Sony Ericsson K700i User manual
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
Approved according to 000 21-LXE 107 42/1
Working Instruction, Electrical
Applicable for K700i/K700c
Contents
1Replacement of parts ......................................................................................................2
1.1 Battery connector...............................................................................................2
1.2 Board to board connector ..................................................................................3
1.3 FPC connectors..................................................................................................4
1.4 Bending shield can fence...................................................................................5
1.5 Replacing shield can fence if damage at repair center ......................................7
2BGA Equipment reflow profiles ....................................................................................8
3Revision History..............................................................................................................9
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
2(9)
1 Replacement of parts
BGA Equipment, General reflow profile guideline see chapter 2.
1.1 Battery connector
Process tools
• BGA replacement equipment
• Pair of tweezers
• Solder cleaning wiper (Tin wick)
• Solder paste
• Gel flux
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Step-by-Step Instructions
1
Replace the component.
Use BGA repair equipment.
No special treatment due to through pins.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
3(9)
1.2 Board to board connector
Process tools
• BGA replacement equipment
• Pair of tweezers
• Solder cleaning wiper (Tin wick)
• Solder paste
• Gel flux
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Step-by-Step Instructions
1
Replace the component.
Use BGA repair equipment.
After soldering check for solder bridges between
solder joints.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
4(9)
1.3 FPC connectors
Process tools
• Dentist hook
• BGA replacement
• Pair of tweezers
• Solder cleaning wiper (Tin wick)
• Solder paste
• Gel flux
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Step-by-Step Instructions
1
Replace the component.
Use BGA repair equipment.
After soldering check for solder bridges between
solder joints.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
5(9)
1.4 Bending shield can fence
Process tools
• Dentist hook
• Cutting pliers, very sharp edged.
• Shield fence pliers NTZ 112 537
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
6(9)
Step-by-Step Instructions
1
Remove the shield can lid.
If needed it is allowed to remove the pick up
area with a cutting pliers (1). This pick up area is
only used when machine mounting the can and
there is no need to put it back again.
NOTE!
Assure that the cutting pliers is sharp-edged to
prevent damaging the shield can fence.
Cut the frame according to the red lines in the
picture.
Bend the frame carefully without bending the
shield can fence wall. Use Shield fence pliers
NTZ 112 537.
Replace the component and gently bend back the
frame. Be very cautious with the shield can
fence wall.
Put back a new shield can lid. Press on all sides
of the lid until you hear a “click” sound.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
7(9)
1.5 Replacing shield can fence if damage at repair center
Process tools
• Dentist hook
• BGA repair equipment
• Hot air soldering station
• Pair of tweezers
• Solder cleaning wiper (Tin wick)
• Solder paste
• Solder wire
• Gel flux
• Cutting pliers
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Step-by-Step Instructions
1
NOTE!
Replacing shield can fence is only done at repair
centers when a shield can fence is damaged after
bending the frame.
This operation is very time consuming and must
be performed by very skilled repair operators.
Remove the shield can fence by using hot air (or
preferrably with BGA repair equipment).
Most often it is necessary to remove the shield
can fence in pieces by using cutting pliers.
Assemble a new shield can fence with BGA
repair equipment.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
8(9)
2 BGA Equipment reflow profiles
These values are strongly depending on the BGA replacement equipment.
Nozzle type will be chosen after the outer size of the actual component. Make sure the nozzle
does not affect any near placed components.
NOTE:
These values are recommendations and may have to be changed depending on the type of
equipment.
General reflow profile sn/pb
* The higher temperature in case the board has extremely high ∆T.
Ramp rate < 3°C/sec
Ramp rate cooling zone < 6°C/sec
Time above liquidus 60-150 sec
Minimum temperature 215°C
Maximum temperature 225°C or 235°C for 10-20 sec
Total time Appr. 4-7 min
0
50
100
150
200
250
0 40 80 120 160 200 240 280
Preheat zone
Reflow zone
Cooling zone
Temperature [ºC]
Time [Seconds]
Working Instruction, Electrical
3/00021-2/FEA 209 544/83 A
Company Internal Sony Ericsson Mobile Communications AB
9(9)
3 Revision History
Rev. Date Changes / Comments
A 2004-05-27 Initial release
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6
This manual suits for next models
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