YASKAWA SLIO User manual
IM | 053-1EC01 | Manual
HB300 | IM | 053-1EC01 | en | 22-30
System SLIO
Interface module EtherCAT - IM 053EC
053-1EC01_000_IM 053EC,7,EN - © 2022
YASKAWA Europe GmbH
Hauptstraße 185
65760 Eschborn
Germany
Tel.: +49 6196 569-300
Fax: +49 6196 569-398
Email: [email protected]
Internet: www.yaskawa.eu.com
Table of contents
1 General.................................................................................................................... 5
1.1 Copyright © YASKAWA Europe GmbH............................................................ 5
1.2 About this manual............................................................................................. 6
1.3 Safety information............................................................................................. 7
2 Basics and mounting............................................................................................. 8
2.1 Safety information for users.............................................................................. 8
2.2 System conception........................................................................................... 9
2.2.1 Overview........................................................................................................ 9
2.2.2 Components................................................................................................ 10
2.2.3 Accessories................................................................................................. 13
2.2.4 Hardware revision........................................................................................ 15
2.3 Dimensions..................................................................................................... 15
2.4 Mounting bus coupler..................................................................................... 18
2.5 Wiring............................................................................................................. 20
2.5.1 Wiring bus coupler....................................................................................... 20
2.5.2 Wiring 8x periphery modules....................................................................... 23
2.5.3 Wiring 16x periphery modules..................................................................... 25
2.5.4 Wiring power modules................................................................................. 26
2.6 Demounting.................................................................................................... 30
2.6.1 Demounting bus coupler.............................................................................. 30
2.6.2 Demounting 8x periphery modules.............................................................. 32
2.6.3 Demounting 16x periphery modules............................................................ 35
2.7 Trouble shooting - LEDs................................................................................. 38
2.8 Industrial security and installation guidelines................................................. 39
2.8.1 Industrial security in information technology................................................ 39
2.8.2 Installation guidelines.................................................................................. 41
2.9 General data for the System SLIO................................................................. 43
2.9.1 Use in difficult operating conditions............................................................. 45
3 Hardware description........................................................................................... 46
3.1 Properties....................................................................................................... 46
3.2 Structure......................................................................................................... 47
3.2.1 Interfaces..................................................................................................... 47
3.2.2 Address switch............................................................................................ 49
3.2.3 LEDs............................................................................................................ 49
3.3 Address area.................................................................................................. 50
3.4 Technical data................................................................................................. 51
4 Deployment........................................................................................................... 53
4.1 Basics EtherCAT............................................................................................ 53
4.1.1 General........................................................................................................ 53
4.1.2 EtherCAT State Machine............................................................................. 55
4.1.3 CoE - CANopen over Ethernet.................................................................... 56
4.1.4 EoE - Ethernet over EtherCAT.................................................................... 56
4.1.5 ESI files....................................................................................................... 56
4.2 Setting the HotConnect address..................................................................... 57
4.2.1 HotConnect via Explicit Device ID............................................................... 57
4.2.2 HotConnect via Configured Station Alias.................................................... 58
4.3 Operating Mode - Normal/Enhanced mode.................................................... 58
System SLIO Table of contents
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4.4 Synchronization modes.................................................................................. 59
4.5 Accessing the System SLIO........................................................................... 60
4.5.1 General........................................................................................................ 60
4.5.2 Accessing the I/O area in the master system.............................................. 60
4.5.3 Accessing the I/O area................................................................................ 61
4.5.4 Accessing parameter data........................................................................... 65
4.5.5 FMM - Free module mapping...................................................................... 66
4.5.6 Easy Maintenance....................................................................................... 72
4.5.7 Access to module information..................................................................... 74
4.5.8 Accessing diagnostics data......................................................................... 75
4.6 Accessing the web server via Ethernet ......................................................... 78
4.6.1 Web server.................................................................................................. 78
4.7 Data transfer via PDO and SDO..................................................................... 81
4.8 Variable PDO mapping via SDO..................................................................... 81
4.9 Object Dictionary............................................................................................ 82
4.10 Error handling............................................................................................. 105
4.10.1 Overview.................................................................................................. 105
4.10.2 Emergency error message...................................................................... 106
4.10.3 Standard error messages ....................................................................... 106
4.10.4 SDO error code....................................................................................... 108
4.11 Firmware update......................................................................................... 110
4.12 Replace EtherCAT slave 053-1EC00 with 053-1EC01............................... 111
Appendix............................................................................................................. 114
A History of changes........................................................................................... 116
System SLIO
Table of contents
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1 General
1.1 Copyright © YASKAWA Europe GmbH
This document contains proprietary information of Yaskawa and is not to be disclosed or
used except in accordance with applicable agreements.
This material is protected by copyright laws. It may not be reproduced, distributed, or
altered in any fashion by any entity (either internal or external to Yaskawa) except in
accordance with applicable agreements, contracts or licensing, without the express
written consent of Yaskawa and the business management owner of the material.
For permission to reproduce or distribute, please contact: YASKAWA Europe GmbH,
European Headquarters, Hauptstraße 185, 65760 Eschborn, Germany
Tel.: +49 6196 569 300
Fax.: +49 6196 569 398
Email: [email protected]
Internet: www.yaskawa.eu.com
Hereby, YASKAWA Europe GmbH declares that the products and systems are in compli-
ance with the essential requirements and other relevant provisions. Conformity is indi-
cated by the CE marking affixed to the product.
For more information regarding CE marking and Declaration of Conformity (DoC), please
contact your local representative of YASKAWA Europe GmbH.
SLIO and SPEED7 are registered trademarks of YASKAWA Europe GmbH.
EtherCAT is a registered trademark of Beckhoff Automation GmbH.
S7 is a registered trademark of Siemens AG.
All other trademarks, logos and service or product marks specified herein are owned by
their respective companies.
Every effort has been made to ensure that the information contained in this document
was complete and accurate at the time of publishing. We cannot guarantee that the infor-
mation is free of errors, and we reserve the right to change the information at any time.
There is no obligation to inform the customer about any changes. The customer is
requested to actively keep his documents up to date. The customer is always responsible
for the deployment of the products with the associated documentation, taking into
account the applicable directives and standards.
This documentation describes all hardware and software units and functions known
today. It is possible that units are described that do not exist at the customer. The exact
scope of delivery is described in the respective purchase contract.
Contact your local representative of YASKAWA Europe GmbH if you have errors or ques-
tions regarding the content of this document. You can reach YASKAWA Europe GmbH via
the following contact:
Email: [email protected]
All Rights Reserved
EC conformity declaration
Conformity Information
Trademarks
General terms of use
Document support
System SLIO General
Copyright © YASKAWA Europe GmbH
HB300 | IM | 053-1EC01 | en | 22-30 5
Contact your local representative of YASKAWA Europe GmbH if you encounter problems
or have questions regarding the product. If such a location is not available, you can reach
the Yaskawa customer service via the following contact:
YASKAWA Europe GmbH,
European Headquarters, Hauptstraße 185, 65760 Eschborn, Germany
Tel.: +49 6196 569 500 (hotline)
Email: [email protected]
1.2 About this manual
This manual describes the IM 053EC of the System SLIO.
nIt describes the structure, configuration and application.
nThe manual is targeted at users who have a background in automation technology.
nThe manual consists of chapters. Each chapter describes a completed topic.
nFor guidance, the manual provides:
– An overall table of contents at the beginning of the manual.
– References with pages numbers.
Validity of the documentation
Product Order no. as of state:
IM 053EC 053-1EC01 HW: 01 FW: V2.0.0
Important passages in the text are highlighted by following icons and headings:
DANGER!
Immediate or likely danger. Personal injury is possible.
CAUTION!
Damages to property is likely if these warnings are not heeded.
Supplementary information and useful tips.
Technical support
Objective and contents
Icons Headings
System SLIO
General
About this manual
HB300 | IM | 053-1EC01 | en | 22-30 6
1.3 Safety information
The system is constructed and produced for:
ncommunication and process control
ngeneral control and automation tasks
nindustrial applications
noperation within the environmental conditions specified in the technical data
ninstallation into a cubicle
DANGER!
This device is not certified for applications in
–in explosive environments (EX-zone)
The manual must be available to all personnel in the
nproject design department
ninstallation department
ncommissioning
noperation
CAUTION!
The following conditions must be met before using or commis-
sioning the components described in this manual:
– Hardware modifications to the process control system should only be
carried out when the system has been disconnected from power!
– Installation and hardware modifications only by properly trained per-
sonnel.
– The national rules and regulations of the respective country must be
satisfied (installation, safety, EMC ...)
National rules and regulations apply to the disposal of the unit!
Applications conforming
with specifications
Documentation
Disposal
System SLIO General
Safety information
HB300 | IM | 053-1EC01 | en | 22-30 7
2 Basics and mounting
2.1 Safety information for users
The modules make use of highly integrated components in MOS-Technology. These com-
ponents are extremely sensitive to over-voltages that can occur during electrostatic dis-
charges. The following symbol is attached to modules that can be destroyed by electro-
static discharges.
The Symbol is located on the module, the module rack or on packing material and it indi-
cates the presence of electrostatic sensitive equipment. It is possible that electrostatic
sensitive equipment is destroyed by energies and voltages that are far less than the
human threshold of perception. These voltages can occur where persons do not dis-
charge themselves before handling electrostatic sensitive modules and they can damage
components thereby, causing the module to become inoperable or unusable. Modules
that have been damaged by electrostatic discharges can fail after a temperature change,
mechanical shock or changes in the electrical load. Only the consequent implementation
of protection devices and meticulous attention to the applicable rules and regulations for
handling the respective equipment can prevent failures of electrostatic sensitive modules.
Modules must be shipped in the original packing material.
When you are conducting measurements on electrostatic sensitive modules you should
take the following precautions:
nFloating instruments must be discharged before use.
nInstruments must be grounded.
Modifying electrostatic sensitive modules you should only use soldering irons with
grounded tips.
CAUTION!
Personnel and instruments should be grounded when working on electro-
static sensitive modules.
Handling of electrostatic
sensitive modules
Shipping of modules
Measurements and altera-
tions on electrostatic sen-
sitive modules
System SLIO
Basics and mounting
Safety information for users
HB300 | IM | 053-1EC01 | en | 22-30 8
2.2 System conception
2.2.1 Overview
The System SLIO is a modular automation system for assembly on a 35mm mounting
rail. By means of the periphery modules with 2, 4, 8 and 16 channels this system may
properly be adapted matching to your automation tasks. The wiring complexity is low,
because the supply of the DC 24V power section supply is integrated to the backplane
bus and defective modules may be replaced with standing wiring. By deployment of the
power modules in contrasting colors within the system, further isolated areas may be
defined for the DC 24V power section supply, respectively the electronic power supply
may be extended with 2A.
System SLIO Basics and mounting
System conception > Overview
HB300 | IM | 053-1EC01 | en | 22-30 9
2.2.2 Components
nCPU (head module)
nBus coupler (head module)
nLine extension
n8x periphery modules
n16x periphery modules
nPower modules
nAccessories
CAUTION!
Only Yaskawa modules may be combined. A mixed operation with third-
party modules is not allowed!
With the CPU 01xC electronic, input/output components and power supply are integrated
to one casing. In addition, up to 64 periphery modules of the System SLIO can be con-
nected to the backplane bus. As head module via the integrated power module for power
supply CPU electronic and the I/O components are supplied as well as the electronic of
the periphery modules, which are connected via backplane bus. To connect the power
supply of the I/O components and for DC 24V power section supply of via backplane bus
connected periphery modules, the CPU has removable connectors. By installing of up to
64 periphery modules at the backplane bus, these are electrically connected, this means
these are assigned to the backplane bus, the electronic modules are power supplied and
each periphery module is connected to the DC 24V power section supply.
With this CPU 01x, CPU electronic and power supply are integrated to one casing. As
head module, via the integrated power module for power supply, CPU electronic and the
electronic of the connected periphery modules are supplied. The DC 24V power section
supply for the linked periphery modules is established via a further connection of the
power module. By installing of up to 64 periphery modules at the backplane bus, these
are electrically connected, this means these are assigned to the backplane bus, the elec-
tronic modules are power supplied and each periphery module is connected to the DC
24V power section supply.
CAUTION!
CPU part and power module may not be separated!
Here you may only exchange the electronic module!
CPU 01xC
CPU 01x
System SLIO
Basics and mounting
System conception > Components
HB300 | IM | 053-1EC01 | en | 22-30 10
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