Renesas RA8 Series User manual

www.renesas.com

All information contained in these materials, including products and product specifications,

represents information on the product at the time of publication and is subject to change by

Renesas Electronics Corp. without notice. Please review the latest information published by

Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.

website (http://www.renesas.com).

Rev 1.00 Jan 23, 2024

Renesas RA Family

RA8 Series

User’ s Manual

RA8T1 Group

MCK-RA8T1 User's Manual

User’s Manual

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products

The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the

products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the

products.

1. Precaution against Electrostatic Discharge (ESD)

A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps

must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be

adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.

Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and

measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor

devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2. Processing at power-on

The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of

register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset

pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins

in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the

level at which resetting is specified.

3. Input of signal during power-off state

Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O

pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal

elements. Follow the guideline for input signal during power-off state as described in your product documentation.

4. Handling of unused pins

Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are

generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of

the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal

become possible.

5. Clock signals

After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program

execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator

during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal

produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin

Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL

(Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the

input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).

7. Prohibition of access to reserved addresses

Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these

addresses as the correct operation of the LSI is not guaranteed.

8. Differences between products

Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.

The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms

of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,

operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-

evaluation test for the given product.

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products

and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your

product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use

of these circuits, software, or information.

2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights,

or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this

document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics

or others.

4. You shall be responsible for determining what licenses are required from any third parties, and obtaining such licenses for the lawful import, export,

manufacture, sales, utilization, distribution or other disposal of any products incorporating Renesas Electronics products, if required.

5. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any

and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

6. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for

each Renesas Electronics product depends on the product’s quality grade, as indicated below.

"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home

electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key

financial terminal systems; safety control equipment; etc.

Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas

Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to

human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space

system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics

disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product

that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

7. No semiconductor product is absolutely secure. Notwithstanding any security measures or features that may be implemented in Renesas Electronics

hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but

not limited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESAS

ELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USING

RENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE,

HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (“Vulnerability Issues”). RENESAS ELECTRONICS DISCLAIMS ANY AND

ALL RESPONSIBILITY OR LIABILITY ARISING FROM OR RELATED TO ANY VULNERABILITY ISSUES. FURTHERMORE, TO THE EXTENT

PERMITTED BY APPLICABLE LAW, RENESAS ELECTRONICS DISCLAIMS ANY AND ALL WARRANTIES, EXPRESS OR IMPLIED, WITH

RESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO

THE IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.

8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for

Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by

Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc.

Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products

outside of such specified ranges.

9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific

characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability

product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics

products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily

injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as

safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for

aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you

are responsible for evaluating the safety of the final products or systems manufactured by you.

10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas

Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of

controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these

applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance

with applicable laws and regulations.

11. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is

prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations

promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

12. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or

transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.

13. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas

Electronics products.

(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled

subsidiaries.

(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

(Rev.5.0-1 October 2020)

Corporate Headquarters

Contact information

TOYOSU FORESIA, 3-2-24 Toyosu,

Koto-ku, Tokyo 135-0061, Japan

www.renesas.com

For further information on a product, technology, the most up-to-date

version of a document, or your nearest sales office, please visit:

www.renesas.com/contact/.

Trademarks

Renesas and the Renesas logo are trademarks of Renesas Electronics

Corporation. All trademarks and registered trademarks are the property

of their respective owners.

 
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Renesas RA Family 
MCK-RA8T1 User's Manual 
Contents 
Overview .................................................................................................................................5 
1 Presupposition and precautions of this document ..................................................................................5 
Product Contents.....................................................................................................................6 
Product Order Information .......................................................................................................6 
Hardware Configuration and Default Setting............................................................................7 
1 Hardware configuration ...........................................................................................................................7 
2 Block diagram........................................................................................................................................11 
3 Board Layout.........................................................................................................................................12 
4 Standoffs and Screws ...........................................................................................................................13 
5 Jumper pin setting.................................................................................................................................14 
5.1 Inverter board......................................................................................................................................14 
5.2 CPU board...........................................................................................................................................15 
5.3 Communication board .........................................................................................................................17 
6 Hardware Setup.....................................................................................................................................18 
6.1 Board Connection................................................................................................................................18 
6.2 Power Supply ......................................................................................................................................19 
Inverter Board Specification...................................................................................................21 
1 Functions...............................................................................................................................................21 
1.1 Inverter control circuit block.................................................................................................................21 
1.2 Current detection circuit ......................................................................................................................22 
1.3 Overcurrent detection circuit ...............................................................................................................23 
1.4 Output voltage detection circuit...........................................................................................................24 
1.5 Voltage generation circuit....................................................................................................................24 
1.6 LED......................................................................................................................................................25 
1.7 Toggle switch and push switch............................................................................................................25 
1.8 Variable resistor...................................................................................................................................25 
2 Pin assignment......................................................................................................................................26 
2.1 CPU board connector..........................................................................................................................26 
2.2 Hall sensor signal input .......................................................................................................................28 
2.3 Encoder/Inductive position sensor signal input...................................................................................28 
CPU Board Specification.......................................................................................................29 
1 Functions...............................................................................................................................................29 
1.1 Power supply.......................................................................................................................................29 

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1.2 Onboard debugger ..............................................................................................................................29 
1.3 J-Link Virtual COM Port.......................................................................................................................29 
1.4 USB IF.................................................................................................................................................29 
1.5 Inverter board connector .....................................................................................................................30 
1.6 Serial communication..........................................................................................................................32 
1.7 Reset circuit.........................................................................................................................................32 
1.8 LED......................................................................................................................................................33 
1.9 CAN Communication...........................................................................................................................33 
1.10 Pmod...................................................................................................................................................33 
2 RA8T1 pin function list ..........................................................................................................................34 
Communication Board Specification......................................................................................38 
1 Functions...............................................................................................................................................38 
1.1 Power supply.......................................................................................................................................38 
1.2 USB communication............................................................................................................................38 
1.3 Serial communication..........................................................................................................................38 
Design and Manufacture Information.....................................................................................39 
Website and Support.............................................................................................................39 
Revision History............................................................................................................................40 
 
 

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Figure of contents 
Figure 2-1 Product contents .............................................................................................................................. 6 
Figure 4-1 MCK-RA8T1 block diagram ........................................................................................................... 11 
Figure 4-2 Inverter board Layout..................................................................................................................... 12 
Figure 4-3 CPU Board Layout ......................................................................................................................... 12 
Figure 4-4 Communication board Layout........................................................................................................ 13 
Figure 4-5 Standoffs and Screws assembly.................................................................................................... 13 
Figure 4-6 Default jumper pin setting of Inverter board................................................................................... 14 
Figure 4-7 Default jumper pin setting of CPU board ....................................................................................... 16 
Figure 4-8 Default jumper pin setting of Communication board...................................................................... 17 
Figure 4-9 Board connection ........................................................................................................................... 18 
Figure 4-10 Power supply from DC jack.......................................................................................................... 19 
Figure 4-11 Power supply from terminal block................................................................................................ 19 
Figure 4-12 Power supply from USB connector.............................................................................................. 20 
Figure 5-1 Illustration of inverter control circuit block...................................................................................... 21 
Figure 5-2 Current detection circuit ................................................................................................................. 22 
Figure 5-3 Overcurrent detection circuit .......................................................................................................... 23 
Figure 5-4 Output voltage detection circuit...................................................................................................... 24 
Figure 6-1 Jumper setting of JP6 .................................................................................................................... 29 
Figure 6-2 Board connection of CPU board, INV board and COM board ....................................................... 32 
 

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Table of contents 
Table 4-1 MCK-RA8T1 specification (1/4)......................................................................................................... 7 
Table 4-2 MCK-RA8T1 specification (2/4)......................................................................................................... 8 
Table 4-3 MCK-RA8T1 specification (3/4)......................................................................................................... 9 
Table 4-4 MCK-RA8T1 specification (4/4)....................................................................................................... 10 
Table 4-5 Jumper pin setting of Invertor board ............................................................................................... 14 
Table 4-6 Jumper pins/registers setting of CPU board for INV1/INV2............................................................ 15 
Table 4-7 Jumper pins/registers setting of CPU board for board interface..................................................... 15 
Table 4-8 Jumper registers setting of CPU board for PWM single channel.................................................... 15 
Table 4-9 Jumper pin setting of Communication board................................................................................... 17 
Table 4-10 Power supply and driving voltage generation ............................................................................... 20 
Table 5-1 Voltage generation .......................................................................................................................... 24 
Table 5-2 LED.................................................................................................................................................. 25 
Table 5-3 Toggle switch and push switch........................................................................................................ 25 
Table 5-4 Variable resistance specification..................................................................................................... 25 
Table 5-5 CPU board connector (CN3) ........................................................................................................... 26 
Table 5-6 CPU board connector (CN4) ........................................................................................................... 27 
Table 5-7 Connector for hall sensor signal input (CN6) pin assignment......................................................... 28 
Table 5-8 Pins for encoder/inductive position sensor signal input (CN5) pin assignment ............................. 28 
Table 6-1 1st inverter board connector (CN1) pin assignment........................................................................ 30 
Table 6-2 1st inverter board connector (CN2) pin assignment........................................................................ 30 
Table 6-3 2nd inverter board connector (CN3) pin assignment ...................................................................... 31 
Table 6-4 2nd inverter board connector (CN4) pin assignment ...................................................................... 31 
Table 6-5 SCI connector (CN8) pin assignment.............................................................................................. 32 
Table 6-6 LED pin assignment ........................................................................................................................ 33 
Table 6-7 CAN communication pin assignment (CN5).................................................................................... 33 
Table 6-8 Pmod Type 2A/3A connector pin assignment (CN6) ...................................................................... 33 
Table 6-9 Pmod Type 6A connector pin assignment (CN7)............................................................................ 33 
Table 6-10 RA8T1 pin function list .................................................................................................................. 34 
Table 7-1 SCI connector (CN5) pin assignment.............................................................................................. 38 
Table 7-2 SCI connector (CN4) pin assignment.............................................................................................. 38 
 
 

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1. Overview

MCK-RA8T1 is a motor control evaluation kit. By using this product, motor control with MCK-RA8T1 can

be performed easily.

MCK-RA8T1 has characteristics shown below.

（1）Supports Brushless DC motor.

（2）Supports 1-/2-/3-shunt current detection.

（3）Supports Motor Control Development Support Tool.

（4）Provides overcurrent protection function using overcurrent detection circuit.

1.1 Presupposition and precautions of this document

1. Experience of using tools: This document assumes that the user has used terminal emulation program of

Integrated Development Environment (IDE) such as e2 studio before.

2. Knowledge about the development subject: This document assumes that the user has a basic knowledge

to modify the sample project regarding MCU and embedded system.

3. Before using this product, wear an antistatic wrist strap. If you touch this product with static charge on

your body, a device failure may occur, or operation may become unstable.

4. All screen shots provided in this document is for reference. Actual screen displays may differ depending

on the software and development tool version which you use.

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2. Product Contents

This kit consists of the following parts.

1. Inverter Board (RTK0EM0000B12020BJ) x1

2. CPU Board (RTK0EMA5K0C00000BJ) x1

3. Communication board (RTK0EMXC90Z00000BJ) x1

4. Brushless DC Motor (R42BLD30L3) x1

5. Communication cable x1

6. USB cable x2

7. Screw x12

8. Standoff x12

Figure 2-1 Product contents

3. Product Order Information

Product number to order MCK-RA8T1:RTK0EMA5K0S00020BJ

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4. Hardware Configuration and Default Setting

4.1 Hardware configuration

MCK-RA8T1 consists of the inverter board, the CPU board and the communication board. Specifications as a

kit and for the relevant boards are listed below.

Table 4-1 MCK-RA8T1 specification (1/4)

Item

Specification

Kit product name

MCK-RA8T1

Kit product No.

RTK0EMA5K0S00020BJ

Kit configuration

Inverter Board

RTK0EM0000B12020BJ

CPU Board

RTK0EMA5K0C00000BJ

Communication board

RTK0EMXC90Z00000BJ

Brushless DC Motor

R42BLD30L3 (MOONS’)

Rated voltage：36[V]

Rated current：1.67[A]

Isolation

Inverter board - CPU board : Non-isolated

Communication board –CPU board : isolated (up to 1kVRMS)

External view

Note: The actual product may differ from this photo.

Board size

Inverter board : 133 mm (W) x 109 mm (L)

CPU board : 109 mm (W) x 109 mm (L)

Comunication board : 89mm(W) × 52mm(L)

Operating temperature

Room temperature

Operating humidity

No condensation allowed

EMC Directive

EN61326-1:2021

EMI : Class A

EMS : Basic Electromagnetic environment

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