Sony XM-DS1300P5 Operating & Mounting User manual

SERVICE MANUAL

US Model

Canadian Model

XM-DS1300P5

MONAURAL POWER AMPLIFIER

Other Specifications

Circuit system Class D Technology

Pulse power supply

Inputs RCA pin jacks

High level input connector

Outputs Speaker terminals

Through out pin jacks

Suitable speaker impedance

2 – 8 Ω

Maximum outputs 400 W (at 4 Ω)

800 W (at 2 Ω)

Rated outputs (supply voltage at 14.4V)

200 W (20 Hz – 300 Hz, 0.2% THD, at 4 Ω)

400 W (20 Hz – 300 Hz, 0.6% THD, at 2 Ω)

Frequency response 5 – 300 Hz ( dB)

Harmonic distortion 0.06% or less (at 100 Hz, 4 Ω)

Input level adjustment range

0.3 – 6.0 V (RCA pin jacks)

1.2 – 12.0 V (High level input)

Sub-sonic filter 15 Hz, –12 dB/oct

Low-pass filter 50 – 300 Hz, –12 dB/oct

Low boost 0 – 10 dB (40 Hz)

Power requirements 12 V DC car battery

(negative ground)

Power supply voltage 10.5 – 16 V

Current drain at rated output : 50 A (at 2 Ω)

Remote input : 2 mA

Dimensions Approx. 295 ×57 ×290 mm

(11 5/8 ×2 1/4 ×11 1/2 in.) (w/h/d) not incl.

projecting parts and controls

Mass Approx. 2.8 kg (6 lb. 3 oz.) not incl. accessories

Supplied accessories Mounting screws (5)

High level input cord (1)

Protection cap (1)

Design and specifications are subject to change without

notice.

SPECIFICATIONS

AUDIO POWER SPECIFICATIONS (US MODEL)

POWER OUTPUTAND TOTAL HARMONIC DISTORTION

200 watts minimum continuous average power into 4 ohms,

20 Hz to 300 Hz with no more than 0.2% total harmonic

distortion per Car Audio Ad Hoc Committee standards.

+0.5

–3

Notes on Chip Component Replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Ver 1.0 2003. 12

Sony Corporation

e Vehicle Company

Published by Sony Engineering Corporation

9-961-897-01

2003L04-1

TABLE OF CONTENTS

1. GENERAL

Location and Function of Controls.......................................... 3

Connections ............................................................................. 4

2. DISASSEMBLY

2-1. Bottom Plate ........................................................................ 6

2-2. Main Board Section ............................................................. 7

2-3. Disassembly and Assembly of Ornamental Plate ................ 7

2-4. Main Board .......................................................................... 8

2-5. LED Board ........................................................................... 8

3. DIAGRAMS

3-1. IC Block Diagram................................................................ 9

3-2. Printed Wiring Boards –Main Section (1/2)– .................... 10

3-3. Printed Wiring Boards –Main Section (2/2)– .................... 11

3-4. Schematic Diagram –Main Section (1/2)– ........................ 12

3-5. Schematic Diagram –Main Section (2/2)– ........................ 13

4. EXPLODED VIEWS

4-1. Heat Sink (Main) Section .................................................. 15

4-2. Main Board Section ........................................................... 16

5. ELECTRICAL PARTS LIST......................................... 17

XM-DS1300P5

SECTION 1

GENERAL This section is extracted

from instruction manual.

XM-DS1300P5

XM-DS1300P5 SECTION 2

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. BOTTOM PLATE

Note : This set can be disassemble according to the following sequence.

2-1. BOTTOM PLATE

(Page 6)

2-2. MAIN BOARD SECTION

(Page 7)

2-5. LED BOARD

(Page 8)

SET

2-4. MAIN BOARD

(Page 8) 2-3. DISASSMBLY AND ASSEMBLY

OF ORNAMENTAL PLATE

(Page 7)

bottom plate

insulating sheet

five

screws

(+P 3

three

screws

(+P 3

XM-DS1300P5

2-3. DISASSEMBLY AND ASSEMBLY OF ORNAMENTAL PLATE

2-2. MAIN BOARD SECTION

heat sink (main)

CNT2

MAIN board section

three

screws

(+BTP 3

14)

three

screws

(+BTP 3

14)

three

screws

(+BTP 3

14)

screw

(+P 3

screw

(+P 3

heat sink (main)

At disassembly:

At assembly:

ornamental plate

cut

welding

heat sink (main)

ornamental plate

XM-DS1300P5

2-4. MAIN BOARD

2-5. LED BOARD

panel (front)

MAIN board

two

screws

(+P 3

screw

(+P 3

LED board

heat sink (main

)

screw

(+P 3

XM-DS1300P5

3-1. IC BLOCK DIAGRAM

IC6 TL494CN

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS

AND SCHEMATIC DIAGRAMS.

(In addition to this, the necessary note is

printed in each block.)

for schematic diagram:

Note:

•All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolytics

and tantalums.

•All resistors are in Ωand 1/4W or less unless otherwise

specified.

•%: indicates tolerance.

•2: nonflammable resistor.

SECTION 3

DIAGRAMS

Caution:

Pattern face side: Parts on thepatternfaceside seenfrom the

(Side B) pattern face are indicated.

Parts face side: Parts on the parts face side seen from the

(Side A) parts face are indicated.

OSC

REF 5V

ERROR

0.1V

16 15 14 13 12 11 10 9

1 2 3 4 5 6 7 8

NON

INV

VREF

VCC

OUT

+IN

-IN

COMP EN

GND

TIME

Note:

The components identi-

fied by mark 0or dotted

linewithmark0are criti-

cal for safety.

Replace only with part

number specified.

Note:

Lescomposantsidentifiéspar

une marque 0sont critiques

pour la sécurité.

Ne les remplacer que par une

piéce portant le numéro

spécifié.

•A: B+ Line.

•B: B– Line.

•Total current is measured with no-signal condition.

•Powervoltage is dc 14.4V and fed with regulated dc power

supply from +12V and REM terminals.

•Voltage is dc with respect to ground under no-signal

condition.

•Voltages are taken with aVOM (Inputimpedance 10 MΩ).

Voltage variations may be noted due to normal produc-

tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc-

tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

F:AUDIO

for printed wiring boards:

Note:

•X: parts extracted from the component side.

•: Pattern from the side which enables seeing.

(The other layer’s patterns are not indicated.)

10 10

XM-DS1300P5

3-2. PRINTED WIRING BOARDS — MAIN SECTION (1/2) — • Refer to page 9 for Common Note on Printed Wiring Boards.

23456789101112

MAIN BOARD (SIDE A)

BCE

1-861-420-

(11)

BCE

ECB

BCE

ECB

BCE

ECB

ECBECBECB

814

ECB

BCE BCE

LED BOARD

(SIDE A)

1-861-421-

(11)

(POWER)

(PROTECTOR)

POWER/PROTECTOR

R139

R93

R88

RG2

RG1

R95

R94

R92

C44

R90

C33

C10

R89

C37

C32

R71

R86

C34

R91

R140

R83

R58

R81

R54

C35

C31

R77

R67

R68

R78

R75R74

R80

R57

R56

R51

R50

C2 C58 C1

R63

C56

RS2

R20

R27

R143

CF1

R65

RS3

RS5

R15

R16

RS4

R13

MC1

C59

R28

C57

R103

R170

R72

R181

R82

R182

R106

R180

C36

R55 R165

R175R168

R76

R104

R85

R167

R149

R96

THR1

C38

R137

R178

R153

C45R154

R126 R105

R97

R173

R172

R161

R130

R127

C47

R184 R183

R131

R129

R128

R108

C40

C41

R125

R132

R186 R185 R136

R164

R163

R155

R157

R134

R123

RG7

RG8

THR3

R169

R109

R171

R174

R162

R160

R69

R70 C6 R79

C14

C12

R23

R14

R35 R25

R24

C13

C42

R73

R113

R116

R121

R118

R117

RG10

RG9

R122

R114

R115

R112

R111

R110

R119

R66

R64

R29

R19

R12

IC4

C22

R158

R156

C21

R159

R2 R4

RS1

R43

R11 C55

C50 C53

C28

C27

C29

C30

R61R62

R18

C43

C16

C19

RG6

RG5

RG4

RG3

R17

C51

R10

C52

R52

R60

R53 C15

R59

C20

R151

R150

D26

R141

R142

R102

R99

R100

Q44

Q5 Q6

Q46

Q36

Q34

Q10

Q35

Q16

Q45

Q13

Q11

Q40

Q39

D11

Q43 D17

Q42

Q41

Q17

Q14

IC3

IC1

IC5

IC2

IC7

IC8

R166

R138

LED2

LED3

D3 F-6

D9 E-4

D11 G-4

D17 G-6

D26 G-6

IC1 F-3

IC2 F-3

IC3 F-3

IC4 E-2

IC5 G-4

IC7 G-6

IC8 H-6

LED2 F-11

LED3 F-12

Q5 E-4

Q6 E-4

Q7 G-5

Q8 G-5

Q9 G-5

Q10 H-6

Q11 G-6

Q13 E-8

Q14 G-6

Q16 F-6

Q17 H-7

Q34 I-6

Q35 I-7

Q36 H-6

Q39 G-6

Q40 G-6

Q41 H-6

Q42 H-6

Q43 G-6

Q44 F-6

Q45 G-7

Q46 E-2

• Semiconductor

Location (Side A)

Ref. No. Location

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