Texas Instruments CC3000 User manual

TI CC3000 BoosterPack Evaluation Module

Board

User's Guide

Literature Number: SWRU331A

November 2012–Revised August 2014

Contents

Preface ........................................................................................................................................ 4

Revision History ........................................................................................................................... 5

1 Introduction......................................................................................................................... 6

2 CC3000 BoosterPack EVM Board........................................................................................... 7

2.1 BoosterPack EVM Board Top View ....................................................................................... 7

2.2 CC3000 BoosterPack EVM Board Bottom View......................................................................... 9

2.3 Antenna...................................................................................................................... 10

2.4 Hardware Setup ............................................................................................................ 13

2.5 CC3000 BoosterPack Schematic ........................................................................................ 14

2.6 Bill of Materials (BOM)..................................................................................................... 15

2.6.1 PCB Design Guidelines .......................................................................................... 15

2.6.2 RF Trace ........................................................................................................... 15

2.6.3 Antenna............................................................................................................. 16

2.6.4 Power Trace ....................................................................................................... 17

2.6.5 Ground.............................................................................................................. 17

3 Application Development .................................................................................................... 18

2Contents SWRU331A–November 2012–Revised August 2014

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List of Figures

2-1. BoosterPack EVM Board (Top View) ..................................................................................... 7

2-2. CC3000 BoosterPack EVM Board (Bottom View)....................................................................... 9

2-3. Antenna Location and RF Trace Routing ............................................................................... 10

2-4. Matching Circuit Between the Antenna and the CC3000 BoosterPack EVM Board .............................. 11

2-5. Return Loss From the ACX Antenna and Matching Circuit........................................................... 11

2-6. Antenna Radiation Pattern................................................................................................ 12

2-7. Host PCB Mating Connector Arrangement ............................................................................. 13

2-8. CC3000 BoosterPack Schematics....................................................................................... 14

2-9. Trace Design for PCB Layout ............................................................................................ 15

2-10. Antenna Layout Guidelines ............................................................................................... 16

2-11. Power Trace ................................................................................................................ 17

2-12. Ground Routing for the CC3000 BoosterPack EVM Board........................................................... 17

3-1. MSP-EXP430G2 Test Platform and CC3000 BoosterPack EVM Board............................................ 18

List of Tables

2-1. Key Parts of CC3000 BoosterPack EVM Board Top View............................................................. 7

2-2. J2 Configuration of the CC3000 EVM Board............................................................................. 8

2-3. Header J11 of the CC3000 BoosterPack EVM Board Top View...................................................... 8

2-4. Header J12 of the CC3000 BoosterPack EVM Board Top View...................................................... 8

2-5. Header J9 of the CC3000 BoosterPack EVM Board (Bottom View).................................................. 9

2-6. Header J10 of the CC3000 BoosterPack EVM Board (Bottom View)............................................... 10

2-7. LaunchPad to BoosterPack Pin Comparison........................................................................... 13

2-8. PCB Stack-Up Data........................................................................................................ 15

2-9. Trace Design Measurement Values ..................................................................................... 16

SWRU331A–November 2012–Revised August 2014 List of Figures

Preface

SWRU331A–November 2012–Revised August 2014

Read This First

About This Manual

This user guide describes how to use the TI CC3000 BoosterPack evaluation module (EVM) board to

evaluate the performance of the TI CC3000 module.

Related Documentation From Texas Instruments

•TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor Data Sheet (SWRS126)

•CC3000 wiki

If You Need Assistance

The primary sources of CC3000 information are the device-specific data sheets and user’s guides. For the

most up-to-date version of the user’s guide and data sheets, see the CC3000 module product page.

FCC Warning

This equipment is intended for use in a laboratory test environment only. It generates, uses, and can

radiate radio frequency energy and has not been tested for compliance with the limits of computing

devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable

protection against radio frequency interference. Operation of this equipment in other environments may

cause interference with radio communications, in which case the user at his own expense will be required

to take whatever measures may be required to correct this interference.

SimpleLink is a trademark of Texas Instruments.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

4Read This First SWRU331A–November 2012–Revised August 2014

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Revision History

Changes from Original (November 2012) to A Revision ................................................................................................ Page

• Changed wiki title in Related Documentation From Texas Instruments ........................................................... 4

• Changed link name in If You Need Assistance ....................................................................................... 4

• Changed wiki title in Table 2-2 .......................................................................................................... 8

• Changed typo in Table 2-6: name for pin 7 changed from WL_SPI_CLK, pin type changed from input, and description

changed from clock input............................................................................................................... 10

• Changed wiki title in Chapter 3 ........................................................................................................ 18

• Changed link name in Chapter 3 ...................................................................................................... 18

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

SWRU331A–November 2012–Revised August 2014 Revision History

Chapter 1

SWRU331A–November 2012–Revised August 2014

Introduction

This user's guide describes how to use the TI CC3000 BoosterPack EVM board to evaluate the

performance and functionality of the TI CC3000 module. The TI CC3000 module is a self-contained Wi-Fi®

solution that enables Internet connectivity for a wide variety of embedded applications. This document

details the key parts and features of the CC3000 BoosterPack EVM board along with the different options

available for the user and includes layout guidelines to assist in PCB development.

6Introduction SWRU331A–November 2012–Revised August 2014

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SWRU331-001

Chapter 2

SWRU331A–November 2012–Revised August 2014

CC3000 BoosterPack EVM Board

2.1 BoosterPack EVM Board Top View

Figure 2-1 shows the top view of the CC3000 BoosterPack EVM board.

Figure 2-1. BoosterPack EVM Board (Top View)

Table 2-1 describes the key parts and jumpers mounted on top of the CC3000 BoosterPack EVM board.

Table 2-1. Key Parts of CC3000 BoosterPack EVM Board Top View

Part Name Description

CC3000MOD Core module for performance evaluation. For more information, see the CC3000 module

datasheet (SWRS126).

Antenna Can be used for radiated testing by reworking the capacitor to correct pads

J1 U.FL RF connector used for conductive power tests

J2 Used to swap between test mode and operation mode. When pins 2 and 3 are shorted, J2 runs in

operation mode. When pins 1 and 2 are shorted, J2 runs in test mode.

J11 Through-hole test points (for more information, see Table 2-3)

J12 Through-hole test points (for more information, see Table 2-4)

J13 Used to switch between external power and power from the motherboard. Can be used for power

measurements. Connect pins 1 and 2 for power from the LaunchPad flash programmer and

debugging tool. Connect pins 2 and 3 for external power.

J14 DC jack for external power supply. If power is not supplied from the motherboard, ensure that

external power is applied.

SWRU331A–November 2012–Revised August 2014 CC3000 BoosterPack EVM Board

BoosterPack EVM Board Top View

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Table 2-2 describes the J2 configuration of the CC3000 EVM board.

Table 2-2. J2 Configuration of the CC3000 EVM Board

Mode Description

Test mode: CC3000 radio Connect pins 1 and 2. Test mode is used with the CC3000 radio tool to operate, test, and

tool(1) calibrate the CC3000 chipset designs during development. This tool uses the RS232/UART pins

to run radio frequency (RF) RX and TX tests on the CC3000 module. For more information, see

the CC3000 wiki.

Functional mode: Normal mode Connect pins 2 and 3. Normal mode is for regular functionality between the host platform and the

CC3000 module.

(1) For more information about test software for the PC, see the CC3000 wiki.

Table 2-3 describes the signals on J11.

Table 2-3. Header J11 of the CC3000 BoosterPack EVM Board Top View

Pin Pin Name Pin Type Descriptions

1 Reserved – Reserved

2 Reserved – Reserved

3 WL_RS232_TX Output RS232 transmit output; used for radio tool serial interface

in test mode. Leave floating in functional mode.

4 WL_RS232_RX Input RS232 receive output; used for radio tool serial interface

in test mode. Leave floating in functional mode.

Table 2-4 describes the signals on J12.

Table 2-4. Header J12 of the CC3000 BoosterPack EVM Board Top View

Pin Pin Name Pin Type Descriptions

1 GND – Ground

2 SCL_CC3000 Output I2C clock signal output from the CC3000 module. This pin

is connected to SCL_EEPROM through a 0-Ωresistor

and is not used by end users.

3 SCL__EEPROM Input I2C clock signal input from EEPROM inside the CC3000

module. This pin is connected to SCL_CC3000 using a

0-Ωresistor and is not used by end users.

4 SDA_CC3000 Input and output I2C data signal from the CC3000 module. This pin is

connected to SDA_EEPROM using a 0-Ωresistor and is

not used by end users.

5 SDA_EEPROM Input and output I2C data signal from EEPROM inside the CC3000

module. This pin is connected to SDA_CC3000 using a

0-Ωresistor and is not used by end users.

8CC3000 BoosterPack EVM Board SWRU331A–November 2012–Revised August 2014

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CC3000 BoosterPack EVM Board Bottom View

2.2 CC3000 BoosterPack EVM Board Bottom View

The two BoosterPack mating connectors (J9 and J10) connect to the host platform and mount to the

bottom of the BoosterPack EVM board, as shown in Figure 2-2.

Figure 2-2. CC3000 BoosterPack EVM Board (Bottom View)

Table 2-5 describes the signals on J9.

Table 2-5. Header J9 of the CC3000 BoosterPack EVM Board (Bottom View)

Pin Pin Name Pin Type Descriptions

1 VBAT_IN Power In Battery voltage input to module. For the MSP430 host

platform, VIO_HOST = VBAT_IN. For other platforms

that have different voltage levels from the battery

voltages, R14 can be removed.

2 VBAT_SW_EN Input Active-high enables signal from the host device

3 Reserved – Reserved

4 Reserved – Reserved

5 Reserved – Reserved

6 Reserved – Reserved

7 WL_SPI_CLK Input Host interface SPI clock input

8 Reserved – Reserved

9 Reserved – Reserved

10 Reserved – Reserved

SWRU331A–November 2012–Revised August 2014 CC3000 BoosterPack EVM Board

SWRU331-003

AT8010-E2R9HAA

Antenna

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Table 2-6 describes the signals on J10.

Table 2-6. Header J10 of the CC3000 BoosterPack EVM Board (Bottom View)

Pin Pin Name Pin Type Descriptions

1 GND – Ground

2 WL_SPI_IRQ Output Host interface SPI interrupt request

3 WL_SPI_CS Input Host interface SPI chip select

4 Reserved – Reserved

5 Reserved – Reserved

6 WL_SPI_DIN Input Host interface SPI data input

7 WL_SPI_DOUT Output Host interface SPI data output

8 Reserved – Reserved

9 Reserved – Reserved

10 Reserved – Reserved

2.3 Antenna

The ACX ceramic mounts on the BoosterPack EVM board with a specific layout and matching circuit for

the radiation tests conducted in FCC, CE, and IC certifications. Figure 2-3 shows the location of the ACX

ceramic antenna on the BoosterPack EVM board and the RF trace routing from the CC3000 module to the

antenna.

Figure 2-3. Antenna Location and RF Trace Routing

10 CC3000 BoosterPack EVM Board SWRU331A–November 2012–Revised August 2014

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