Telit Wireless Solutions HE920-NA Installation manual

HE920

Hardware User Guide

1vv0301014 Rev.9 –2014-01-23

HE920 Hardware User Guide

1vv0301014 Rev.9 –2014-01-23

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APPLICABILITY TABLE

PRODUCT

HE920-EU

HE920-NA

HE920 Hardware User Guide

1vv0301014 Rev.9 –2014-01-23

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit

assumes no liability resulting from any inaccuracies or omissions in this document, or from

use of the information obtained herein. The information in this document has been carefully

checked and is believed to be entirely reliable. However, no responsibility is assumed for

inaccuracies or omissions. Telit reserves the right to make changes to any products described

herein and reserves the right to revise this document and to make changes from time to time

in content hereof with no obligation to notify any person of revisions or changes. Telit does

not assume any liability arising out of the application or use of any product, software, or

circuit described herein; neither does it convey license under its patent rights or the rights of

others.

It is possible that this publication may contain references to, or information about Telit

products (machines and programs), programming, or services that are not announced in your

country. Such references or information must not be construed to mean that Telit intends to

announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be,

include or describe copyrighted Telit material, such as computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for

Telit and its licensors certain exclusive rights for copyrighted material, including the

exclusive right to copy, reproduce in any form, distribute and make derivative works of the

copyrighted material. Accordingly, any copyrighted material of Telit and its licensors

contained herein or in the Telit products described in this instruction manual may not be

copied, reproduced, distributed, merged or modified in any manner without the express

written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed

to grant either directly or by implication, estoppel, or otherwise, any license under the

copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a

product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual

may include copyrighted Telit and other 3rd Party supplied computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for

Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer

programs, including the exclusive right to copy or reproduce in any form the copyrighted

computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW

computer programs contained in the Telit products described in this instruction manual may

not be copied (reverse engineered) or reproduced in any manner without the express written

permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products

shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any

license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied

SW, except for the normal non-exclusive, royalty free license to use that arises by operation

of law in the sale of a product.

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Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is

furnished by express license agreement only and may be used only in accordance with the

terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is

prohibited by law. No part of the software or documentation may be reproduced, transmitted,

transcribed, stored in a retrieval system, or translated into any language or computer language,

in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT

fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control

equipment in the following hazardous environments requiring fail-safe controls: the operation

of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic

Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)

specifically disclaim any expressed or implied warranty of fitness for such High Risk

Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or

service names are the property of their respective owners.

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Contents

1. Introduction ................................................. 9

1.1. Scope ..................................................... 9

1.2. Audience .................................................. 9

1.3. Contact Information, Support .............................. 9

1.4. Document Organization .................................... 10

1.5. Text Conventions ......................................... 11

1.6. Related Documents ........................................ 11

2. General Product Description ................................. 12

2.1. Overview ................................................. 12

2.2. HE920 Mechanical Dimensions .............................. 13

2.3. Weight ................................................... 13

2.4. Environmental requirements ............................... 14

2.4.1. Temperature range .......................................... 14

2.4.2. RoHS compliance ............................................ 14

2.5. Operating Frequency ...................................... 14

3. HE920 Module Connections .................................... 16

3.1. PIN-OUT .................................................. 16

3.1.1. LGA Pads Layout ............................................ 23

4. Hardware Commands ........................................... 25

4.1. Turning ON the HE920 ..................................... 25

4.2. Initialization and Activation state ...................... 25

4.3. Turning OFF the HE920 .................................... 27

4.3.1. Shutdown by Software Command ............................... 28

4.3.2. Hardware Shutdown .......................................... 29

4.4. Hardware Unconditional Restart (RESET) ................... 30

4.5. Hardware Unconditional Shutdown (Power Off) .............. 31

4.6. Summary of Turning ON and OFF the module ................. 32

5. Power Supply ................................................ 33

5.1. Power Supply Requirements ................................ 33

5.2. General Design Rules ..................................... 35

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5.2.1. Electrical Design Guidelines ............................... 35

5.2.1.1. + 5V Input Source Power Supply Design Guidelines ........ 35

5.2.1.2. + 12V Input Source Power Supply Design Guidelines ....... 36

5.2.1.3. Battery Source Power Supply Design Guidelines ........... 38

5.2.2. Thermal Design Guidelines .................................. 39

5.2.3. Power Supply PCB Layout Guidelines ......................... 40

6. Antenna(s) .................................................. 42

6.1. GSM/WCDMA Antenna Requirements ........................... 42

6.2. GSM/WCDMA Antenna –PCB line Guidelines .................. 43

6.3. GSM/WCDMA Antenna –Installation Guidelines .............. 44

6.4. Antenna Diversity Requirements ........................... 44

6.5. GPS/GNSS Antenna Requirements ............................ 45

6.5.1. Combined GPS/GNSS Antenna .................................. 45

6.5.2. Linear and Patch GPS/GNSS Antenna .......................... 45

6.5.3. LNA and Front End Design Considerations .................... 45

6.5.4. GPS/GNSS Antenna - PCB Line Guidelines ..................... 47

6.5.5. GPS/GNSS Antenna –Installation Guidelines ................. 48

7. Logic Level Specifications .................................. 49

7.1. Reset Signal(Module Restart) ............................. 50

8. USB Port .................................................... 51

9. Serial Ports ................................................ 52

9.1. Modem Serial Port 1 ...................................... 53

9.2. Modem Serial Port 2 ...................................... 54

9.3. RS232 Level Translation .................................. 54

10. Audio Section Overview ...................................... 56

10.1. Analog Audio ........................................... 56

10.2. Digital Audio .......................................... 56

10.2.1. CODEC Example ............................................ 56

11. General Purpose I/O ......................................... 57

11.1. Logic Level Specifications ............................. 58

11.2. Using a GPIO Pad as Input .............................. 58

11.3. Using a GPIO Pad as Output ............................. 59

11.4. Using the Temperature Monitor Function ................. 60

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11.4.1. Short Description ........................................ 60

11.5. Indication of Network Service Availability ............. 60

11.6. RTC Bypass Out ......................................... 61

11.7. VAUX Power Output ...................................... 61

12. DAC and ADC section ......................................... 62

12.1. DAC Converter .......................................... 62

12.1.1. Description .............................................. 62

12.1.2. Enabling DAC ............................................. 62

12.1.3. Low Pass Filter Example .................................. 63

12.2. ADC Converter .......................................... 63

12.2.1. Description .............................................. 63

12.2.2. Using ADC Converter ...................................... 63

13. Mounting the module on your board ........................... 64

13.1. General ................................................ 64

13.2. Module Finishing & Dimensions .......................... 65

13.3. Recommended foot print for the application ............. 66

13.4. Stencil ................................................ 67

13.5. PCB Pad Design ......................................... 67

13.6. Recommendations for PCB Pad Dimensions (mm) ............ 68

13.7. Solder Paste ........................................... 70

13.7.1. Solder Reflow ............................................ 70

14. Application guide ........................................... 72

14.1. Debug of the HE920 in production ....................... 72

14.2. Bypass capacitor on Power supplies ..................... 73

14.3. SIM interface .......................................... 74

14.3.1. SIM schematic example .................................... 74

14.4. EMC recommendations .................................... 75

14.5. Download and Debug Port ................................ 76

15. Packing system .............................................. 77

15.1. Tray Drawing ........................................... 77

15.2. Moisture Sensibility ................................... 77

16. Conformity Assessment Issues ................................ 79

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16.1. 1999/5/EC Directive .................................... 79

16.2. FCC/IC Regulatory notices .............................. 81

17. Safety Recommendations ...................................... 83

18. Document History ............................................ 84

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1. Introduction

1.1. Scope

The aim of this document is the description of some hardware solutions useful for developing

a product with the Telit HE920-EU/NA module. All the features and solutions detailed are

applicable to all HE920, whereas “HE920” is intended the modules listed in the applicability

table.

When a specific feature is applicable to a specific product, it will be clearly highlighted.

1.2. Audience

This document is intended for Telit customers, who are integrators, about to implement their

applications using our HE920 module.

1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals,

contact Telit’s Technical Support Center (TTSC) at:

TS-[email protected]

TS-NORTHAMERIC[email protected]

TS-LATINAMERIC[email protected]

TS-[email protected]

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations

on accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s

Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and

suggestions for improvements.

Telit appreciates feedback from the users of our information.

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1.4. Document Organization

This document contains the following chapters:

Chapter 1: “Introduction” provides a scope for this document, target audience, contact and

support information, and text conventions.

Chapter 2: “General Product Description” gives an overview of the features of the product.

Chapter 3: “HE920 Module Connections” deals with the pin out configuration and layout.

Chapter 4: “Hardware Commands” How to control the module via hardware

Chapter 5: “Power Supply” deals on supply and consumption.

Chapter 6: “Antenna” The antenna connection and board layout design are the most important

parts in the full product design

Chapter 7: “Logic Level specifications” Specific values adopted in the implementation of

logic levels for this module.

Chapter 8: “USB Port”

Chapter 9: “Serial Ports”

Chapter 10: “Audio Section Overview”

Chapter 11: “General Purpose I/O” How the general purpose I/O pads can be configured.

Chapter 12 “DAC and ADC Section” Deals with these two kind of converters.

Chapter 13: “Mounting the module on your board”

Chapter 14: “Application Guides”

Chapter 15: “Packing System”

Chapter 16: “Conformity Assessments Issues”

Chapter 17: “Safety Recommendations”

Chapter 18: “Document History”

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