Quectel FCM561D-P Supplement

FCM561D-P

Hardware Design

Wi-Fi&Bluetooth Module Series

Version: 1.0.0

Date: 2023-10-27

Status: Preliminary

Wi-Fi&Bluetooth Module Series

FCM561D-P_Hardware_Design 1 /

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you

require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd.

Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,

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Tel: +86 21 5108 6236

Email: info@quectel.com

Or our local offices. For more information, please visit:

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For technical support, or to report documentation errors, please visit:

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Legal Notices

We offer information as a service to you. The provided information is based on your requirements and we

make every effort to ensure its quality. You agree that you are responsible for using independent

analysis and evaluation in designing intended products, and we provide reference designs for illustrative

purposes only. Before using any hardware, software or service guided by this document, please read this

notice carefully. Even though we employ commercially reasonable efforts to provide the best possible

experience, you hereby acknowledge and agree that this document and related services hereunder are

provided to you on an “as available” basis. We may revise or restate this document from time to time at

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noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of

the material.

Wi-Fi&Bluetooth Module Series

FCM561D-P_Hardware_Design 2 /

Trademarks

Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights

to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel

or any third party in advertising, publicity, or other aspects.

Third-Party Rights

This document may refer to hardware, software and/or documentation owned by one or more third parties

(“third-party materials”). Use of such third-party materials shall be governed by all restrictions and

obligations applicable thereto.

We make no warranty or representation, either express or implied, regarding the third-party materials,

including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular

purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any

third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein

constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell,

offer for sale, or otherwise maintain production of any our products or any other hardware, software,

device, tool, information, or product. We moreover disclaim any and all warranties arising from the course

of dealing or usage of trade.

To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,

including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the

relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the

purpose of performing the service only or as permitted by applicable laws. Before data interaction with

third parties, please be informed of their privacy and data security policy.

Disclaimer

a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.

b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the

information contained herein.

c) While we have made every effort to ensure that the functions and features under development are

free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless

otherwise provided by valid agreement, we make no warranties of any kind, either implied or

express, and exclude all liability for any loss or damage suffered in connection with the use of

features and functions under development, to the maximum extent permitted by law, regardless of

whether such loss or damage may have been foreseeable.

d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness

of information, advertising, commercial offers, products, services, and materials on third-party

websites and third-party resources.

Wi-Fi&Bluetooth Module Series

FCM561D-P_Hardware_Design 3 /

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage,

service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal

should notify users and operating personnel of the following safety information by incorporating these

guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure

to comply with these precautions.

Full attention must be paid to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. Please comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the terminal or mobile before boarding an aircraft. The operation of

wireless appliances in an aircraft is forbidden to prevent interference with

communication systems. If there is an Airplane Mode, it should be enabled prior to

boarding an aircraft. Please consult the airline staff for more restrictions on the use

of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in

hospitals, clinics or other healthcare facilities.

Terminals or mobiles operating over radio signal and cellular network cannot be

guaranteed to connect in certain conditions, such as when the mobile bill is unpaid

or the (U)SIM card is invalid. When emergency help is needed in such conditions,

use emergency call if the device supports it. In order to make or receive a call, the

terminal or mobile must be switched on in a service area with adequate cellular

signal strength. In an emergency, the device with emergency call function cannot

be used as the only contact method considering network connection cannot be

guaranteed under all circumstances.

The terminal or mobile contains a transceiver. When it is ON, it receives and

transmits radio frequency signals. RF interference can occur if it is used close to

TV sets, radios, computers or other electric equipment.

In locations with explosive or potentially explosive atmospheres, obey all posted

signs and turn off wireless devices such as mobile phone or other terminals. Areas

with explosive or potentially explosive atmospheres include fueling areas, below

decks on boats, fuel or chemical transfer or storage facilities, and areas where the

air contains chemicals or particles such as grain, dust or metal powders.

Wi-Fi&Bluetooth Module Series

FCM561D-P_Hardware_Design 4 /

About the Document

Revision History

Version

Date

Author

Description

2023-08-24

Luke FU

Creation of the document

1.0.0

2023-10-27

Roshan WENG/Jay DONG

Preliminary

 
 Wi-Fi&Bluetooth Module Series 
FCM561D-P_Hardware_Design 5 / 

Contents 
Safety Information...................................................................................................................................... 3 
About the Document.................................................................................................................................. 4 
Contents...................................................................................................................................................... 5 
Table Index.................................................................................................................................................. 7 
Figure Index................................................................................................................................................ 8 
Introduction............................................................................................................................................. 9 
1. Special Marks............................................................................................................................... 10 
Product Overview................................................................................................................................. 11 
1. Key Features................................................................................................................................ 12 
Application Interfaces.......................................................................................................................... 13 
1. Pin Assignment............................................................................................................................ 13 
2. Pin Description............................................................................................................................. 14 
3. GPIO Multiplexing........................................................................................................................ 19 
4. Application Interfaces................................................................................................................... 23 
4.1. SPIs ................................................................................................................................... 23 
4.2. QSPI .................................................................................................................................. 24 
4.3. UARTs ............................................................................................................................... 24 
4.4. SDIO Interface................................................................................................................... 25 
4.5. I2C Interfaces .................................................................................................................... 27 
4.6. USB Interface .................................................................................................................... 27 
4.7. CAN Interface*................................................................................................................... 28 
4.8. LCM Interface.................................................................................................................... 28 
4.9. Camera Interface............................................................................................................... 30 
4.10. PWM Interfaces............................................................................................................... 31 
4.11. I2S Interface .................................................................................................................... 31 
4.12. Analog Audio Interface.................................................................................................... 32 
4.13. SAR ADC Interface.......................................................................................................... 32 
4.14. Touch Sensor Interfaces ................................................................................................. 33 
Operating Characteristics.................................................................................................................... 35 
1. Power Supply............................................................................................................................... 35 
1.1. Reference Design for Power Supply................................................................................. 35 
2. Turn On........................................................................................................................................ 36 
3. Reset............................................................................................................................................ 36 
RF Performances.................................................................................................................................. 38 
1. Wi-Fi Performances..................................................................................................................... 38 
2. Bluetooth Performances.............................................................................................................. 39 
3. Antenna Interface......................................................................................................................... 39 

 
 Wi-Fi&Bluetooth Module Series 
FCM561D-P_Hardware_Design 6 / 

3.1. Pin Antenna Interface (ANT_WIFI/BT) ............................................................................ 40 
3.1.1. Reference Design.................................................................................................... 40 
3.1.2. Antenna Design Requirements............................................................................... 40 
3.1.3. RF Routing Guidelines............................................................................................ 41 
3.2. FCM561D-P PCB Antenna .............................................................................................. 43 
Electrical Characteristics & Reliability............................................................................................... 45 
1. Absolute Maximum Ratings......................................................................................................... 45 
2. Power Supply Ratings.................................................................................................................. 45 
3. Power Consumption..................................................................................................................... 46 
3.1. Wi-Fi Power Consumption................................................................................................. 46 
3.2. Bluetooth Power Consumption.......................................................................................... 46 
4. Digital I/O Characteristics ............................................................................................................ 47 
5. ESD Protection ............................................................................................................................ 47 
Mechanical Information ....................................................................................................................... 48 
1. Mechanical Dimensions............................................................................................................... 48 
2. Recommended Footprint............................................................................................................. 50 
3. Top and Bottom Views................................................................................................................. 51 
Storage, Manufacturing & Packaging................................................................................................. 52 
1. Storage Conditions ...................................................................................................................... 52 
2. Manufacturing and Soldering....................................................................................................... 53 
3. Packaging Specifications............................................................................................................. 55 
3.1. Carrier Tape....................................................................................................................... 55 
3.2. Plastic Reel........................................................................................................................ 56 
3.3. Mounting Direction............................................................................................................. 56 
3.4. Packaging Process............................................................................................................ 57 
Appendix References........................................................................................................................... 58 

 
 Wi-Fi&Bluetooth Module Series 
FCM561D-P_Hardware_Design 7 / 
61 
Table Index 
Table 1 : Special Marks.............................................................................................................................. 10 
Table 2 : Basic Information ........................................................................................................................ 11 
Table 3 : Key Features............................................................................................................................... 12 
Table 4 : Parameter Description ................................................................................................................ 14 
Table 5 : Pin Description............................................................................................................................ 14 
Table 6 : GPIO Multiplexing....................................................................................................................... 19 
Table 7 : Pin Definition of SPIs.................................................................................................................. 23 
Table 8 : Pin Definition of QSPI................................................................................................................. 24 
Table 9 : Pin Definition of UARTs .............................................................................................................. 25 
Table 10 : Pin Definition of SDIO Interface................................................................................................ 26 
Table 11 : Pin Definition of I2C Interfaces................................................................................................. 27 
Table 12 : Pin Definition of USB Interface ................................................................................................. 27 
Table 13 : Pin Definition of CAN Interface................................................................................................. 28 
Table 14 : Pin Definition of LCM_RGB Interface....................................................................................... 28 
Table 15 : Pin Definition of LCM_I8080 Interface...................................................................................... 29 
Table 16 : Pin Definition of Camera DVP Interface ................................................................................... 30 
Table 17 : Pin Definition of PWM Interfaces.............................................................................................. 31 
Table 18 ：Pin Definition of I2S Interface................................................................................................. 32 
Table 19 : Pin Definition of Analog Audio Interfaces................................................................................. 32 
Table 20 : Pin Definition of SAR ADC Interfaces....................................................................................... 33 
Table 21 : SAR ADC Features................................................................................................................... 33 
Table 22 : Pin Definition of Touch Sensor Interfaces................................................................................ 34 
Table 23 : Pin Definition of Power Supply and GND Pins......................................................................... 35 
Table 24 : Pin Definition of CHIP_EN........................................................................................................ 36 
Table 25 : Wi-Fi Performances .................................................................................................................. 38 
Table 26 : Bluetooth Performances ........................................................................................................... 39 
Table 27 : ANT_WIFI/BT Pin Definition ..................................................................................................... 40 
Table 28 : Antenna Design Requirements................................................................................................. 40 
Table 29 : PCB Antenna Specifications..................................................................................................... 43 
Table 30 : Absolute Maximum Ratings (Unit: V)........................................................................................ 45 
Table 31 : Module Power Supply Ratings (Unit: V) ................................................................................... 45 
Table 32 : Power Consumption in Non-signaling Modes (Unit: mA)......................................................... 46 
Table 33 : Power Consumption in Non-signaling Modes (Unit: mA)......................................................... 46 
Table 34 : VBAT I/O Characteristics (Unit: V)............................................................................................ 47 
Table 35 : ESD Characteristics (Unit: kV).................................................................................................. 47 
Table 36 : Recommended Thermal Profile Parameters ............................................................................ 54 
Table 37 : FCM561D Carrier Tape Dimension Table (Unit: mm).............................................................. 55 
Table 38 : Plastic Reel Dimension Table (Unit: mm)................................................................................. 56 
Table 39 : Reference Documents.............................................................................................................. 58 
Table 40 : Terms and Abbreviations.......................................................................................................... 58 

 
 Wi-Fi&Bluetooth Module Series 
FCM561D-P_Hardware_Design 8 / 
61 
Figure Index 
Figure 1 : Pin Assignment (Top View) ....................................................................................................... 13 
Figure 2 : SPI Connection.......................................................................................................................... 23 
Figure 3 : QSPI Connection....................................................................................................................... 24 
Figure 4 : UART1 Connection.................................................................................................................... 25 
Figure 5 : SDIO Interface Connection........................................................................................................ 26 
Figure 6 : VBAT Reference Circuit............................................................................................................. 35 
Figure 7 : Turn-on Timing........................................................................................................................... 36 
Figure 8 : Reference Circuit of CHIP_EN by Using A Driving Circuit........................................................ 37 
Figure 9 : Reference Circuit of RESET with A Button ............................................................................... 37 
Figure 10 : Reset Timing............................................................................................................................ 37 
Figure 11 : RF Antenna Reference Design................................................................................................ 40 
Figure 12 : Microstrip Design on a 2-layer PCB ........................................................................................ 41 
Figure 13 : Coplanar Waveguide Design on a 2-layer PCB...................................................................... 41 
Figure 14 : Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)................... 42 
Figure 15 : Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)................... 42 
Figure 16 : Keepout Area on Motherboard ................................................................................................ 43 
Figure 17 : Prohibited Area for Routing ..................................................................................................... 44 
Figure 18 : FCM561D-P Top and Side Dimensions.................................................................................. 48 
Figure 19 : FCM561D-P Bottom Dimensions (Bottom View)..................................................................... 49 
Figure 20 : FCM561D-P Recommended Footprint.................................................................................... 50 
Figure 21 : FCM561D-P Top and Bottom Views (PCB Antenna Interface)............................................... 51 
Figure 22 : Recommended Reflow Soldering Thermal Profile .................................................................. 53 
Figure 23 : Tape Specifications.................................................................................................................. 55 
Figure 24 : Plastic Reel Dimension Drawing ............................................................................................. 56 
Figure 25 : Mounting Direction................................................................................................................... 56 
Figure 26 : Packaging Process.................................................................................................................. 57 

Wi-Fi&Bluetooth Module Series

FCM561D-P_Hardware_Design 9 / 61

1Introduction

QuecOpen®is a solution where the module acts as the main processor. Constant transition and evolution

of both the communication technology and the market highlight its merits. It can help you to:

⚫Realize embedded applications’ quick development and shorten product R&D cycle

⚫Simplify circuit and hardware structure design to reduce engineering costs

⚫Miniaturize products

⚫Reduce product power consumption

⚫Apply OTA technology

⚫Enhance product competitiveness and price-performance ratio

⚫Apply anti-copy encryption technology to enhance product safety

This document defines FCM561D-P in QuecOpen®solution and describes its air interfaces and hardware

interfaces, which are connected with your applications. The document provides a quick insight into

interface specifications, RF performance, electrical and mechanical specifications, as well as other

related information of the module.

Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type FCM561D-P is in

compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address:

http://www.quectel.com/support/technical.htm

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