LB-Link BL-M8723DU1 User manual
Product Specification
Revision V1.0
Date 2018-05-25
Model Name BL-M8723DU1
Product Name IEEE 802.11b/g/n (1T1R) WIFI +Bluetooth
Bilian Approve Field
Engineer QC Sales
Customer Approve Field
Engineer QC Manufactory Purchasing
Shenzhen Bilian Electronic Co.，Ltd
Address: No 268,Fuqian Rd.,JuTang Community ,Guanlan Town,Baoan District, Shenzhen, 518110,PRC
Homepage: www.b-link.net.cn
0
Table of Contents
Revision History..................................................................................................................................................... 0
1. Introduction.........................................................................................................................................................1
1.1 General Description.......................................................................................................................... 1
1.2 Features................................................................................................................................................ 1
1.3 Applications........................................................................................................................................ 1
2. Functional Block Diagram..................................................................................................................................2
3. Product Technical Specifications........................................................................................................................ 2
3.1 General Specifications.................................................................................................................... 2
3.2 RF Specifications............................................................................................................................ 4
4. Pin Assignments..................................................................................................................................................5
5. Peripheral Schematic Reference Design............................................................................................................ 6
6. Mechanical Specifications..................................................................................................................................7
7. Others..................................................................................................................................................................8
7.1 Package Information.......................................................................................................................... 8
7.2 Storage Temperature and Humidity................................................................................................8
8. Typical Solder Reflow Profile............................................................................................................................8
Revision History
Date Document
Revision
Product
Revision
Description
/ 0.1 V0.1 Preliminary release
2017/05/21 1.0 V1.0 Officially released
1
1. Introduction
1.1 General Description
BL-M8723DU1 is a highly integrated single-chip 802.11n Wireless LAN (WLAN) USB2.0 Multi-Function
network interface controller with integrated Bluetooth 2.1//4.2 controller. It combines a WLAN MAC, a 1T1R
capable WLAN baseband, and RF in s single chip. The RTL8723DU provides a complete solution for a
high-performance integrated wireless and Bluetooth device. The integration provides better coordination
between 802.11 and Bluetooth, and with sophisticated dynamic power control and packet traffic arbitration,
RTL8723DU is able to provide the best coexistence performance Overview.
Top ViewFigure 1 Bottom ViewFigure 2
1.2 Features
Operating
Frequencies
:
BT:2.402~2.48GHz(BT)/WIFI:2.412~2.472GHz(USA 11Channels, Europe and others 13 channels)
Host Interface is USB, complies with USB 2.0
IEEE Standards : IEEE 802.11b/g/n
Wireless data rate can reach up to 150Mbps
Bluetooth controller complies with Bluetooth core specification V4.2
Connect to the external antenna through the half hole
Power Supply:3.3V±0.2V
1.3 Applications
MID
IP Camera
STB
Smart TV
E-book
Other devices which need to be supported by wireless network
11Channels, Europe and others 1
2
2. Functional Block Diagram
Figure 3 RTL8723DU block diagram
3. Product Technical Specifications
3.1 General Specifications
Item Description
Product Name BL-M8723DU1
Main Chip RTL8723DU-CG
Host Interface USB2.0
IEEE Standards IEEE 802.11b/g/n B T: Compatible with Bluetooth v2.1,v4.2 Systems
Operating Frequencies BT:2.402~2.48GHz(BT)/WIFI:2.412~2.472GHz(USA 11Channels, Europe and others 13 channels)
Modulation
WiFi:
802.11b:
CCK,
DQPSK,
DBPSK
802.11g:
64-QAM,16-QAM,
QPSK,
BPSK
3
802.11n: 64-QAM,16-QAM, QPSK, BPSK
B T:
8DPSK, π/4 DQPSK, GFSK
Working Mode Infrastructure, Ad-Hoc
Wireless Data Rate
WIFI:
802.11b: 1, 2 ,5.5,11
802.11g: 6,9,12,18,24,36,48,54
802.11n: MCS0~7，HT20 reach up to72.2Mbps, HT40 reach up to150Mbps
BT:
1 Mbps for Basic Rate
2,3 Mbps for Enhanced Data Rate
Rx Sensitivity WIFI:-94dBm (Min) BT: -89dBm (Min)
TX Power WIFI:16.93dBm
(Max)
BT:
4.85dBm
(Max)
Antenna Type Connect to the external antenna through the half hole
Dimension(L*W*H) (PCB) 12.2mm*12.9mm*0.8mm (L*W*H) ，Tolerance: ±0.15mm
Power Supply 3.3V±0.2V
Clock Source 40MHz
Working Temperature -10°C to +50°C
Storage Temperature -40°C to +70°C
ESD CAUTION:Although this module is designed to be as robust as possible, Electrostatic Discharge (ESD)
can damage this module. It must be protected from ESD at all times and handled under the protection of ESD.
3.2 DC Power Consumption
Vcc=3.3V，Ta= 25 °C，unit: mA
Supply current Typ. Max
Standby (RF disabled) 75 80
802.11b 1Mbps 11Mbps
Supply current Typ. Max. Typ. Max.
TX mode 320 330 285 300
Rx mode 89 90 90 92
802.11g 6Mbps 54Mbps
Supply current Typ. Max. Typ. Max.
TX mode 260 270 190 205
Rx mode 89 90 92 95
4
802.11n HT20 MCS0 MCS7
Supply current Typ. Max. Typ. Max.
TX mode 250 260 185 200
Rx mode 89 91 92 96
802.11n HT40 MCS0 MCS7
Supply current Typ. Max. Typ. Max.
TX mode 240 250 180 190
Rx mode 90 92 95 99
3.3 RF Specifications
TX Constellation Error(EVM)
802.11b: <-20dB@11Mbps
802.11g:<-28dB@54Mbps
802.11n-HT20: <-28dB@72.2Mbps
802.11n-HT40:< -28dB@150Mbps
Receiver Minimum Input Sensitivity@PER
1Mbps: -92dBm@PER<8%;
11Mbps:-85dBm@PER<8%;
54Mbps:-72dBm@PER<10%;
150Mbps:-66dBm@PER<10%;
BT: -89dBm@1Mbps -85dBm@2Mbps
-83dBm@3Mbps
5
4. Pin Assignments
Figure 4 Pin Assignments (Top view)
Pin No. Pin Name Description
1 GND Grond
2 RF-S0 WLAN/BT RF TX/RX signal port 0
3 RF-S1
4 GND Grond
5 BT_PCM_IN General Purpose Input/Output Pin
6 BT_PCM_OUT General Purpose Input/Output Pin
7 BT_PCM_SYNC General Purpose Input/Output Pin
8 BT_PCM_CLK General Purpose Input/Output Pin
9 BT_WAKE_HST Chip wakeup host
10 HST_WAKE_BT host wakeup Chip
11 VDD33 The power input 3.3V
WLAN/BT RF TX/RX signal port 1(No signal transmission)
6
12
DM
High-Speed USB D- Signal
12
DP
High-Speed USB D+ Signal
14
GND
Grond
15
N
No attributes
16
WL_DIS#
This Pin Can Externally Shutdown the RTL8723DU
WLAN function when WL_DISn is Pulled Low. When this pin
deasserted,USB interface will be disabled.
The WLAN Radio-off function with host interface
remaining connected.
17
BT_DIS#
This Pin Can Externally Shutdown the RTL8723DU
BT function when BT_DISn is Pulled Low. This pin can
also support the BT Radio-off function with host
interface remaining connected.
18
N
No attributes
19
HST_WAKE_WL
General Purpose Input/Output Pin
20
WL_WAKE_HST
General Purpose Input/Output Pin
21,22
N
No attributes
5. Peripheral Schematic Reference Design
Circuit reference pictures were designed
Note: 1.Pls reserve a “pi” circuit for antenna matching.
2. The RF circuit needs to keep 50 Ω impedance.
3. The USB differential pair needs to keep 90 Ω impedance.
4. reserved filter capacitance for 3.3 V power input
7
6. Mechanical Specifications
PCB Module dimension: Typical ( L*W * H): 12.2mm*12.9mm*0.8mm Tolerance : +/-0.15mm
Figure 5
Figure 6
8
7. Others
7.1 Package Information
Figure 7 Package Information
7.2 Storage Temperature and Humidity
Storage Condition: Moisture barrier bag must be stored under 30℃, humidity under 85% RH.
The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date.
Humidity indicator cards must be blue, <30%.
8. Typical Solder Reflow Profile
Figure 7
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