SimCom SIM300DZ Instruction Manual

SMT Guidelines

Module de-soldering and rework_UGD_V1.01

SMT module de-soldering and rework Guidelines

Module de-soldering and rework _UGD_V1.01 07.12.2009

Document Title: SMT module de-soldering and rework Guidelines

Version: 1.01

Date: 2008-12-07

Status: Release

Document Control ID: Module de-soldering and rework _UGD_V1.01

General Notes

Simcom offers this information as a service to its customers, to support application and

engineering efforts that use the products designed by Simcom. The information provided is

based upon requirements specifically provided to Simcom by the customers. Simcom has not

undertaken any independent search for additional relevant information, including any

information that may be in the customer’s possession. Furthermore, system validation of this

product designed by Simcom within a larger electronic system remains the responsibility of

the customer or the customer’s system integrator. All specifications supplied herein are

subject to change.

This document contains proprietary technical information which is the property of SIMCOM

Limited., copying of this document and giving it to others and the using or communication of

the contents thereof, are forbidden without express authority. Offenders are liable to the

a utility model or design. All specification supplied herein are subject to change without

notice at any time.

SMT module de-soldering and rework Guidelines

Module de-soldering and rework _UGD_V1.01 07.12.2009

Contents

Version history..................................................................................................................................5

1 Scope of the document...................................................................................................................6

2 Manual soldering tools...................................................................................................................7

2.1 Manual soldering tools introduction.....................................................................................7

3 Preparation before manual soldering .............................................................................................8

4 Manual de-soldering process .........................................................................................................9

4.1 PCBA with Single side components placement ...................................................................9

4.2 PCBA with both sides components placement.....................................................................9

5 Basic considerations for manual de-soldering .............................................................................12

SMT module de-soldering and rework Guidelines

Module de-soldering and rework _UGD_V1.01 07.12.2009

List of Figures

FIGURE 1: MANUAL SOLDERING TOOLS.............................................................................................7

FIGURE 2: CUSTOMIZED SQUARE HOTAIR TIP....................................................................................7

FIGURE 3: HOLDING IN REVERSE .......................................................................................................8

FIGURE 4: DE-SOLDERING WITH PREHEATER .....................................................................................9

FIGURE 5: HEATING THE MODULE WITH HOT AIR SOLDERING GUN .................................................10

FIGURE 6: CHECK WHETHER THE SOLDER IS MOLTEN ......................................................................10

FIGURE 7: REMOVE THE HOT AIR SOLDERING GUN..........................................................................10

FIGURE 8: PICK UP THE MODULE WITH A PAIR OF TWEEZERS ...........................................................11

FIGURE 9: COOL DOWN .................................................................................................................11

SMT module de-soldering and rework Guidelines

Module de-soldering and rework _UGD_V1.01 07.12.2009

Version history

Date Version Description of change Author

2008-12-07 01.01 Origin

SMT module de-soldering and rework Guidelines

Module de-soldering and rework _UGD_V1.01 07.12.2009

1 Scope of the document

This document is intended for the following versions of the SIMCom modules:

•SIM300DZ

•SIM340DZ

•SIM300W

•SIM340W

•SIM700D

SMT module de-soldering and rework Guidelines

2 Manual soldering tools

2.1 Manual soldering tools introduction

NO Manual soldering tools type

1 HAKKO 850 Hot air soldering gun 220~300W 50/60Hz

2 Surface thermometer

3 Customized square hot air tip

4 Tweezers

5 Anti Electrostatic discharge wristband

6 Smoke absorber HAKKO 493

7 Repairing board cradle

8 PCB pre-heater

Figure 1: Manual soldering tools

Figure 2: Customized square hot air tip

Module de-soldering and rework _UGD_V1.01 07.12.2009

SMT module de-soldering and rework Guidelines

3 Preparation before manual soldering

zAssemble the customized square hot air tip on to the HAKKO850 and tighten the screw to

assure it is immovably.

zPower on the hot air soldering gun and the smoke absorber, keep a distance about 15cm

between the smoke absorber and PCBA.

zIt is recommended to set the temperature of the hot air to about 400℃ ± 20℃, the volume

of the air flow to 4.5 ± 0.5.

zCaution should be taken for the ESD protection. The operator should take the anti

electrostatic discharge wristband for avoiding damage by static discharge when contact to the

components on PCBA.

zIf there are some big size DIP package components nearby the SIM300DZ module such as

electrolytic capacitors, potentiometers which intervenes the SIM300DZ module to be heating

by hot air soldering gun. They can be removed by soldering iron in advance. In addition, if

some components are not heat resistant, they can be screened from the hot air.

zThe correct posture of holding the hot air soldering gun by hand is shown as following figure

Figure 3: Holding in reverse

Module de-soldering and rework _UGD_V1.01 07.12.2009

SMT module de-soldering and rework Guidelines

4 Manual de-soldering process

Recommended operation for manual de-soldering:

zHot air heating the pads of the SIM300DZ module

zCheck whether the solder is molten

zRemove the nozzle of the hot air soldering gun and remove the SIM300DZ module with a

pair of tweezers

zPut the SIM300DZ module on the smoke absorber for cooling down

4.1 PCBA with Single side components placement

If the PCBA is designed with single side placement, it is recommended to preheat the bottom of

the PCBA. Course of preheating the PCBA can permits lower soldering reflow temperature and

reduces thermal stresses to the PCB substrate when localized reflow is made with hot air nozzle.

The illumination of the operation for manual de-soldering:

zFix the position of the PCBA on the adjustable board cradle

zPreheating the PCBAwith the temperature about 150℃

zhandle the hot air soldering gun and take equably heating to the pads of the SIM300DZ

module

Hot air soldering gun

SIM300D module

Make example for PCBA

PCB preheater

Figure 4: De-soldering with preheater

4.2 PCBA with both sides components placement

If the PCBA is designed with both sides placement, it is recommended to change the soldering tip

for customized square hot air nozzle for heating with a pair of tweezers.

The illumination of the operation for manual de-soldering:

zHandle the hot air soldering gun, make the square nozzle cover the SIM300DZ module and

Module de-soldering and rework _UGD_V1.01 07.12.2009

SMT module de-soldering and rework Guidelines

take equably heating to the pads of the module for 2 or 3 minutes to melt the solder

Make the hot air

soldering gun is

held vertically

to the PCBA

Assure the square

nozzle can totally

cove the module

Figure 5: Heating the module with hot air soldering gun

zCheck whether the solder is molten.

Figure 6: check whether the solder is molten

Check whether the

solder is molten

with the tweezee

zOn the condition of the solder is molten, remove the hot air soldering gun reposefully and

vertically. Care should be taken that the pads of module and other components are not

damaged during remove the hot air soldering gun.

Figure 7: Remove the hot air soldering gun

zAt the moment when the solder on all pad is molten, the module can be removed by a pair of

tweezers. Firstly, insert one tip of the tweezers into the gap between module and the PCBA,

then pick up the module carefully.

Module de-soldering and rework _UGD_V1.01 07.12.2009

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