Samsung GT-E1075L User manual
GSM TELEPHONE
GT-E1075L
GSM TELEPHONE CONTENTS
1. Safety Precautions
2. Specification
3. Product Function
4. Array course control
5. Exploded View and Parts List
6. Main Electrical Parts List
7. Block Diagrams
8. PCB Diagrams
9. Flow Chart of Troubleshooting
10. Reference data
11. Disassembly and Assembly
instructions
GSPN (Global Service Partner Network)
Country Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast &Africa mea.samsungportal.com
This Service Manual is aproperty of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
Samsung Electronics Co.,Ltd.
2009. 01. Rev.1.0
ⓒ
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2. Specification
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2-1
2-1. GSM General Specification
GSM850
Phase 2 PCS1900
Phase 1
Freq.
Band[MHz]
Uplink/Downlink
824~849
869~894
1850~1910
1930~1990
ARFCN range 128~251 512~810
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate/
Bit Period 270.833kbps
3.692us 270.833kbps
3.692us
Time Slot
Period/Frame
Period
576.9us
4.615ms 576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
Power Class 5pcl ~19
pcl 0pcl ~15
pcl
Sensitivity -102dBm -100dBm
TDMA Mux 88
Cell Radius 35Km 2Km
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Specification
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2-2
2-2. GSM TX power class
TX Power
control level PCS1900
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level GSM850
533±2
dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
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3. Product Function
3-1
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Main Function
-Simple and modern bar design
-FM RADIO
-Speaker Phone Function
-My Menu
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10. Reference data
10-1
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Reference Abbreviate
―ADC :Analog to Digital Converter
―AMPS :Advanced Mobile Phone System(analog IS-95)
―BGA :Ball Grid Array
―BPF :Band Pass Filter
―CDMA :Code Division Multiple Access
―DL :Downlink
―FTP :File Transfer Protocol
―GPS :Global Positioning System
―MMS :Multimedia Messaging Service
―PBA :Panel Board Assembly
―PCS :Personal Communication System
―PIM(S) :Personal Information Management (System)
―QPSK :Quadrature Phase Shift Keying
―RF :Radio Frequency
―RSS :Received Signal Strength
―SAW :Surface Acoustic Wave
―SMS :Short Message Service
―TCXO :Temperature Compensated Crystal Oscillator
―TSP :Touch Screen Panel
―UL :Uplink
―USB :Universal Serial Bus
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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test, because the specification of cellular phone is sensitive for
surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. Otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.
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4. Array course control
4-1
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4-1. Software Adjustments
Test Jig (GH99-36900A) Test Cable (GH39-01160A)
RF Test Cable (GH39-00985A) Adapter (GH99-38251A)
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Array course control
4-2
This Document can not be used without Samsung's authorization
4-2. Software Downloading
4-2-1. Downloading Binary Files
•2binary files for downloading E1075.
–E1075XAHxx.cla
–E1075XAHxx.tfs
4-2-2. Pre-requsite for Downloading
•Downloader Program(Coast Downloader for SEC v00.exe)
•E1075 Mobile Phone
•JIG BOX
•Test Cable
•Serial Cable
•Binary files
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