ST STEVAL-STWINBX1 User manual

Introduction

The STWIN.box (STEVAL-STWINBX1) is a development kit and reference design that simplifies prototyping and testing of

advanced industrial sensing applications in IoT contexts such as condition monitoring and predictive maintenance.

It is an evolution of the original STWIN kit (STEVAL-STWINKT1B) and features a higher mechanical accuracy in the

measurement of vibrations, an improved robustness, an updated BoM to reflect the latest and best-in-class MCU and industrial

sensors, and an easy-to-use interface for external add-ons.

The STWIN.box kit consists of an STWIN.box core system, a 480mAh LiPo battery, an adapter for the ST-LINK debugger, a

plastic case, an adapter board for DIL 24 sensors and a flexible cable.

The many on-board industrial-grade sensors and the ultra-low power MCU enable applications that feature: ultra-low power,

9 DoF motion sensing, wide-bandwidth vibration analysis, audio and ultrasound acoustic inspection, very precise local

temperature, and environmental monitoring.

A rich set of software packages is available in source code. Optimized firmware libraries and a complete companion cloud

application help to speed up the design cycle to develop end-to-end solutions.

The kit supports a broad range of connectivity options, including the built-in RS485 transceiver, BLE, Wi-Fi, and NFC.

The STWIN.box also includes a 34-pin expansion connector for small form factor daughter boards associated with the STM32

family, such as the STEVAL-C34KAT1 vibrometer and temperature sensors expansion board.

The STWIN.box is suitable for field trials, demonstrations, and PoC for industrial IoT applications that use ST software and

third-party software.

Figure 1. STWIN.box mounted with the plastic case

Getting started with the STEVAL-STWINBX1 SensorTile wireless industrial node

development kit

UM2965

User manual

UM2965 - Rev 1 - December 2022

For further information contact your local STMicroelectronics sales office. www.st.com

1Getting started

1.1 Precautions for use

Warning: Charge your device with a DC 5 V–500 mA USB charger at a temperature from 10°C to

35°C.

The kit must be used within the working temperature range. It must never be exposed to

excessive heat such as direct sunlight, fire, or heating equipment.

Danger: Use only USB chargers equipped with short-circuit protections to prevent fire hazard.

Danger: Use only the LiPo battery provided with the kit (HiMax 752535). A replacement of the battery

with an incorrect type can defeat a safeguard.

LiPo batteries can be damaged and even explode if they are short-circuited or overcharge

or with an improper usage, such as mechanical crushes, hot oven, or battery cutting.

1.2 Features

• Multisensing wireless platform for vibration monitoring and ultrasound detection

•Built around STWIN.box core system board with processing, sensing, connectivity, and expansion

capabilities

• Ultra-low power Arm® Cortex®-M33 with FPU and TrustZone at 160 MHz, 2048 kBytes Flash memory

(STM32U585AI)

• MicroSD card slot for standalone data logging applications

• On-board Bluetooth® low energy v5.0 wireless technology (BlueNRG-M2), Wi-Fi (EMW3080) and NFC

(ST25DV04K)

• Option to implement authentication and brand protection secure solution with STSAFE-A110

• Wide range of industrial IoT sensors:

– Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)

– 3D accelerometer + 3D gyro iNEMO inertial measurement unit (ISM330DHCX) with Machine

Learning Core

– High-performance ultra-low-power 3-axis accelerometer for industrial applications (IIS2DLPC)

– Ultra-low power 3-axis magnetometer (IIS2MDC)

– High-accuracy, high-resolution, low-power, 2-axis digital inclinometer with Embedded Machine

Learning Core (IIS2ICLX)

– Dual full-scale, 1.26 bar and 4 bar, absolute digital output barometer in full-mold package

(ILPS22QS)

– Low-voltage, ultra low-power, 0.5°C accuracy I²C/SMBus 3.0 temperature sensor (STTS22H)

– Industrial grade digital MEMS microphone (IMP34DT05)

– Analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)

• Expandable via a 34-pin FPC connector

1.3 Kit components

The STEVAL-STWINBX1 development kit includes:

• the STWIN core system (main board);

• a plastic case with M3 bolts;

• a 480 mAh 3.7 V LiPo battery;

• STEVAL-MKIGIBV4 ST-LINK adapter with programming cable;

• an adapter board for DIL24 sensors with a flexible cable.

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Figure 2. STEVAL-STWINBX1 components

1.4 Layout of the core system board (STEVAL-STWINBX1) components

Figure 3. Layout of the core system board top components

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Layout of the core system board (STEVAL-STWINBX1) components

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Figure 4. Layout of the core system board bottom components

1.5 Core system board

Figure 5. STEVAL-STWINBX1 block diagram

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Core system board

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Figure 6. STEVAL-STWINBX1 evaluation kit (top view)

Figure 7. STEVAL-STWINBX1 evaluation kit (bottom view)

1.6 Functional blocks

1.6.1 Sensing

The core system board offers a comprehensive range of sensors specifically designed to support industrial

applications and satisfy the demanding requirements of the Industry 4.0.

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Functional blocks

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Figure 8. STEVAL-STWINBX1 - overview of the sensing components

The motion sensors communicate with the STM32U585AI microcontroller via SPI in order to accommodate the

high data rates, whereas the magnetometer and environmental sensors communicate via I²C. The suitably filtered

signal from the IMP23ABSU analog microphone is amplified by a TSV912 op-amp and then sampled by the

internal 12-bit ADC of the MCU. The signal from the digital microphone is directly managed by the audio digital

filter (ADF) interface of the MCU.

Figure 9. STEVAL-STWINBX1 - sensors on the top side

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Figure 10. STEVAL-STWINBX1 - sensors on the bottom side

• U3: ILPS22QS MEMS pressure sensor

•U6: STTS22H digital temperature sensor

• U8: TSV912 wide-bandwidth (8 MHz) rail-to-rail I/O op-amp

• U9: ISM330DHCX iNEMO IMU, 3D accelerometer and 3D gyroscope with Machine Learning Core and

Finite State Machine

• U11: IIS3DWB wide bandwidth accelerometer

• U12: IIS2DLPC high-performance ultra-low-power 3-axis accelerometer for industrial applications

• U13: IIS2MDC 3-axis magnetometer

• U21: IIS2ICLX high-accuracy, high-resolution, low-power, 2-axis digital inclinometer with Machine Learning

Core

• M1: IMP23ABSU analog MEMS microphone

• M2: IMP34DT05 digital MEMS microphone

1.6.1.1 ILPS22QS

The ILPS22QS is an ultra-compact piezoresistive absolute pressure sensor, which functions as a digital output

barometer. It supports dual full-scale up to 4 bar, selectable by the user.

The ILPS22QS embeds a sensing element and an IC interface that communicates over I²C, MIPI I3CSM or SPI

interfaces from the sensing element to the application. It also supports a 1.2 V digital interface.

The ILPS22QS features an analog hub-sensing functionality, which is able to connect an analog input and convert

it to a digital signal for embedded processing.

The ILPS22QS is available in a full-mold, holed LGA package. It is guaranteed to operate over a temperature

range extending from -40°C to +105°C. The package is holed to allow the external pressure to reach the sensing

element.

Table 1. ILPS22QS I/O configuration

I/O Configuration

PH4 I2C2_SCL

PF0 I2C2_SDA

1.6.1.2 STTS22H

The STTS22H is an ultra-low-power, high-accuracy, digital temperature sensor. It offers a high performance over

the entire operating temperature range.

The STTS22H is coupled with an ASIC featuring A/D converter, signal processing logic, and an I²C/SMBus 3.0

interface.

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The sensor is housed in a small 2 x 2 x 0.50 mm 6-lead UDFN package with the exposed pad down for a better

temperature match with the surrounding environment.

The STTS22H is factory-calibrated and requires no additional calibration.

The STTS22H units are 100% tested on a production setup that is NIST traceable and verified with equipment

calibrated in accordance with the IATF 16949:2016 standard.

Table 2. STTS22H I/O configuration

I/O Configuration

PH4 I2C2_SCL

PF0 I2C2_SDA

PF5 INT

1.6.1.3 TVS912

The TSV91x and TSV91xA operational amplifiers offer low voltage operation and rail-to-rail input and output.

They also offer an excellent speed/power consumption ratio, providing an 8 MHz gain-bandwidth product while

consuming only 1.1 mA maximum at 5 V.

The op amps are unity-gain stable and feature an ultra-low input bias current. The devices are ideal for sensor

interfaces, battery-supplied, and portable applications, as well as active filtering.

1.6.1.4 ISM330DHCX

The ISM330DHCX is a system-in-package that features a high-performance 3D digital accelerometer and a 3D

digital gyroscope tailored for Industry 4.0 applications.

The various sensing elements are manufactured using specialized micromachining processes, while the IC

interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed

to match the characteristics of the sensing element.

In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the

same silicon die, guaranteeing superior stability and robustness.

The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of

±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of applications.

All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy,

stability, extremely low noise, and full data synchronization. The embedded features (Machine Learning Core,

programmable FSM, FIFO, sensor hub, event decoding, and interrupts) enable smart and complex sensor nodes,

which deliver high performance at very low power.

The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.

Table 3. ISM330DHCX I/O configuration

I/O Configuration

PI1 SPI2_CLK

PI3 SPI2_MOSI

PD3 SPI2_MISO

PH15 SPI_CS

PB8 INT1

PF4 INT2

1.6.1.5 IIS3DWB

The IIS3DWB is a system-in package that features a 3-axis digital vibration sensor with low noise over an

ultra-wide and flat frequency range.

The wide bandwidth, low noise, very stable, repeatable sensitivity, and the capability of operating over an

extended temperature range (up to +105°C) make the device particularly suitable for vibration monitoring in

industrial applications.

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The high performance delivered at low power consumption, the digital output, and the embedded digital features,

such as FIFO and the interrupts, enable features for battery-operated industrial wireless sensor nodes.

The IIS3DWB has a selectable full-scale acceleration range of ±2/±4/±8/±16 g and is capable of measuring

accelerations with a bandwidth up to 6 kHz with an output data rate of 26.7 kHz.

The device integrates a 3 kB first-in, first-out (FIFO) buffer to avoid any data loss and to limit intervention of the

host processor.

The ST MEMS sensor module family leverages the robust and mature manufacturing processes already used for

the production of micromachined accelerometers and gyroscopes to serve automotive, industrial, and consumer

markets. The sensing elements are manufactured using the ST proprietary micromachining process, whereas the

embedded IC interfaces are developed using CMOS technology.

The IIS3DWB has a self-test capability, which allows checking whether the sensor is correctly working in the final

application.

The IIS3DWB is available in a 14-lead plastic land grid array (LGA) package and is guaranteed to operate over an

extended temperature range from -40°C to +105°C.

Table 4. IIS3DWB I/O configuration

I/O Configuration

PI1 SPI2_CLK

PI3 SPI2_MOSI

PD3 SPI2_MISO

PF12 SPI_CS

PF15 INT1

- INT2

1.6.1.6 IIS2DLPC

The IIS2DLPC is a three-axis linear accelerometer with digital I²C/SPI output interface.

It has full scales of ±2g/±4g/±8g/±16g selectable by the user and can measure accelerations with output data

rates from 1.6 Hz to 1600 Hz.

The IIS2DLPC has a high-performance mode and four low-power modes, which can be changed on-the-fly,

providing outstanding versatility and adaptability to the requirements of the application.

The accelerometer has an integrated 32-level first-in, first-out (FIFO) buffer that allows the user to store data in

order to limit intervention by the host processor. The embedded self-test capability allows checking whether the

sensor is correctly working in the final application.

The IIS2DLPC has a dedicated internal engine to process motion and acceleration detection, including free-fall,

wake-up, highly configurable single/double-tap recognition, activity/inactivity, stationary/motion detection, portrait/

landscape detection, and 6D/4D orientation.

The IIS2DLPC is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate

over an extended temperature range from -40°C to +85°C.

Table 5. IIS2DLPC I/O configuration

I/O Configuration

PI1 SPI2_CLK

PI3 SPI2_MOSI

PD3 SPI2_MISO

PH6 SPI_CS

PF1 INT1

PF2 INT2

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1.6.1.7 IIS2ICLX

The IIS2ICLX is a high-accuracy (ultra-low noise, high stability, and repeatability) and low-power two-axis linear

accelerometer with digital output.

The IIS2ICLX has a selectable full scale of ±0.5/±1/±2/±3 g. It can provide the measured accelerations to the

application over an I²C or SPI digital interface. Its high accuracy, stability over temperature, and repeatability

make IIS2ICLX particularly suitable for inclination measurement applications (inclinometers).

The sensing element is manufactured using a dedicated micromachining process developed by

STMicroelectronics to produce inertial sensors and actuators on silicon wafers.

The IC interface is manufactured using a CMOS process that allows a high level of integration to design a

dedicated circuit, which is trimmed to match the characteristics of the sensing element.

The IIS2ICLX has an unmatched set of embedded features (programmable FSM, machine learning core, sensor

hub, FIFO, event decoding, and interrupts). These features are enablers for implementing smart and complex

sensor nodes, which deliver high accuracy and performance at very low power.

The IIS2ICLX is available in a high-performance (low-stress) ceramic cavity land grid array (CCLGA) package. It

can operate within a temperature range of -40°C to +105°C.

Table 6. IIS2ICLX I/O configuration

I/O Configuration

PI1 SPI2_CLK

PI3 SPI2_MOSI

PD3 SPI2_MISO

PI7 SPI_CS

PF3 INT1

PF11 INT2

1.6.1.8 IIS2MDC

The IIS2MDC is a high-accuracy, ultra-low-power, 3-axis digital magnetic sensor. It features a magnetic field

dynamic range up to ±50 gausses.

The IIS2MDC includes an I²C serial bus interface, which supports standard, fast mode, fast mode plus, and

high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz), and an SPI serial standard interface.

You can configure the device to generate an interrupt signal for magnetic field detection.

The IIS2MDC is available in a plastic land grid array package (LGA) and is guaranteed to operate over an

extended temperature range from -40°C to +85°C.

Table 7. IIS2MDC I/O configuration

I/O Configuration

PH4 I2C2_SCL

PF0 I2C2_SDA

PF9 INT

1.6.1.9 IMP23ABSU

The IMP23ABSU is a compact, low-power microphone with a capacitive sensing element and an IC interface.

The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon-

micromachining process to produce audio sensors.

The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio.

The microphone sensitivity is -38 dBV ±1 dB at 94 dBSPL, 1 kHz.

The IMP23ABSU is available in a package compliant with reflow soldering and is guaranteed to operate over an

extended temperature range from -40°C to +85°C.

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