Active Measure Mode" (0b101)
c. Set MAG_CH_EN within the SENSOR_CONFIG register to "XYZ" (0b0111)
6. Navigate to the Plots panel and click Collect Data
7. Apply a magnetic field to the sensor by doing one of the following:
a. Wave the included handheld magnet around the sensor.
b. Use the Rotate & Push module by attaching it to the EVM (see Figure 3-10). For more details on how to
use this module, see Section 3.2.2.
8. Observe the outputs in the GUI. See Section 3.2.1.3 for more information on GUI setup and operation.
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3.2 EVM Operation
To use the EVM with the included TI-SCB Controller, connect the EVM as shown in Figure 3-1.
Figure 3-1. EVM on TI-SCB Controller
It is optional to snap apart the TMAG5170DEVM to separate the TMAG5170DA1 and TMAG5170DA2 halves. To
snap apart the PCB, flex the PCB at the indicated boundary shown in Figure 3-2.
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Figure 3-2. TMAG5170DEVM Snap Apart Edge
3.2.1 Setup
3.2.1.1 Driver Installation
Download and install the PAMB Windows USB driver: http://www.ti.com/lit/zip/sbac253. This is a one-time step
per computer. Unzip the folder and run the .exe file with administrator privileges.
3.2.1.2 Firmware
The GUI can load firmware onto the TI-SCB as described in Section 3.2.1.3.1. Firmware updates will be pushed
through the GUI (requires driver installation). Downloaded offline GUIs may check for GUI/Firmware updates
depending on the version.
3.2.1.2.1 Firmware Debug
If the firmware gets corrupted or must be manually reinstalled for any reason, follow these steps to reinstall the
firmware. This is demonstrated in the TMAG5170 EVM Quick Start Video:
1. Configure the MCU on the TI-SCB Controller to Device Firmware Update (DFU) Mode.
a. It is possible that the MCU has already entered DFU mode. If so, the GUI will notify you and try to
update the firmware to the latest version after the GUI is connected to the PC.
b. DFU mode can be entered manually through one of the following methods while the TI-SCB Controller is
powered on:
• Through software:
– Send the command 'bsl' on the TI-SCB's USB Serial (COM) port.
• Though the hardware:
– Ensure TI-SCB is connected to the PC through a USB
– Short the two test points near PK1 and PK2 of the header pins (see Figure 3-3) with a pair of
tweezers (or wire) while pressing the RESET button.
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Figure 3-3. Test Points Used to Enter DFU Mode Manually
c. LEDs D1 and D2 will be off if successful
2. With the MCU in DFU mode, upload the firmware through the GUI:
• Open the File menu and select Program Device
• The firmware update will initiate
• After the GUI re-initializes, the TI-SCB should automatically connect
If the firmware programming was unsuccessful, TI recommends to repeat the above steps with a different
USB port connection on the machine.
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3.2.1.3 GUI Setup and Usage
Access the GUI from the following link in either a Firefox or Google Chrome browser:
• TMAG5170DEVM GUI: https://dev.ti.com/gallery/search/TMAG5170D
3.2.1.3.1 Initial Setup
To set up the GUI the first time, follow these steps:
1. Make sure that the above mentioned driver was installed successfully to ensure that everything works
properly and that the GUI can update the EVM firmware, if necessary.
2. With the EVM/TI-SCB Controller unit plugged to the PC, go to the GUI link:
3. To launch the GUI from the web browser, click the GUI Composer application to open the GUI Composer
window (see Figure 3-4).
Figure 3-4. GUI Composer Application Window
a. For first-time GUI Composer setup, follow the prompts to download the TI Cloud Agent and browser
extension (see Figure 3-5). These prompts will appear after you close the README.md dialog.
Figure 3-5. TI Cloud Agent
4. Optionally, click the icon in the GUI Composer window to download the GUI for offline use (see Figure
3-4).
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3.2.1.3.2 GUI Operation
To operate the GUI, follow these steps:
1. Connect to and launch the GUI as described in Section 3.2.1.3.1.
2. With the EVM connected to the GUI, close the README.md file page. The text near the bottom-left hand
corner of the GUI should read Hardware Connected (see Figure 3-6).
Figure 3-6. Hardware Connected
a. If Hardware Connected does not show in the bottom-left hand corner of the GUI, check different
hardware COM ports under Options → Serial Port (see Figure 3-7).
Figure 3-7. Change Serial Port
b. If the hardware still does not connect, make sure you are using the correct GUI/EVM combination.
3. Click the Registers icon shown in Figure 3-8 (also available on the left-side menu) to view the register
map, change device settings, and enable automatic register read. Each die within the TMAG5170D may
be configured independently using the device select, or both sensors can be configured under the same
register settings (if desired). For questions about a register or register bit field, select the icon. For more
questions about registers, check the data sheet.
Figure 3-8. Registers Page Icon
4. Click the Plots icon to view and save graphical data from the results registers (see Figure 3-9). This is also
available on the left-side menu.
Figure 3-9. Plots Page Icon
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3.2.2 Rotate and Push Demonstration
To use the rotate and push demonstration, follow these steps:
1. Attach the Rotate & Push module to the EVM as shown in Figure 3-10.
Figure 3-10. Rotate & Push Module on EVM
2. In the GUI register page:
a. At this time the Rotate & Push GUI will only show results for the device selected on the register map
page.
b. Make sure that the DEVICE_CONFIG → OPERATING_MODE says (TRIGGER_MODE Active).
c. Make sure that SYSTEM_CONFIG → TRIGGER_MODE is set to the default value.
d. Under the SENSOR_CONFIG register:
i. Make sure both the X and Y channels are enabled (MAG_CH_EN).
ii. Set X_RANGE and Y_RANGE to ±100 mT for A1 versions, and ±133 mT for A2 versions.
iii. Optional: Set ANGLE_EN to X-Y angle calculation.
e. At the top of the register map, set Auto Read to As fast as possible.
3. Go to the Rotate & Push tab inside the Plots page (see Figure 3-11).
Figure 3-11. Rotate & Push GUI Page
4. If the push button LEDs are not triggering at every angle or trigger when they are not supposed to, calibrate
the module by doing the following:
a. With the settings set to run the demo, slowly rotate the module 360° and use the Plots page to record
the absolute value of the minimum and maximum magnetic field measurements (in mT) for both the X
and Y channels.
b. Adjust the Push threshold calibration value found in the Rotate & Push tab to be about 3 mT to 5 mT
larger than the maximum value recorded above.
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3.2.2.1 Optimizing Device Angle Matching
Each 3D Hall-effect sensor is fabricated on a die and the package assembly has these dies stacked vertically for
a minimal offset in the XY plane. Device tolerances for sensitivity gain and offset should be canceled out:
1. Capture the data for one full rotation on both devices with averaging set to 32x for minimal input referred
noise. Set the device to calculate angle using the desired axes.
2. Correct the gain for one axis on each device:
a. Find the maximum and minimum data points for each axis used in the angle measurement
b. If the maximum of either channel is more than 2x the maximum of the other, it will be necessary to
attenuate the channel with the larger input. Otherwise, TI recommends to amplify the output of the
smaller input
c. GAIN_VALUE in the MAG_GAIN_CONFIG register (0h11) is used to select the sensitivity gain
adjustment for the desired axis.
i. Gain is calculated from an 11-bit value / 1024. (For a value ranging from 0-2)
ii. Select the axis to amplify/attenuate using GAIN_SELECTION
iii. Set gain value based on the ratio of:
1. (Max Ch A - Min Ch A)/(Max Ch B - Min Ch B).
2. Where Channel A and B are selected based on step 2b.
3. Repeat step 1 to verify the amplitude matching and to start the calculation of the offset correction
a. For each axis, calculate the offset using:
i. Output Offset = (Maximum Value + Minimum Value) /2
b. Set OFFSET_SELECTION in MAG_OFFSET_CONFIG (0h12) to 0b11 to enable offset correction on
both axes
c. Set OFFSET_VALUE1 and OFFSET_VALUE2 using a 7-bit 2's compliment value to correct output offset
based on maximum and minimum peak data in step 3a.
After correction sensitivity and offset errors of the device, the sensors may still experience some measurement
error due to mechanical rotations of the package relative to the rotating magnet. The most straightforward
alignment method is achieved by placing the sensor on-axis to the rotating magnet.
Figure 3-12. Sensor Alignments for Angle Measurements
In an ideal on-axis placement, the X and Y axis data will observe a decrease in magnitude only, with no impact
to observed angle linearity. As the package is mechanically offset, peak input data for X and Y axes will vary, and
the severity of amplitude correction needed will become more significant. Additionally, package rotations may
cause angle offset relative to the position of the magnet or phase error between the observed X and Y axis input.
This happens as each sensing element detects the field which is orthogonal to the sensing element and the
sensor is no longer orthogonal to the rotating magnet. As a result, each sensing element detects a portion of the
vector component from either of the other two axes. This error may vary based on the installation of either the
magnet or sensor within the system. Often, end-of-line calibration for each sensor is required after full system
assembly to achieve the best results. For more information, refer to the Texas Instruments Achieving Highest
System Angle Sensing Accuracy application note.
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