Panasonic TH-42PM50U User manual

ORDERNO. MTNC050950C1

B19 Canada:B05

ProgressiveWidePlasmaDisplay

TH-42PM50U

GP8DU Chassis

SPECIFICATIONS

Specifications

Power

Source AC120 V, 50/60 Hz

Power

Consumption Maximum:380 W

Stand-bycondition :0.6W

Plasma

Displaypanel Drivemethod :ACtype42-inch, 16 :9aspectratio

Screen

Size Approx. 36 7/32 "(920mm)(W)×20 25/64 “(518 mm)(H)×41 9/16 “(1056 mm)(diagonal)

Dimensions

(W ×H×D) Approx. 42 3/64 “(1068 mm)×27 39/64 “(701 mm)×3 51/64 “(96.5mm)

Mass

(Weight) 71.871 lb. (32.6kg)Net

Sound

Speaker 4 23/32 “(120 mm)×2 23/64 “(60 mm)×2pcs 6

Audio Output 16 W [8W +8W ](10 %THD)

FEATURES

3DY/CFILTER HDMI

Accessories

Supplied Remotecontrol:EUR646539

AA Battery×2

ACCord

Pedestal

Cableclamper×2

Operating

Conditions Temperature:32 °F -104 °F (0° -40 °C)

Humidity:20 %-80 %(non-condensing)

Connection

Terminals AVINPUT1-2 VIDEO 1.0Vp-p (75 )

(Phono Jack Type)

S-VIDEO Y:1.0Vp-p (75 ), C:0.286 Vp-

)

(Mini DIN4-pin)

AUDIOL-R 0.5Vrms

(Phono Jack Type×2)

AVPROG. OUT VIDEO 1.0Vp-p (75 )

(Phono Jack Type)

AUDIOL-R 0.5Vrms

(Phono Jack Type×2)

COMPONENTVIDEO Y 1.0Vp-p (including

synchronization)

INPUT1-2 PB/PR± 0.35 Vp-p

AUDIOL-R 0.5Vrms

(Phono Jack Type×2)

HDMI HDMI typeAConnector

AUDIOL-R 0.5Vrms

(Phono Jack Type×2)

Note

Design

and Specificationsaresubjecttochangewithoutnotice. Weightand Dimensionsshownare

approximate.

1. Applicablesignals

2. SafetyPrecautions

2.1. General Guidelines

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

2.1.1. LeakageCurrentColdCheck

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturnpathtothechassis,

thereading shouldbebetween1M and 5.2M . / Whenthe

exposedmetal does nothaveareturnpathtothechassis, the

reading must be . Figure1

2.1.2. LeakageCurrentHotCheck (See Figure 1.)

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitors, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as shownin Figure 1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 orequivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed1/2

milliamp. Incase ameasurementisoutsideofthelimits specified,

thereisapossibilityofashock hazard, and theequipmentshould

berepairedand recheckedbeforeitisreturnedtothecustomer.

3. Prevention of ElectroStaticDischarge (ESD) to

ElectrostaticallySensitive(ES) Devices

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical

ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectro staticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischarging ESDwrist strap, which

shouldberemovedforpotential shock reasonspriortoapplying

powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas alminumfoil,

topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"can

generate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, alminumfoil orcomparable

conductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricity(ESD)sufficientto

damageanES device).

4. About lead free solder(PbF)

Note:Leadislistedas (Pb)intheperiodictableofelements.

Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.

TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).

ThatisTin(Sn), Silver(Ag)and Copper(Cu)although othertypes areavailable.

Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.

For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder

may beused.

PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol

stampedon theback ofPCB.

Caution

-Pbfree solderhas ahighermelting pointthanstandardsolder.

Typicallythemelting pointis50 ~70 °F(30~40 °C)higher. Please

use ahigh temperaturesoldering iron and set itto700 ±20 °F(370

±10 °C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100

°For600 °C).

Ifyou must use Pbsolder, please completelyremoveall ofthePb

free solderon thepinsorsolderarea beforeapplying Pbsolder. If

thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,

beforeapplying Pbsolder.

-Afterapplying PbF soldertodoublelayeredboards, please check

thecomponentsideforexcess solderwhichmayflow ontothe

opposite side. (see figurebelow)

SuggestedPbfree solder

Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu

(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan

alsobeused.

5. Service Hint

Board Name Function Board Name Function

PPowerSupply C1 DataDriver(Left)

PA DC-DC Converter, PowerSOS C2 DataDriver(Right)

PB AudioPower SC ScanDrive

HAV Terminal, AV Switch SU Scanout(Upper)

DV HDMIInterface

Noneserviceable.

DV-Board shouldbeexchangedfor

service.

SD Scanout(Lower)

SS SustainDrive

KRemotereceiver, Keyscan

DG Digital Signal Processor S PowerSwitch

ZSpeakerout, AudioAMP

DFormatConverter, PlasmaAI

Processor

6. Plasmapanel replacement method

6.1. RemovetheBack cover.

1. See Service hint(Section 5).

6.2. RemovetheP-Board.

Caution:

To removeP.C.B., wait1minute afterpowerwas off fordischarge

fromelectrolisiscapacitors.

1. Disconnect thecouplers(P2, P5, P9, P10, P11, P12, P23 and P25).

2. Removethescrews(×5 )and removetheP-Board.

6.3. RemovethePB-Board

1. Unlock thecableclamperstofree thecable.

2. Disconnect thecouplers(PB5and PB7).

3. Removethescrews(×3 )and removethePB-Boardmetal frame.

4. Removethescrews(×4 )and removethePB-Board.

6.4. RemovetheD-Board

1. RemovethePB-Board.

2. Disconnect thecouplers(D3, D5, D20 and D25) and

3. Disconnect theflexiblecables (D33 and D34).

4. Removethescrews(×4 )and removetheD-Board.

6.5. Removetherearterminal cover

1. Removethescrews(×4 , ×3 , ×2 , and ×1 ).

2. Removetherearterminal cover.

6.6. Removethemetal frame

1. Unlock thecableclamperstofree thecable.

2. Disconnect thecouplers(D3, D5, H7, P10 and PB7) and relay

connector(SP-Land SP-R).

3. Removethescrews(×5 )removethemetal frame.

6.7. RemovetheDV-Board

1. Unlock thecableclamperstofree thecable.

2. Removethescrews(×6 and ×1 ).

3. RemovetheDV-Board.

4. RemovetheDV-Boardunit.

(Becareful thecoupler(DV15) whenremovetheDV-Boardunit.)

6.8. RemovetheDG-Board

1. Unlock thecableclamperstofree thecable.

2. Disconnect thecouplers(DG3and DG5).

3. Disconnect theflexiblecables (DG1, DG2and DG20).

4. Removethescrews(×2 )and removetheDG-Board.

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