Sony XM-502X User manual

US Model

Canadian Model

AEP Model

UK Model

E Model

STEREO POWER AMPLIFIER

XM-502X

SERVICE MANUAL

Circuit system OTL (output transformerless) circuit

Pulse power supply

Inputs RCA pin jacks

High level input connector

Outputs Speaker terminals

Through out pin jacks

Speaker impedance 2 - 8 ohms (stereo)

4 - 8 ohms (when used as a bridging

amplifier)

Maximum outputs 100 watts per channel (at 4 ohms)

260 watts (monaural) at 4 ohms

Rated outputs (supply voltage at 14.4V)

50 watts per channel (20 Hz -

20 kHz, 0.04 % THD, at 4 ohms)

65 watts per channel (20 Hz -

20 kHz, 0.1 % THD, at 2 ohms)

130 watts (monaural) (20 Hz -

20 kHz, 0.1 % THD, at 4 ohms)

Frequency response 5 Hz - 100 kHz ( dB)

Harmonic distortion 0.005 % or less

(at 1 kHz, 4 ohms)

Input level adjustment range

0.2 - 4.0 V (RCA pin jacks)

0.4 - 8.0 V (High level input)

SPECIFICATIONS

High-pass filter 50 - 200 Hz, –12 dB/oct

Low-pass filter 50 - 200 Hz, –12 dB/oct

Low boost 0 - 10 dB (40 Hz)

Power requirements 12 V DC car battery

(negative ground)

Power supply voltage 10.5 - 16 V

Current drain at rated output: 15 A

Remote input: 2 mA

Dimensions Approx. 258 ×55 ×182 mm

(10 1/4 ×2 3/8 ×7 1/4 in.)

(l/h/p) not incl. projecting parts and

controls

Mass Approx. 1.9 kg (4 lb. 3 oz.)

not incl. accessories

Supplied accessories Mounting screws (4)

High level input cord (1)

Protect cover (1)

Design and specifications are subject to change without

notice.

–3

Ver 1.1 2001. 08

Sony Corporation

e Vehicle Company

Shinagawa Tec Service Manual Production Group

9-925-591-12

2001H0400-1

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location and Function of Controls......................................... 3

Connections ............................................................................ 4

2. DISASSEMBLY

2-1. Bottom Plate....................................................................... 6

2-2. Panel (Front)....................................................................... 6

2-3. Amplifier Board ................................................................. 7

2-4. Filter Board ........................................................................ 7

3. DIAGRAMS

3-1. Block Diagram ................................................................... 8

3-2. Printed Wiring Boards...................................................... 10

3-3. Schematic Diagram .......................................................... 13

4. EXPLODED VIEWS

4-1. Amplifier Board Section .................................................. 17

4-2. Filter Board Section ......................................................... 18

5. ELECTRICAL PARTS LIST ................................... 19

Notes on Chip Component Replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

SECTION 2

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. BOTTOM PLATE

2-2. PANEL (FRONT)

BTP 3x6

bottom plate

fuse (25 A)

BTP 3x8

panel (front)

BTP 3x8

– 7 –

2-3. AMPLIFIER BOARD

BTP 3x8

BTP 3x5

BTP 3x10

AMPLIFIER board

BTP 3x10

BTP 3x8

BTP 3x5

FILTER board

BTP 3x5

2-4. FILTER BOARD

connectors

Table of contents

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