Samsung DDR3 User manual

October 2009

General Information DDR3 SDRAM

DDR3 SDRAM Product Guide

October 2009

Memory Division

October 2009

General Information DDR3 SDRAM

1. DDR3 SDRAM Component Ordering Information

51 :512Mb

1G :1Gb

2G : 2Gb

4G : 4Gb

04 : x 4

08 : x 8

16 :x16

3 :4 Banks

4 :8 Banks

5 :16 Banks

3. DRAM Type

4. Density

5. Bit Organization

6. # of Internal Banks

9. Package Type

8. Revision

10. Temp & Power

1. SAMSUNG Memory : K

2. DRAM : 4

Revision

# of Internal Banks

Bit Organization

Density

DRAM Type

DRAM

SAMSUNG Memory

Interface (VDD, VDDQ)

Package Type

Temp & Power

1 2 3 4 5 6 7 8 9 10 11

Speed

B :DDR3 SDRAM

:Commercial Temp.( 0°C ~ 85°C) & Normal Power

: Commercial Temp.( 0°C ~ 85°C) & Low Power

: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

:FBGA (Lead-free)

:FBGA (Halogen-free & Lead-free)

:FBGA (Lead-free, DDP)

:FBGA (Halogen-free & Lead-free, DDP)

:1st Gen.

: 2nd Gen.

: 3rd Gen.

:4th Gen.

:5th Gen.

:6th Gen.

:7th Gen

:8th Gen

:9th Gen

11. Speed

K4 B X X X X X X X - X X X X

: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

6 : SSTL (1.5V, 1.5V)

7. Interface ( VDD, VDDQ)

October 2009

General Information DDR3 SDRAM

2. DDR3 SDRAM Component Product Guide

* Note : 1.35V product is 1.5V operatable.

Density Banks Part Number Package & Power,

Temp. (-C/-L) & Speed Org. VDD Voltage PKG Avail. Note

1Gb D-die 8Banks

K4B1G0446D HC(L)F7/F8/H9 256M x 4

1.5V

78 + 4 ball

FBGA

Now

K4B1G0846D HC(L)F7/F8/H9 128M x 8

K4B1G1646D HC(L)F7/F8/H9 64M x 16 96 + 4 ball

FBGA

1Gb E-die 8Banks

K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4

1.5V

78 ball

FBGA

Now

K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8

K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16 96 ball

FBGA

K4B1G0446E HYF7/F8/H9/K0 256M x 4

1.35V 78 ball

FBGA

K4B1G0846E HYF7/F8/H9/K0 128M x 8

1Gb F-die 8Banks

K4B1G0446F HC(L)F8/H9 256M x 4 1.5V

78 ball

FBGA Now

K4B1G0846F HC(L)F8/H9 128M x 8

K4B1G0446F HY(L)F8/H9 256M x 4 1.35V

K4B1G0846F HY(L)F8/H9 128M x 8

2Gb B-die 8Banks

K4B2G0446B HC(L)F7/F8/H9 512M x 4

1.5V

78 ball

FBGA

Now

K4B2G0846B HC(L)F7/F8/H9 256M x 8

K4B2G1646B HC(L)F7/F8/H9 128M x 16 96 ball

FBGA

K4B2G0446B HYF7/F8/H9 512M x 4 1.35V 78 ball

FBGA

K4B2G0846B HYF7/F8/H9 256M x 8

2Gb C-die 8Banks

K4B2G0446C HC(L)F8/H9 512M x 4 1.5V

78 ball

FBGA Now

K4B2G0846C HC(L)F8/H9 256M x 8

K4B2G0446C HY(L)F8/H9 512M x 4

1.35V

K4B2G0846C HY(L)F8/H9 256M x 8

DDP 2Gb D-die 8Banks K4B2G0446D MC(L)F7/F8/H9 512M x 4 1.5V 78 ball

FBGA Now

K4B2G0846D MC(L)F7/F8/H9 256M x 8

DDP 2Gb E-die 8Banks K4B2G0446E MC(L)F7/F8/H9 512M x 4 1.5V 78 ball

FBGA Now

K4B2G0846E MC(L)F7/F8/H9 256M x 8

DDP 4Gb B-die 8Banks

K4B4G0446B MC(L)F7/F8/H9 1G x 4

1.5V 78 ball

FBGA Now

K4B2G0846B MC(L)F7/F8/H9 512M x 8

October 2009

General Information DDR3 SDRAM

3 :DIMM

4 :SODIMM

Z FBGA(Lead-free)

H FBGA(Lead-free & Halogen-free)

J FBGA(Lead-free, DDP)

M FBGA(Lead-free & Halogen-free, DDP)

32 :32M 33 : 32M (for 128Mb/512Mb)

64 :64M 65 : 64M (for 128Mb/512Mb)

28 :128M 29 :128M (for 128Mb/512Mb)

56 :256M 57 :256M (for 512Mb/2Gb)

51 : 512M 52 : 512M (for 512Mb/2Gb)

1G : 1G 1K : 1G (for 2Gb)

2G : 2G 2K : 2G (for 2Gb)

M 1st Gen. A 2nd Gen.

B 3rd Gen. C 4th Gen.

D 5th Gen. E 6th Gen.

F :7th Gen. G 8th Gen.

0: None

2 :2nd Rev.

4 :4th Rev.

B :DDR3 SDRAM (1.5V VDD)

1. Memory Module : M

2. DIMM Type

3. Data Bits

4. DRAM Component Type

5. Depth

12. Speed

11. Temp & Power

10. PCB Revision

9. Package

8. Component Revision

7 : 8Banks & SSTL-1.5V

6. # of Banks in comp. & Interface

3. DDR3 SDRAM Module Ordering Information

1 :1st Rev.

3 : 3rd Rev.

S : Reduced Layer

:Commercial Temp.( 0°C ~ 85°C) & Normal Power

:Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),

PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)

PCB Revision

Component Revision

# of Banks in Comp. & Interface

Depth

DRAM Component Type

Data bits

DIMM Type

Memory Module

Package

Temp & Power

Speed

MX X X B X X X X X X X - X X X

1 2 3 4 5 6 7 8 9 10 11 12

Bit Organization

0 : x 4

3 : x 8

4 : x16

7. Bit Organization

: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

71 : x64 204pin Unbuffered SODIMM

78 : x64 240pin Unbuffered DIMM

91 : x72 240pin ECC unbuffered DIMM

92 : x72 240pin VLP Registered DIMM

93 : x72 240pin Registered DIMM

October 2009

General Information DDR3 SDRAM

4. DDR3 SDRAM Module Product Guide

4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)

240Pin DDR3 Unbuffered DIMM

Org. Density Part Number Speed Raw Card Composition Comp.

Version

Internal

Banks Rank PKG Height Avail. Note

128Mx 64 1GB

M378B2873DZ1 CF8/H9

A(1Rx8)

128M x 8 * 8 pcs 1Gb D-die

78 + 4 ball

FBGA

30mm Now

M378B2873EH1 CF8/H9/K0 128M x 8 * 8 pcs 1Gb E-die 78 ball

FBGA

M378B2873FHS CF8/H9 128M x 8 * 8 pcs 1Gb F-die

128Mx 72 1GB

M391B2873DZ1 CF8/H9

D(1Rx8)

128M x 8 * 9 pcs 1Gb D-die

78 + 4 ball

FBGA

30mm Now

M391B2873EH1 CF8/H9/K0 128M x 8 * 9 pcs 1Gb E-die 78 ball

FBGA

M391B2873FH0 CF8/H9/K0 128M x 8 * 9 pcs 1Gb F-die

256Mx 64 2GB

M378B5673DZ1 CF8/H9

B(2Rx8)

128M x 8 * 16 pcs 1Gb D-die

78 + 4 ball

FBGA

30mm Now

M378B5673EH1 CF8/H9/K0 128M x 8 * 16 pcs 1Gb E-die

78 ball

FBGA

M378B5673FH0 CF8/H9/K0 128M x 8 * 16 pcs 1Gb F-die

M378B5773CHS CF8/H9/K0 A(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1

256Mx 72 2GB

M391B5673DZ1 CF8/H9

E(2Rx8)

128M x 8 * 18 pcs 1Gb D-die

78 + 4 ball

FBGA

30mm Now

M391B5673EH1 CF8/H9/K0 128M x 8 * 18 pcs 1Gb E-die

78 ball

FBGA

M391B5673FH0 CF8/H9/K0 128M x 8 * 18 pcs 1Gb F-die

M391B5773CH0 CF8/H9/K0 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 1

512Mx 64 4GB

M378B5273BH1 CF8/H9

B(2Rx8)

256M x 8 * 16 pcs 2Gb B-die

78 ball

FBGA 30mm Now

M378B5273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die

512Mx 72 4GB M391B5273BH1 CF8/H9 E(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 82

78 ball

FBGA 30mm Now

M391B5273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)

* Note : 1.35V product is 1.5V operatable.

240Pin DDR3 Unbuffered DIMM

Org. Density Part Number Speed Raw Card Composition Comp.

Version

Internal

Banks Rank PKG Height Avail. Note

128Mx 72 1GB M391B2873EH1 YF8/H9 D(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81

78 ball

FBGA 30mm Now

M391B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die

256Mx 72 2GB

M391B5673EH1 YF8/H9 E(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 82

78 ball

FBGA 30mm NowM391B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die

M391B5773CH0 YF8/H9 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 8 1

512Mx 72 4GB M391B5273BH1 YF8/H9 E(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 82

78 ball

FBGA 30mm Now

M391B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die

October 2009

General Information DDR3 SDRAM

4.3 204Pin DDR3 SoDIMM (1.5V Product)

204Pin DDR3 SODIMM

Org. Density Part Number Speed Raw Card Composition Comp.

Version

Internal

Banks Rank PKG Height Avail. Note

128Mx 64 1GB

M471B2874DZ1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb D-die 8 2 96 + 4 ball

FBGA

30mm Now

M471B2873EH1 CF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1 78 ball

FBGA

M471B2874EH1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball

M471B2873FHS CF8/H9 B(1Rx8) 64M x 16 * 8 pcs 1Gb F-die 8 1 78 ball

FBGA

256Mx 64 2GB

M471B5673DZ1 CF8/H9

F(2Rx8)

128M x 8 * 16 pcs 1Gb D-die

78 + 4 ball

FBGA

30mm Now

M471B5673EH1 CF8/H9 128M x 8 * 16 pcs 1Gb E-die

78 ball

FBGA

M471B5673FH0 CF8/H9 128M x 8 * 16 pcs 1Gb F-die

M471B5773CHS CF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1

512Mx 64 4GB

M471B5273BH1 CF8/H9

F(2Rx8)

256M x 8 * 16 pcs 2Gb B-die

78 ball

FBGA 30mm Now

M471B5273CH0 CF8/H9 256M x 8 * 16 pcs 2Gb C-die

4.4 204Pin DDR3 SoDIMM (1.35V Product)

* Note : 1.35V product is 1.5V operatable.

204Pin DDR3 SODIMM

Org. Density Part Number Speed Raw Card Composition Comp.

Version

Internal

Banks Rank PKG Height Avail. Note

128Mx 64 1GB

M471B2873EH1 YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1 78 ball

FBGA

30mm NowM471B2874EH1 YF8/H9 A(1Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball

M471B2873FHS YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb F-die 8 1 78 ball

FBGA

256Mx 64 2GB

M471B5673EH1 YF8/H9 F(2Rx8) 128M x 8 * 16 pcs 1Gb E-die 82

78 ball

FBGA 30mm NowM471B5673FH0 YF8/H9 128M x 8 * 16 pcs 1Gb F-die

M471B5773CHS YF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1

512Mx 64 4GB M471B5273BH1 YF8/H9 F(2Rx8) 256M x 8 * 16 pcs 2Gb B-die 82

78 ball

FBGA 30mm Now

M471B5273CH0 YF8/H9 256M x 8 * 16 pcs 2Gb C-die

October 2009

General Information DDR3 SDRAM

4.5 240Pin DDR3 Registered DIMM (1.5V Product)

240Pin DDR3 Registered DIMM

Org. Density Part Number Speed Raw Card Composition Comp.

Version

Internal

Banks Rank PKG Height Avail. Note

128Mx 72 1GB

M393B2873DZ1 CF8/H9

A(1Rx8)

128M x 8 * 9 pcs 1Gb D-die

78 + 4 ball

FBGA

30mm Now

M393B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die 78 ball

FBGA

M393B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die

256Mx 72 2GB

M393B5673DZ1 CF8/H9

B(2Rx8)

128M x 8 * 18 pcs 1Gb D-die

278 + 4 ball

FBGA

30mm Now

M393B5673EH1 CF8/H9 128M x 8 * 18 pcs 1Gb E-die 278 ball

FBGA

M393B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die

M393B5670DZ1 CF8/H9

C(1Rx4)

256M x 4 * 18 pcs 1Gb D-die 1 78 + 4 ball

FBGA

M393B5670EH1 CF8/H9 256M x 4 * 18 pcs 1Gb E-die

178 ball

FBGA

M393B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die

512Mx 72 4GB

M393B5173DZ1 CF7/F8

H(4Rx8)

128M x 8 * 36 pcs 1Gb D-die

478 + 4 ball

FBGA

30mm Now

M393B5173EH1 CF7/F8 128M x 8 * 36 pcs 1Gb E-die 478 ball

FBGA

M393B5173FH0 CF7/F8 128M x 8 * 36 pcs 1Gb F-die

M393B5170DZ1 CF8/H9

E(2Rx4)

256M x 4 * 36 pcs 1Gb D-die 2 78 + 4 ball

FBGA

M393B5170EH1 CF8/H9 256M x 4 * 36 pcs 1Gb E-die 2

78 ball

FBGA

M393B5170FH0 CF8/H9 256M x 4 * 36 pcs 1Gb F-die

M393B5273BH1 CF8/H9

B(2Rx8)

256M x 8 * 18 pcs 2Gb B-die

M393B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die

M393B5270BH1 CF8/H9 C(1Rx4) 512M x 4 * 18 pcs 2Gb B-die 1

M393B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die

1Gx 72 8GB

M393B1G70DJ1 CF7/F8

F(4Rx4)

DDP

512M x 4 * 36 pcs 1Gb D-die

78 ball

FBGA 30mm Now

M393B1G70EM1 CF7/F8 DDP

512M x 4 * 36 pcs 1Gb E-die

M393B1K73BH1 CF7/F8 H(4Rx8) 256M x 8 * 36 pcs 2Gb B-die 4

M393B1K73CH0 CF7/F8 256M x 8 * 36 pcs 2Gb C-die

M393B1K70BH1 CF8/H9

E(2Rx4)

512M x 4 * 36 pcs 2Gb B-die

M393B1K70CH0 CF8/H9 512M x 4 * 36 pcs 2Gb C-die

2Gx 72 16GB

M393B2K70BM1 CF7/F8

F(4Rx4)

DDP

1G x 4 * 36 pcs 2Gb B-die

78 ball

FBGA 30mm Now

M393B2K70CM0 CF7/F8 DDP

1G x 4 * 36 pcs 2Gb C-die

October 2009

General Information DDR3 SDRAM

4.6 240Pin DDR3 Registered DIMM (1.35V Product)

* Note : 1.35V product is 1.5V operatable.

240Pin DDR3 Registered DIMM

Org. Density Part Number Speed Raw Card Composition Comp.

Version

Internal

Banks Rank PKG Height Avail. Note

128Mx 72 1GB

M393B2873EH1 YF8/H9

A(1Rx8)

128M x 8 * 9 pcs 1Gb E-die

78 ball

FBGA 30mm Now

M393B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die

256Mx 72 2GB

M393B5673EH1 YF8/H9 B(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 82

78 ball

FBGA 30mm Now

M393B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die

M393B5670EH1 YF8/H9

C(1Rx4)

256M x 4 * 18 pcs 1Gb E-die

81M393B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die

M393B5773CH0 YF8/H9 A(1Rx8) 512M x 4 * 9 pcs 2Gb C-die

512Mx 72 4GB

M393B5173EH1 YF7/F8

H(4Rx8)

128M x 8 * 36 pcs 1Gb E-die

78 ball

FBGA 30mm Now

M393B5173FH0 YF7/F8 128M x 8 * 36 pcs 1Gb F-die

M393B5170EH1 YF8/H9 E(2Rx4) 256M x 4 * 36 pcs 1Gb E-die 82

M393B5170FH0 YF8/H9 256M x 4 * 36 pcs 1Gb F-die

M393B5273BH1 YF8/H9 B(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 82

M393B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die

M393B5270BH1 YF8/H9

C(1Rx4)

512M x 4 * 18 pcs 2Gb B-die

M393B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die

1Gx 72 8GB

M393B1G70EM1 YF7/F8

F(4Rx4)

DDP

512M x 4 * 36 pcs 1Gb E-die

78 ball

FBGA 30mm

Now

M393B1G70FM0 YF7/F8 DDP

512M x 4 * 36 pcs 1Gb F-die Nov. ’09

M393B1K73BH1 YF7/F8 H(4Rx8) 256M x 8 * 36 pcs 2Gb B-die 84

Now

M393B1K73CH0 YF7/F8 256M x 8 * 36 pcs 2Gb C-die

M393B1K70BH1 YF8/H9 E(2Rx4) 512M x 4 * 36 pcs 2Gb B-die 82

M393B1K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die

2Gx 72 16GB

M393B2K70BM1 YF7/F8

F(4Rx4)

DDP

1G x 4 * 36 pcs 2Gb B-die

78 ball

FBGA 30mm

Now

M393B2K70CM0 YF7/F8 DDP

1G x 4 * 36 pcs 2Gb C-die Nov. ’09

October 2009

General Information DDR3 SDRAM

4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)

240Pin DDR3 VLP Registered DIMM

Org. Density Part Number Speed Raw Card Composition Comp.

Version

Internal

Banks Rank PKG Height Avail. Note

128Mx 72 1GB

M392B2873DZ1 CF8/H9

K(1Rx8)

128M x 8 * 9 pcs 1Gb D-die

78 + 4 ball

FBGA

18.75mm Now

M392B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die 78 ball

FBGA

M392B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die

256Mx 72 2GB

M392B5673DZ1 CF8/H9

L(2Rx8)

128M x 8 * 18 pcs 1Gb D-die

78 + 4 ball

FBGA

18.75mm Now

M392B5673EH1 CF8/H9 128M x 8 * 18 pcs 1Gb E-die 78 ball

FBGA

M392B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die

M392B5670DZ1 CF8/H9

M(1Rx4)

256M x 4 * 18 pcs 1Gb D-die

78 + 4 ball

FBGA

M392B5670EH1 CF8/H9 256M x 4 * 18 pcs 1Gb E-die 78 ball

FBGA

M392B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die

M392B5773CH0 CF8/H9 K(1Rx8) 128M x 8 * 9 pcs 1Gb F-die 1 78 ball

FBGA

512Mx 72 4GB

M392B5170DJ1 CF8/H9

N(2Rx4)

DDP

512M x 4 * 18 pcs 1Gb D-die

78 ball

FBGA 18.75mm

Now

M392B5170EM1 CF8/H9 DDP

512M x 4 * 18 pcs 1Gb E-die

M392B5170FM0 CF8/H9 DDP

512M x 4 * 18 pcs 1Gb F-die

Dec. ’09

M392B5173FM0 CF7/F8 V(4Rx8) DDP

256M x 8 * 18 pcs 1Gb F-die 4

M392B5273BH1 CF8/H9 L(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 2

Now

M392B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die

M392B5270BH1 CF8/H9 M(1Rx4) 512M x 4 * 18 pcs 2Gb B-die 1

M392B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die

1Gx 72 8GB

M392B1K73BM1 CF7/F8

V(4Rx8)

DDP

512M x 8 * 18 pcs 2Gb B-die

78 ball

FBGA 18.75mm Now

M392B1K73CM0 CF7/F8 DDP

512M x 8 * 18 pcs 2Gb C-die

M392B1K70BM1 CF8/H9

N(2Rx4)

DDP

1G x 4 * 18 pcs 2Gb B-die

M392B1K70CM0 CF8/H9 DDP

1G x 4 * 18 pcs 2Gb C-die

October 2009

General Information DDR3 SDRAM

4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)

* Note : 1.35V product is 1.5V operatable.

240Pin DDR3 VLP Registered DIMM

Org. Density Part Number Speed Raw Card Composition Comp.

Version

Internal

Banks Rank PKG Height Avail. Note

128Mx 72 1GB

M392B2873EH1 YF8/H9

K(1Rx8)

128M x 8 * 9 pcs 1Gb E-die

78 ball

FBGA 18.75mm Now

M392B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die

256Mx 72 2GB

M392B5673EH1 YF8/H9 L(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 82

78 ball

FBGA 18.75mm Now

M392B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die

M392B5670EH1 YF8/H9 M(1Rx4) 256M x 4 * 18 pcs 1Gb E-die

81M392B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die

M392B5773CH0 YF8/H9 K(1Rx8) 512M x 4 * 9 pcs 2Gb C-die

512Mx 72 4GB

M392B5170EM1 YF8/H9 N(2Rx4) DDP

512M x 4 * 18 pcs 1Gb E-die 8 2

78 ball

FBGA 18.75mm

Now

M392B5173FM0 YF7/F8 V(4Rx8) 256M x 8 * 18 pcs 1Gb F-die 8 4 Dec. ’09

M392B5170FM0 YF8/H9 N(2Rx4) 512M x 4 * 18 pcs 1Gb F-die

82M392B5273BH1 YF8/H9

L(2Rx8)

256M x 8 * 18 pcs 2Gb B-die

Now

M392B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die

M392B5270BH1 YF8/H9 M(1Rx4) 512M x 4 * 18 pcs 2Gb B-die 81

M392B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die

1Gx 72 8GB

M392B1K73BM1 YF7/F8

V(4Rx8)

DDP

512M x 8 * 18 pcs 2Gb B-die

78 ball

FBGA 18.75mm

Now

M392B1K73CM0 YF7/F8 DDP

512M x 8 * 18 pcs 2Gb C-die Nov. ’09

M392B1K70BM1 YF8/H9

N(2Rx4)

DDP

1G x 4 * 18 pcs 2Gb B-die

Now

M392B1K70CM0 YF8/H9 DDP

1G x 4 * 18 pcs 2Gb C-die Nov. ’09

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