Telink FR1 PCB Design Guideline
AN-22051900-E1 Ver. 1.0.0
Table of Contents
Revision History ................................................................................................................................3
Table of Contents..............................................................................................................................4
List of Figures ...................................................................................................................................5
1. Overview ...................................................................................................................................6
2. Application Board Structure ID ...................................................................................................7
2.1 Single-layer board.................................................................................................................7
2.2 Doulbe-layer board ...............................................................................................................8
2.2.1 Component and copper wire layer + carbon film alignment layer ...........................................8
2.2.2 Component and copper wire layer + carbon film and copper wire layer...................................9
3. Key Points of FR1 Board Design................................................................................................ 10
3.1 Board layer ........................................................................................................................ 10
3.1.1 Board thickness selection ............................................................................................... 10
3.1.2 Introduction of board structure........................................................................................ 10
3.2 Carbon film routing ..............................................................................................................11
4. Layout Regulations................................................................................................................. 13
4.1 Package............................................................................................................................. 13
4.2 Solder pads and vias............................................................................................................ 13
4.3 Notes ................................................................................................................................ 15
5. Routing Notes........................................................................................................................ 18
