Sony D-E330 - Portable Cd Player User manual

D-E330/E331

SERVICE MANUAL

PORTABLE CD PLAYER

SPECIFICATIONS

Photo : D-E331

Model Name Using Similar Mechanism D-E350

CD Mechanism Type CDM-3125ER

Optical Pick-up Type DAX-25E

System

Compact disc digital audio system

Laser diode properties

Material: GaAlAs

Wavelength:λ =780 nm

Emission duration: Continuous

Laser output: Less than 44.6 µW (This output is the value measured

at a distance of 200 mm from the objective lens surface on the optical

pick-up block with 7 mm aperture. )

Error correction

Sony Super Strategy Cross Interleave Reed

Solomon Code

D-A conversion

1-bit quartz time-axis control

Frequency response

20 - 20 000 Hz +1

–5 dB (measured by JEITACP-307)

Output (at 4.5 V input level)

Headphones (stereo minijack)

Approx. 1 mW + approx. 1 mW at 16 Ω

Power requirements

For the area code of the model you purchased, check the upper left

side of the bar code on the package.

• Two LR6 (size AA) batteries: 3 V DC

•AC power adaptor (DC IN 4.5 V jack):

220 - 230 V, 50/60 Hz

Ver 1.0 2002.02

AEP Model

9-873-591-01

2002B0200-1

Sony Corporation

Personal Audio Company

Pubulished by Sony Engineering Corporation

Dimensions (w/h/d) (without projecting parts and controls)

Approx. 130.6 ×26.3 ×150.5 mm

(5 1

⁄4×11

⁄16 ×6 in.)

Mass (excluding accessories)

Approx. 190 g (6.8 oz)

Operating temperature

5°C - 35°C (41°F - 95°F)

Supplied accessories

For the area code of the model you purchased, check the upper left

side of the bar code on the package.

D-E330

Headphones/earphones (1)

D-E331

AC power adaptor (1)

Headphones/earphones (1)

Design and specifications are subject to change without notice.

Specifications ............................................................................ 1

1. SERVICING NOTES ................................................... 3

2. GENERAL

Locating the Controls......................................................... 3

3. DISASSEMBLY

3-1. Cabinet (Lower), MD ASSY ...................................... 4

3-2. Main Board ................................................................. 4

3-3. “Motor ASSY, Turn Table (Spindle) (M901)”............ 5

3-4. “Motor ASSY (Spindle) (M902)”,

Optical Pick-up (DAX-25E) ...................................... 5

4. ELECTRICAL ADJUSTMENS ............................... 6

5. DIAGRAMS

5-1. Explanation of IC Terminals....................................... 7

5-2. Block Diagram............................................................ 9

5-3. Printed Wiring Boards .............................................. 10

5-4. Schematic Diagram –MAIN SECTION (1/3)– ........11

5-5. Schematic Diagram –MAIN SECTION (2/3)– ....... 12

5-6. Schematic Diagram –MAIN SECTION (3/3)– ....... 13

6. EXPLODED VIEWS

6-1. Cabinet Section......................................................... 16

6-2. Optical pick-up Section (CDM-3125ER) ................. 17

7. ELECTRICAL PARTS LIST................................... 18

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE

WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE

PARTS LIST ARE CRITICALTO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE

PART NUMBERS APPEAR AS SHOWN INTHIS MANUAL OR IN

SUPPLEMENTS PUBLISHED BY SONY.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270°C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

TABLE OF CONTENTS

This Compact Disc player is

classified as a CLASS 1 LASER

product.

The CLASS 1 LASER

PRODUCT label is located on

the rear exterior.

CAUTION

Use of controls or adjustments or performance of procedures other

than those specified herein may result in hazardous radiation

exposure.

Laser component in this product is capable of emitting

radiation exceeding the limit for Class 1.

DANGER

Invisible laser radiation when open and interlock failed or defeated.

Avoid direct exposure to beam.

D-E330/E331

The laser diode in the optical pick-up block may suffer electrostatic

breakdown because of the potential difference generated by the charged

electrostatic load, etc. on clothing and the human body. During repair,

pay attention to electrostatic breakdown and also use the procedure in

the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the

disc reflective surface by the objective lens in the optical pick-up block.

Therefore, when checking the laser diode emission, observe from more

than 30cm away from the objective lens.

Before Replacing the Optical pick-up Block

Please be sure to check thoroughly the parameters as per the “Optical

pick-up Block Checking Procedure” (Part No. : 9-960-027-11) issued

separately before replacing the optical Pick-up block.

Note and specifications required to check are given below.

• FOK output : IC601 yg pin

When checking FOK, remove the lead wire to disc motor.

• RF signal P-to-P value : 0.45 to 0.65Vp-p

SECTION 1

SERVICING NOTES

Laser Diode Checking Methods

During normal operation of the equipment, emission of the laser diode

is prohibited unless the upper panel is closed while turning ON the S801

(push switch type).

The following two checking methods for the laser diode are operable.

Method :

Emission of the laser diode is visually checked.

1. Open the upper lid.

2. Push the S801 as shown in Fig. 1 .

3. Check the object lens for confirming normal emission of the laser

diode. If not emitting, there is a trouble in the automatic power

control circuit or the optical pick-up. During normal operation, the

laser diode is turned ON about 2.5 seconds for focus searching.

NOTES ON HANDLINGTHE OPTICAL PICK-UP BLOCK OR

BASE UNIT

Fig.1 Method to push S801

SECTION 2

GENERAL

LOCATINGTHE CONTROLS

This section is extracted from

instruction manual.

S801

HOLD .

VOL–VOL+SOUND

ESP

OPEN

DISPLAY

DC IN 4.5V

D-E330/E331

Cabinet (lower),

MD ASSY

Main board

“Motor ASSY, turn table (Spindle) (M901)”,

Optical pick-up (DAX-25E), “Motor ASSY (Sled) (M902)”

Set

SECTION 3

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

3-1. CABINET (LOWER), MD ASSY

3-2. MAIN BOARD

zThe equipment can be removed using the following procedure.

2Three screws (B2 x 10)

1OPEN

7CN501

8CN503 (white)

9CN502 (black)

5Claws

3Open the battery lid

5Claw

4Two screws (B2 x 10)

Cabinet (lower)

Cabinet (front)

MD ASSY

Lid upper

Main board

Cabinet (lower)

D-E330/E331

3-3.“MOTOR ASSY,TURNTABLE

(SPINDLE) (M901)”

3-4.“MOTOR ASSY (SLED) (M902)”,

OPTICAL PICK-UP (DAX-25E)

1Screw (B 1.7x5)

4Screw

(P 1.4x3.5)

Screw ASSY, Feed

Chassis

Optical pick-u

(DAX-25E)

Bracket (Shaft)

Gear B

Cover, Gear

Motor ASSY (Sled) (M902)

Motor ASSY, Turn tabl

(Spindle) (M901)

1Three screws (B1.7x5)

Chassis

D-E330/E331 SECTION 4

ELECTRICAL ADJUSTMENTS

The CD section adjustments are done automatically in this set.

Precautions for Check

1. Perform check in the order given.

2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise

indicated.

3. Power supply voltage requirement : DC4.5 V in DC IN jack.

(J401)

VOLUME button : Minimum

HOLD switch : OFF

Focus bias Check

Condition:

• Hold the set in horizontal state.

Connection:

Procedure:

1. Connect the oscilloscope to the test points TJ503(RFI) and TJ610

(VBIAS) on the MAIN board.

2. Set a disc. (YEDS-18)

3. Press the >B button.

4. Check the oscilloscope waveform is as shown below.

A good eye pattern means that the diamond shape (◊) in the cen-

ter of the waveform can be clearly distinguished.

RF Signal referenceWaveform (Eye Pattern)

To watch the eye pattern, set the oscilloscope to AC range and

increase the vertical sensitivity of the oscilloscope for easy

watch-ing.

5. Stop revolving of the disc motor by pressing the x button.

[MAIN BOARD] (SIDE B)

S801

(OPEN/CLO

C301

C619

C802

IC603

TP814

C106

R620

TAP806

C634

TJ502

R631

TJ608

TP817

TP609

TP616

R82

TP503

TJ303

C306

R209

TJ603

C203

TP507

TJ610

R205

TP603

TJ604

D801 TAP803

TJ405

TJ601

TJ602

TJ607

TAP805

TJ501

Q601

TJ503

TAP601

TP621

IC302

R109

C206

C610

R605

R107

D805

R617

R613

R614

R615

L601

HPLOUT

AVDD

AGND

RFI

AVDD

LASER

MON1

MON2

CLK4M

FOK

RF1

SCOR

XBUSY

C2POEN

VBIAS

OPSTB

RFGO

TJ610 (VBIAS)

TJ503(RFI)

oscilloscope

(AC range)

RF level

0.45 to 0.65 Vp-

VOLT/DIV : 100 mV (With the 10 : 1 probe in use)

TIME/DIV : 500ns

D-E330/E331

Pin No. Pin name I/O Description

SECTION 5

DIAGRAMS

5-1. EXPLANATION OF IC TERMINALS

IC801 (SYSTEM CONTROL)T5AW5-Z5-M1

1 GND – Ground terminal.

2 XIN I System clock input.

3 XOUT O Not used (OPEN).

4 TEST I Test mode terminal (FiXed to “L”).

5 VCPU – Power supply for CPU & I/O.

6 FOK_I I Focus OK signal input.

7 XBUSY_I I DSP’s auto sequencer status.

8 XRESET_I I/O Micon reset terminal.

9 XSTOP_I I Not used (FiXed to “L”).

10 DFCT CTRL O Not used (OPEN).

11 SCOR_I I SCOR pulse input.

12 HPSW_O O Headphone IC power switch.

13 DEFECT O DEFECT signal output (Not used).

14 XPOWLT_O O Power IC’s serial interface latch output.

15 R/XW_O O DSP’s serial interface Read/Write signal output.

16 MSDTI I Serial interface input.

17 MSDTO O Serial interface output.

18 SCK_O O Serial interface clock output.

19 AVCPU – Power supply for CPU and I/O.

20 VREFH – Analog reference voltage forA/D converter.

21 AD_SEL I Test mode detection input

22 AD_CHGMNT I Charging monitor input.

23 AD_KEY2 I Key input.

24 AD_BATMNT I Battery voltage monitor input.

25 AD_KEY I Set’s key detection input.

26 AD_RMKEY I Not used (OPEN).

27 AD_DCINMNT I DC voltage monitoring input.

28 XOPEN_I I OPEN switch status detection input.

29 P50 O Not used (OPEN).

30 BEEP_O O BEEP sound

31 TSB O Not used (OPEN).

32 VDD_EEPROM – Power supply for EEPROM (OPEN).

33 P44 O Not used (OPEN).

34 XNONCHG_I I Charging feature detection

35 P42 O Not used (OPEN).

36 FRANCE_I I France version detection input.

37 X4M/16M_I I DRAM size selection terminal (OPEN).

38 CMPON_I I ESP switch status detection input.

39 XTSB/PANA-HP O Not used (fixed at “L”) (OPEN).

40 HOLD_I I HOLD switch status detection input.

41 SEG15 O Not used (OPEN).

42-55 SEG1-14 O LCD segment output.

56 SEG0 O Not used (OPEN).

57-60 COM0-3 O LCD common output.

61-63 V1-3 – LCD driver booster.

64 C1 – LCD driver booster.

65 C0 – LCD driver booster.

D-E330/E331

Pin No. Pin name I/O Description

66 XWAKEUP_O O Wale-up signal output.

67 PGM STD0 – Not used (OPEN).

68 PGMSI_I – Not used (OPEN).

69 PGMSCK_O – Not used (OPEN).

70 P13 O Not used (OPEN).

71 GFS_I I Guard Frame Synchronous signal input.

72 ESPLT_O O ESP’s serial interface latch output.

73 PGMSEL_O – Not used (OPEN).

74 AMUTE_O O Mute ON/OFF control output.

75 VCC2ON_O O Not used (OPEN).

76 XRST_O O System reset output.

77 XPOFF_O O DSP’s power off output.

78 OPSTBY_O O Pick-up’s power supply ON/OFF control.

79 OPG4[_O O RF IC’s gain control.

80 C2POEN_O O C2PO enable.

D-E330/E331

5-2. BLOCK DIAGRAMS

88,87,85,84

1,2,24,25 5,9-12,14-18 23 3

90 83 89

CH3

BRIDGE

CH2

BRIDGE

CH1

BRIDGE

LEVEL

SHIFTER 49

35 24

OPTICAL

PICK-UP

BLOCK

(DAX-25E)

OPGSW

F+

F-

T+

T-

S+

S-

C+

C-

OPSTB

OP IC

FO1

RO2

FO2

RO3

FO3

RO1

FO4

RO4

36 VM12

40 VM2

41 VM3

26 VM34

FOCUS

COIL

TRACKING

COIL

M902

SLED

MOTOR

M901

SPINDLE

MOTOR M

F3 FIN+

FIN-

CPOL

CDUTY

FR4

PWM4

LEVEL

SHIFTER

I/F

F2 TIN+

TIN-

SIN+

SIN-

FIN+

FIN-

CPOL

CDUTY

TIN+

TIN-

SIN+

SIN-

LATCH

DATA

CLOCK

WAKEUP

FI1

RESET

XRST_O

SCOR_I

POFF_O

XBUSY_I

DEFECT_I

FOK_I

ESPLT_O

AD_BATMNT

BEEP_O

AMUTE_O

XIN_I

IC603 RAM(4M)

D0-3 A0-10

D0-D3

88,87,85,84

AO-A10

AD_CHG MNT

WP/AD,DSINMNT

BATN2

IC801

SYSTEM

CONTROL

MICON

XRAS

XCAS

XWE

XRAS

XCAS

XWE

42 - 55 57 - 60 28

SEG1

SEG14

COM0

COM3

LIQUID

CRYSTAL

DISPLAY

LCD801

WP/XOPEN

HOLD_I

CMPON_I

VCPU

WP/AD_KEY_1

AD-KEY_2

11 777 13 72 24

1415

SCGFS_I

7176

75 74 72 73 77 76 79 78 38 37 40 44 43 45 52 64 65 68 70 571

7430

7201917

15 R/XW_O

X POWLT_O

(SENS)MSDTI_I

MSDTO.O

SCK_O

XWAKEUP_O

XRESET_I

VBATT

OPG_O

XOPSTBY_O

HPSW_O

47 48 49 50

AMP

APC

SERVO CORE

PWM CLOCK

OSC

SIO

WINDOW

ECC ESP

OUT IN

IC403

+2V REG.

15 10

2 62

15 OUT IN

IC402

+2V REG.

52 OUT IN

IC405

RESET

54 OUT IN

CTRL

IC404

+5V REG.

DC IN 4.5V

J401

Q401

L401

REGBDC IN

D404

Q403

D402

D801

VBATT

SWITCGING

REG.

SWITCGING

REG.

DRY BATTERY

SIZE" AA"

(IEC DESIGNATION LR6)

2PCS,3V

RECHARGEABLE BATTERY

NC-WMAA/NH-WM2AA

2.4V

S801

DOOR

OPEN ON OFF

S807

S806

S811

S809

VOL+

> N SOUND VOL-

S808

S805 S810

S803

ESP

ON OFF

DEFFERNTIAL

Q402

VBATT

IC401(1/2)

FOCUS/TRACKING COIL DRIVE

SLED/SPINDLE MOTOR DRIVE

IC601

RF AMP,DIGITAL SERVO

DIGITAL SIGNAL PROCESSOR IC302

HEADPHONE AMP

IC401(2/2)

SWITCHING REGURATOR

CH4

BRIDGE

DAC

LOUT

LIN

RIN

BEEP

MUTE

PWRSW

LDACO

RDACO ROUT

VREF

VBATT

DRIVER

Q601

FDOP

FDON

CLVON

CLVOP

TDOP

TDON

SDOP

SDON

CLKDRV

XOUT

XIN

XRST

SBSY

XPWMN

XBUSY

FOK

DEFECT

YMLD

GFS

VCHK

X4M/8M

CLK4M

SCOK

SRW

SDIN

SDOUT

VBATT

AVDD+2V

VCC+2.2V

VCPU+2V

+3V

VCC1-OUT

VCC1-IN

STNG

VMMNT

VCPU

CHGMNT

Q405

GATE

VCPU+2V

AVDD+2V

VCC0

VIN

: CD PLAY

J301

X171

90MHz

S802

HOLD .

• Signal path

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