Sony XM-502X User manual

Table of contents

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STEREO POWER AMPLIFIER

XM-502X

SERVICE MANUAL

Circuit system OTL (output transformerless) circuit

Pulse power supply

Inputs RCA pin jacks

High level input connector

Outputs Speaker terminals

Through out pin jacks

Speaker impedance 2 - 8 ohms (stereo)

4 - 8 ohms (when used as a bridging

amplifier)

Maximum outputs 100 watts per channel (at 4 ohms)

260 watts (monaural) at 4 ohms

Rated outputs (supply voltage at 14.4V)

50 watts per channel (20 Hz -

20 kHz, 0.04 % THD, at 4 ohms)

65 watts per channel (20 Hz -

20 kHz, 0.1 % THD, at 2 ohms)

130 watts (monaural) (20 Hz -

20 kHz, 0.1 % THD, at 4 ohms)

Frequency response 5 Hz - 100 kHz ( dB)

Harmonic distortion 0.005 % or less

(at 1 kHz, 4 ohms)

Input level adjustment range

0.2 - 4.0 V (RCA pin jacks)

0.4 - 8.0 V (High level input)

SPECIFICATIONS

High-pass filter 50 - 200 Hz, –12 dB/oct

Low-pass filter 50 - 200 Hz, –12 dB/oct

Low boost 0 - 10 dB (40 Hz)

Power requirements 12 V DC car battery

(negative ground)

Power supply voltage 10.5 - 16 V

Current drain at rated output: 15 A

Remote input: 2 mA

Dimensions Approx. 258 ×55 ×182 mm

(10 1/4 ×2 3/8 ×7 1/4 in.)

(l/h/p) not incl. projecting parts and

controls

Mass Approx. 1.9 kg (4 lb. 3 oz.)

not incl. accessories

Supplied accessories Mounting screws (4)

High level input cord (1)

Protect cover (1)

Design and specifications are subject to change without

notice.

+0

–3

Ver 1.1 2001. 08

Sony Corporation

e Vehicle Company

Shinagawa Tec Service Manual Production Group

9-925-591-12

2001H0400-1

© 2001. 8

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location and Function of Controls......................................... 3

Connections ............................................................................ 4

2. DISASSEMBLY

2-1. Bottom Plate....................................................................... 6

2-2. Panel (Front)....................................................................... 6

2-3. Amplifier Board ................................................................. 7

2-4. Filter Board ........................................................................ 7

3. DIAGRAMS

3-1. Block Diagram ................................................................... 8

3-2. Printed Wiring Boards...................................................... 10

3-3. Schematic Diagram .......................................................... 13

4. EXPLODED VIEWS

4-1. Amplifier Board Section .................................................. 17

4-2. Filter Board Section ......................................................... 18

5. ELECTRICAL PARTS LIST ................................... 19

Notes on Chip Component Replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

SECTION 2

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. BOTTOM PLATE

2-2. PANEL (FRONT)

1

BTP 3x6

2

BTP 3x6

3

bottom plate

1

fuse (25 A)

2

BTP 3x8

4

panel (front)

3

BTP 3x8

– 7 –

2-3. AMPLIFIER BOARD

2

BTP 3x8

5

BTP 3x5

4

BTP 3x10

6

AMPLIFIER board

3

BTP 3x10

1

BTP 3x8

2

BTP 3x5

3

FILTER board

1

BTP 3x5

2-4. FILTER BOARD

connectors