Samsung GT-E1075L User manual

GSM TELEPHONE

GT-E1075L

GSM TELEPHONE CONTENTS

1. Safety Precautions

2. Specification

3. Product Function

4. Array course control

5. Exploded View and Parts List

6. Main Electrical Parts List

7. Block Diagrams

8. PCB Diagrams

9. Flow Chart of Troubleshooting

10. Reference data

11. Disassembly and Assembly

instructions

GSPN (Global Service Partner Network)

Country Web Site

North America service.samsungportal.com

Latin America latin.samsungportal.com

CIS cis.samsungportal.com

Europe europe.samsungportal.com

China china.samsungportal.com

Asia asia.samsungportal.com

Mideast &Africa mea.samsungportal.com

This Service Manual is aproperty of Samsung Electronics Co.,Ltd.

Any unauthorized use of Manual can be punished under applicable

International and/or domestic law.

Samsung Electronics Co.,Ltd.

2009. 01. Rev.1.0

ⓒ

SAMSUNG Proprietary-Contents may change without notice

2. Specification

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2-1

2-1. GSM General Specification

GSM850

Phase 2 PCS1900

Phase 1

Freq.

Band[MHz]

Uplink/Downlink

824~849

869~894

1850~1910

1930~1990

ARFCN range 128~251 512~810

Tx/Rx spacing 45MHz 95MHz

Mod. Bit rate/

Bit Period 270.833kbps

3.692us 270.833kbps

3.692us

Time Slot

Period/Frame

Period

576.9us

4.615ms 576.9us

4.615ms

Modulation 0.3GMSK 0.3GMSK

MS Power 33dBm~5dBm 30dBm~0dBm

Power Class 5pcl ~19

pcl 0pcl ~15

pcl

Sensitivity -102dBm -100dBm

TDMA Mux 88

Cell Radius 35Km 2Km

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Specification

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2-2

2-2. GSM TX power class

TX Power

control level PCS1900

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control level GSM850

533±2

dBm

631±2

dBm

729±2

dBm

827±2

dBm

925±2

dBm

10 23±2 dBm

11 21±2 dBm

12 19±2 dBm

13 17±2 dBm

14 15±2 dBm

15 13±2 dBm

16 11±3 dBm

17 9±3dBm

18 7±3 dBm

19 5±3 dBm

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3. Product Function

3-1

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Main Function

-Simple and modern bar design

-FM RADIO

-Speaker Phone Function

-My Menu

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10. Reference data

10-1

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Reference Abbreviate

―ADC :Analog to Digital Converter

―AMPS :Advanced Mobile Phone System(analog IS-95)

―BGA :Ball Grid Array

―BPF :Band Pass Filter

―CDMA :Code Division Multiple Access

―DL :Downlink

―FTP :File Transfer Protocol

―GPS :Global Positioning System

―MMS :Multimedia Messaging Service

―PBA :Panel Board Assembly

―PCS :Personal Communication System

―PIM(S) :Personal Information Management (System)

―QPSK :Quadrature Phase Shift Keying

―RF :Radio Frequency

―RSS :Received Signal Strength

―SAW :Surface Acoustic Wave

―SMS :Short Message Service

―TCXO :Temperature Compensated Crystal Oscillator

―TSP :Touch Screen Panel

―UL :Uplink

―USB :Universal Serial Bus

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1. Safety Precautions

1-1

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1-1. Repair Precaution

―Repair in Shield Box, during detailed tuning.

Take specially care of tuning or test, because the specification of cellular phone is sensitive for

surrounding interference(RF noise).

―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by

the influence of magnetic force.

―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be

worn away.

―Use athicken twisted wire when you measure level.

Athicken twisted wire has low resistance, therefore error of measurement is few.

―Repair after separate Test Pack and Set because for short danger (for example an overcurrent

and furious flames of parts etc) when you repair board in condition of connecting Test Pack and

tuning on.

―Take specially care of soldering, because Land of PCB is small and weak in heat.

―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous

when tuning ON/OFF PBA and Connector after disassembling charger.

―Don't use as you pleases after change other material than replacement registered on SEC System.

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

1-2

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1-2. ESD(Electrostatically Sensitive Devices) Precaution

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD

(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

You can prevent from ESD damage by static electricity.

―Remove static electricity remained your body before you touch semiconductor or parts with

semiconductor. There are ways that you touch an earthed place or wear static electricity prevention

string on wrist.

―Use earthed soldering steel when you connect or disconnect ESD.

―Use soldering removing tool to break static electricity. Otherwise ESD will be damaged by static

electricity.

―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and

aluminum plate to have conductive power,they are prevented from static electricity.

―You must maintain electric contact between ESD and place due to be set up until ESD is

connected completely to the proper place or acircuit board.

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4. Array course control

4-1

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4-1. Software Adjustments

Test Jig (GH99-36900A) Test Cable (GH39-01160A)

RF Test Cable (GH39-00985A) Adapter (GH99-38251A)

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Array course control

4-2

This Document can not be used without Samsung's authorization

4-2. Software Downloading

4-2-1. Downloading Binary Files

•2binary files for downloading E1075.

–E1075XAHxx.cla

–E1075XAHxx.tfs

4-2-2. Pre-requsite for Downloading

•Downloader Program(Coast Downloader for SEC v00.exe)

•E1075 Mobile Phone

•JIG BOX

•Test Cable

•Serial Cable

•Binary files

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