HP 5830AF-48G Series Assembly instructions

Product End-of-Life Disassembly Instructions

Product Category: Calculators

Marketing Name / Model

[List multiple models if applicable.]

HP 5830AF-48G Series Switch Chassis

（

JG316A

）

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Tool Description

Tool Size (if

applicable)

Screw driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.

2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.

3. Unscrew the screws on filler panel 3, and then remove filler panel 3.

4. Unscrew the screws on fan-assembly 4, and then remove fan-assembly 4.

5. Remove the filler panel 5.

6. Remove the power 6.

7. Unscrew the screws on top cover 10, and remove top cover 10.

8. Unscrew the screws on front panel 7, and then remove front panel 7.

9. Unscrew the screws on bracket 9, and then remove bracket 9.

10. Unscrew the screws on bracket 11, and then remove bracket 11.

11. Unscrew the screws on heat sink 12, and then remove heat sink 12.

12. Unscrew the screws on PCB 13, and remove PCB 13.

13. Remove all of the labels.

14. Remove film 4-8.

15. Unscrew the screws on 4-7, and then remove 4-7.

16. Unscrew the screws on 4-6, and then remove 4-6.

17. Unscrew the screws on 4-5, and then remove 4-5.

18. Unscrew the screws on 4-4, and then remove 4-4.

19. Unscrew the screws on pcb 4-9, and then remove 4-9.

20. Unscrew the screws on pulled handle 4-1, and then remove pulled handle 4-1.

21. Remove lamp 4-2.

22. Remove bushing 4-3.

23. Unscrew the screws on 5-1, and then remove 5-1.

24. Remove shielding finger 5-3.

25. Remove film 7-1.

26. Remove film 7-2.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 1Remove mounting angle Figure 2 Rear of HP S5810-52C-EI

Figure 3Treatments to the product Figure 4 Treatments to fan-assembly 4

Figure 5 Treatments to filler panel 5 Figure 6 Treatments to front panel 7

3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight

percentage

Selective treatment for

materials and components

Details

Chassis

1.2%

recycling

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

180

recycling

0.5%

recycling

4-1

0.4%

recycling

4-4

0.2%

recycling

4-5

PBT, Cu

580

9.4%

Pla

recycling

4-6

0.6%

recycling

4-7

0.7%

recycling

4-9

Complex

PWB

0.3%

The surface of PCB is

greater than 10

square centimeters

；

4-10

210

3.4%

5-4

100

1.6%

Fe,

Complex

PWB

1000

16.1%

7-3

361

5.8%

recycling

Complex

PWB

1620

26.2%

The surface of PCB is

greater than 10

square centimeters;

electrolyte capacitor

height is more than 25

0.22%

recycling

1766

28.5%

recycling

0.3%

recycling

0.1%

recycling

Complex

PWB

0.6%

The surface of PCB is

greater than 10

square centimeters;

electrolyte capacitor

height is more than 25

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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