Quectel FC909A User manual

FC909A

Hardware Design

Wi-Fi&Bluetooth Module Series

Version: 1.0.0

Date: 2022-01-13

Status: Preliminary

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At Quectel, our aim is to provide timely and comprehensive services to our customers. If you

require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd.

Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai

200233, China

Tel: +86 21 5108 6236

Email: [email protected]

Or our local offices. For more information, please visit:

http://www.quectel.com/support/sales.htm.

For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm.

Or email us at: [email protected].

Legal Notices

We offer information as a service to you. The provided information is based on your requirements and we

make every effort to ensure its quality. You agree that you are responsible for using independent analysis

and evaluation in designing intended products, and we provide reference designs for illustrative purposes

only. Before using any hardware, software or service guided by this document, please read this notice

carefully. Even though we employ commercially reasonable efforts to provide the best possible

experience, you hereby acknowledge and agree that this document and related services hereunder are

provided to you on an “as available” basis. We may revise or restate this document from time to time at

our sole discretion without any prior notice to you.

Our and third-party products hereunder may contain copyrighted material. Such copyrighted material

shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior

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be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid

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Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights

to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel

or any third party in advertising, publicity, or other aspects.

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Third-Party Rights

This document may refer to hardware, software and/or documentation owned by one or more third parties

(“third-party materials”). Use of such third-party materials shall be governed by all restrictions and

obligations applicable thereto.

We make no warranty or representation, either express or implied, regarding the third-party materials,

including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular

purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any

third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein

constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell,

offer for sale, or otherwise maintain production of any our products or any other hardware, software,

device, tool, information, or product. We moreover disclaim any and all warranties arising from the course

of dealing or usage of trade.

To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,

including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the

relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the

purpose of performing the service only or as permitted by applicable laws. Before data interaction with

third parties, please be informed of their privacy and data security policy.

Disclaimer

a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.

b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the

information contained herein.

c) While we have made every effort to ensure that the functions and features under development are

free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless

otherwise provided by valid agreement, we make no warranties of any kind, either implied or express,

and exclude all liability for any loss or damage suffered in connection with the use of features and

functions under development, to the maximum extent permitted by law, regardless of whether such

loss or damage may have been foreseeable.

d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of

information, advertising, commercial offers, products, services, and materials on third-party websites

and third-party resources.

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Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service

or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal

shall notify users and operating personnel of the following safety information by incorporating these

guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to

comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. Please comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation

of wireless appliances in an aircraft is forbidden to prevent interference with

communication systems. If there is an Airplane Mode, it shall be enabled prior to

boarding an aircraft. Please consult the airline staff for more restrictions on the use

of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in

hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signal and cellular network

cannot be guaranteed to connect in certain conditions, such as when the mobile bill

is unpaid or the (U)SIM card is invalid. When emergency help is needed in such

conditions, use emergency call if the device supports it. In order to make or receive

a call, the cellular terminal or mobile must be switched on in a service area with

adequate cellular signal strength. In an emergency, the device with emergency call

function cannot be used as the only contact method considering network

connection cannot be guaranteed under all circumstances.

The cellular terminal or mobile contains a transceiver. When it is ON, it receives

and transmits radio frequency signals. RF interference can occur if it is used close

to TV sets, radios, computers or other electric equipment.

In locations with explosive or potentially explosive atmospheres, obey all posted

signs and turn off wireless devices such as mobile phone or other cellular

terminals. Areas with explosive or potentially explosive atmospheres include

fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,

and areas where the air contains chemicals or particles such as grain, dust or

metal powders.

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About the Document

Revision History

Version

Date

Author

Description

2022-01-13

Macky XU

Creation of the document

1.0.0

2022-01-13

Macky XU

Preliminary

 
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Contents 
Safety Information....................................................................................................................................3 
About the Document................................................................................................................................4 
Contents....................................................................................................................................................5 
Table Index ...............................................................................................................................................7 
Figure Index..............................................................................................................................................8 
1Introduction.......................................................................................................................................9 
1. Special Mark...........................................................................................................................13 
2Product Overview............................................................................................................................14 
1. General Description................................................................................................................14 
2. Key Features..........................................................................................................................14 
3. EVB........................................................................................................................................16 
3Application Interfaces.....................................................................................................................17 
1. General Description................................................................................................................17 
2. Pin Description .......................................................................................................................17 
3. Power Supply.........................................................................................................................20 
3.1. Power Supply Pins......................................................................................................20 
3.2. Buck Circuit Pins.........................................................................................................21 
4. WLAN Application Interfaces..................................................................................................22 
4.1. SDIO Interface.............................................................................................................22 
4.2. WLAN_EN...................................................................................................................24 
4.3. WLAN_WAKE .............................................................................................................24 
4.4. Introduction of WLAN Pin Multiplexing Function..........................................................26 
5. Bluetooth Application Interfaces.............................................................................................27 
5.1. UART ..........................................................................................................................27 
5.2. BT_EN.........................................................................................................................28 
5.3. BT_WAKE_HOST and HOST_WAKE_BT ..................................................................29 
5.4. PCM Interface .............................................................................................................29 
6. Other Interfaces......................................................................................................................30 
6.1. WLAN_SLP_CLK........................................................................................................30 
6.2. XTAL_IN/OUT.............................................................................................................30 
6.3. GPIOs .........................................................................................................................31 
4RF Antenna Interfaces....................................................................................................................32 
1. RF Antenna............................................................................................................................32 
1.1. Antenna Interface & Frequency Bands........................................................................32 
1.2. Reference Design........................................................................................................32 
2. Reference Design of RF Routing............................................................................................33 
3. Requirements for Antenna Design .........................................................................................35 

 
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4. RF Connector Recommendation............................................................................................36 
5Electrical Characteristics & Reliability..........................................................................................38 
1. Electrical Characteristics........................................................................................................38 
2. I/O Interface Characteristics...................................................................................................39 
3. Power Consumption...............................................................................................................39 
4. RF Performance.....................................................................................................................40 
4.1. Wi-Fi Performance ......................................................................................................40 
4.2. BLE Performance........................................................................................................41 
5. ESD Protection.......................................................................................................................41 
6Mechanical Information..................................................................................................................42 
1. Mechanical Dimensions..........................................................................................................42 
2. Recommended Footprint........................................................................................................44 
3. Top and Bottom Views ...........................................................................................................45 
7Storage, Manufacturing & Packaging............................................................................................46 
1. Storage Conditions.................................................................................................................46 
2. Manufacturing and Soldering..................................................................................................47 
3. Packaging Specifications........................................................................................................49 
3.1. Carrier Tape................................................................................................................49 
3.2. Plastic Reel .................................................................................................................49 
3.3. Packaging Process......................................................................................................50 
8Appendix References .....................................................................................................................51 
 
 

 
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Table Index 
Table 1: Special Mark.............................................................................................................................. 13 
Table 2: Key Features............................................................................................................................. 14 
Table 3: I/O Parameters Definition.......................................................................................................... 17 
Table 4: Pin Description .......................................................................................................................... 18 
Table 5: Pin Definition of Power Supply and GND Pins .......................................................................... 20 
Table 6: Definition of Buck Circuit Pins ................................................................................................... 21 
Table 7: Recommended Inductance Parameters.................................................................................... 22 
Table 8: Pin Definition of SDIO Interface................................................................................................. 23 
Table 9: Pin Definition of WLAN_EN....................................................................................................... 24 
Table 10: Pin Definition of WLAN_WAKE ............................................................................................... 25 
Table 11: Pin Setting Description............................................................................................................ 26 
Table 12: Pin Definition of SDIO Interface............................................................................................... 26 
Table 13: Pin Definition of UART............................................................................................................. 27 
Table 14: Pin Definition of BT_EN........................................................................................................... 28 
Table 15: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT .......................................... 29 
Table 16: Pin Definition of PCM Interface ............................................................................................... 29 
Table 17: Pin Definition of WLAN_SLP_CLK .......................................................................................... 30 
Table 18: Recommended WLAN_SLP_CLK Parameter ......................................................................... 30 
Table 19: XTAL_IN/OUT Parameter Definition........................................................................................ 31 
Table 20: Pin Definition of GPIOs............................................................................................................ 31 
Table 21: Pin Definition of RF Antenna Interfaces................................................................................... 32 
Table 22: FC909A Operating Frequency................................................................................................. 32 
Table 23: Antenna Cable Requirements ................................................................................................. 35 
Table 24: Antenna requirements............................................................................................................. 35 
Table 25: Absolute Maximum Ratings..................................................................................................... 38 
Table 26: Recommended Operating Conditions...................................................................................... 38 
Table 27: General DC Electrical Characteristics for 1.8 V Domain.......................................................... 39 
Table 28: General DC Electrical Characteristics for 3.3 V Domain.......................................................... 39 
Table 29: Current Consumption of the Module (Normal Operation)........................................................ 39 
Table 30: Conducted RF Output Power at 2.4 GHz Wi-Fi....................................................................... 40 
Table 31: Conducted RF Receiving Sensitivity at 2.4 GHz Wi-Fi............................................................ 40 
Table 32: BLE Transmitting and Receiving Performance........................................................................ 41 
Table 33: Electrostatic Discharge Characteristics (25 ºC, 45 % Relative Humidity)................................ 41 
Table 34: Recommended Thermal Profile Parameters ........................................................................... 48 
Table 35: Carrier Tape Dimension Table (Unit: mm)............................................................................... 49 
Table 36: Plastic Reel Dimension Table (Unit: mm)................................................................................ 50 
Table 37: Related Documents................................................................................................................. 51 
Table 38: Terms and Abbreviations......................................................................................................... 51 
 

 
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Figure Index 
Figure 1: VBAT Circuit Reference Design............................................................................................... 20 
Figure 2: Power On Timing ..................................................................................................................... 21 
Figure 3: Recommended Reference Design Circuit................................................................................ 22 
Figure 4: WLAN Application Interfaces Connection................................................................................. 22 
Figure 5: SDIO Interface Connection ...................................................................................................... 24 
Figure 6: Block Diagram of Bluetooth Application Interfaces Connection................................................ 27 
Figure 7: Reference Design for UART Connection.................................................................................. 28 
Figure 8: PCM Interface Connection....................................................................................................... 29 
Figure 9: Reference Circuit for RF Antenna Interface ............................................................................. 33 
Figure 10: Microstrip Design on a 2-layer PCB ....................................................................................... 33 
Figure 11: Coplanar Waveguide Design on a 2-layer PCB ..................................................................... 34 
Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)................... 34 
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)................... 34 
Figure 14: Dimensions of the U.FL-R-SMT Connector (Unit: mm).......................................................... 36 
Figure 15: Mechanicals of U.FL-LP Connectors...................................................................................... 36 
Figure 16: Space Factor of Mated Connector (Unit: mm)........................................................................ 37 
Figure 17: Top and Side Dimensions...................................................................................................... 42 
Figure 18: Bottom Dimension.................................................................................................................. 43 
Figure 19: Recommended Footprint (Top View)...................................................................................... 44 
Figure 20: Top and Bottom Views of FC909A......................................................................................... 45 
Figure 21: Recommended Reflow Soldering Thermal Profile.................................................................. 47 
Figure 22: Carrier Tape Dimension Drawing....................................................................................... 49 
Figure 23: Plastic Reel Dimension Drawing........................................................................................ 49 
Figure 24: Packaging Process................................................................................................................. 50 
 

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1Introduction

This document defines the FC909A and describes its air interfaces and hardware interfaces which are

connected with your application.

This document can help you quickly understand module interface specifications, electrical and

mechanical details, as well as other related information of the module. Associated with application notes

and user guides, you can use FC909A to design and set up applications easily.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to

Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference to

radio communications. However, there is no guarantee that interference will not occur in a particular

installation.

If this equipment does cause harmful interference to radio or television reception, which can be determined

by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more

of the following measures:

-- Reorient or relocate the receiving antenna.

-- Increase the separation between the equipment and receiver.

-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-- Consult the dealer or an experienced radio/TV technician for help.

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to

avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna

shall not be less than 20cm (8 inches) during normal operation.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Any changes or modifications not expressly approved by the party responsible forcompliance could void

the user's authority to operate this equipment. This transmitter must not be co-located or operating in

conjunction with any other antenna or transmitter.

Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.

2. This module is limited to installation in fixed applications, according to Part 2.1091(b).

3. The separate approval is required for all other operating configurations, including portable

configurations with respect to Part 2.1093 and different antenna configurations

4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify

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