Panasonic Viera TX-32LMD70 User manual

Service Manual

Colour LCD Television

TX-32LMD70

TX-32LMD70F

TX-32LMD71F

TX-32LMD72F

TX-26LMD70

TX-26LMD70F

TX-26LMD71F

GLP22 Chassis

Specifications

(Informations in brackets [ ] refers to model 26“)

Power Source: 220-240V AC, 50Hz

Power Consumption 115W [100W]

Stand-by Power Consumption: 1.0W (TV ONLY)

13W (TV+DVB set to record)

Aerial Impedance: 75Ωunbalanced, Coaxial Type

Receiving System: LMD70 LMD70F

PAL-I, PAL-I/H, B/G, D/K

PAL-525/60 (AV only) SECAM B/G, D/K, L/L

DVB (via UHF aerial input) PAL-525/60 (AV only)

M.NTSC (AV only) DVB (via VHF/UHF aerial input)

NTSC (AV only) M.NTSC (AV only)

NTSC (AV only)

Receiving Channels: LMD70 LMD70F

UHF E21-E68 VHF E2-E12 VHF H1-H2 (ITALY)

VHF A-H (ITALY) VHF R1-R2

VHF R3-R5 VHF R6-R12

UHF E21-E69 CATV (S01-S05)

CATV S1-S10 (M1-M10) CATV S11-S20 (U1-U10)

CATV S21-S41 (Hyperband)

Operating Conditions: Temperature: 0°C ÷35°C

Humidity: 20% ÷ 80% RH (non condensing)

Scanning format: 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(60Hz), 720p(50Hz), 1.080i(60Hz),

1.080i(50Hz), 1.080p(60Hz), 1.080p(50Hz)

PC signals: VGA, SVGA, XGA, SXGA(compressed)

Horizontal scanning frequency 31 – 69 kHz

Vertical scanning frequency 59 – 86 Hz

ORDER No. PCZ0703017CE

Panasonic CS ( U.K. ) Ltd.

WILLOUGHBY ROAD,

BRACKNELL,

BERKS.,

RG12 8FT.

Intermediate Frequency:

Video/Audio LMD70 LMD70F

Video 38,9MHz 38,9MHz, 33,9MHz

Audio 32.90MHz 33,4MHz (B/G), 33,16MHz (A2)

32.35MHz(NICAM) 33,05MHz (NICAM B/G, D/K, L)

32,4MHz (D/K), 32,66MHz (CZ STEREO)

40,4MHz (L), 39,75MHz (L NICAM)

Colour 34,47MHz 34,47MHz (PAL)

34,5MHz, 34,65MHz (SECAM)

38,3MHz, 38,15MHz (SECAM L)

Terminals:

AV1 IN Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 10kΩ

RGB (21 pin) 0,7V p-p 75Ω

AV1 OUT Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 1kΩ

AV2 IN Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 10kΩ

RGB (21 pin) 0,7V p-p 75Ω

S-video IN (21-pin)Y: 1V p-p 75Ω

C:0,3V p-p 75Ω

AV2 OUT Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 1kΩ

AV3 IN S-Video IN (4-pin)Y: 1V p-p 75Ω

C:0,286V p-p 75Ω

Audio (RCAx2) 500mV rms 10kΩ

Video (RCAx1) 1V p-p 75Ω

HDMI1, HDMI2 Type A Connector

COMPONENT Video (RCAx3) Y:1V p-p 75Ω(including synchronization)

Pb, Pr: ±0,35V p-p 75Ω

AUDIO IN Audio (RCAx2) 500mV rms 10kΩ(for YUV; HDMI1)

AUDIO OUT Audio (RCAx2) 500mV rms 1kΩ(high Impedance)

PC HIGH-DENSITY D_SUB 15PIN R,G,B: 700mV p-p 75Ω

HD,VD:TTL Level 2-5V p-p (high impedance)

LCD screen: L5EDD8Q00029 [L5EDD6Q00023]

1366 x 768 XGA, 16:9

Visible Diagonal 800mm [660mm]

Audio Output: 20W (2x10W)

Headphones: 3,5mm (M3), 8ΩImpedance

Accessories supplied : Remote Control 2 x R6 (UM3) Batteries

Dimensions: Height: Width: Depth:

Including TV stand 615mm 791mm 248mm

[525mm] [657mm] [216mm]

TV set only 563mm 791mm 117mm

[473mm] [657mm] [117mm]

Net weight: 18kg [14kg]

Specifications are subject to change without notice.

Weights and dimensions shown are approximate.

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not

contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products

powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the

product or products deal within this service information by anyone else could result in serious injury or death.

Warning

CONTENTS

SAFETY PRECAUTIONS.......................................................................... 4

GENERAL GUIDE LINES..................................................................... 4

TOUCH – CURRENT CHECK.............................................................. 4

PREVENTION OF ELECTROSTATIC DISCHARGE (ESD)

TO ELECTROSTATICALLY SENSITIVE (ES) DEVICES.......................... 5

ABOUT LEAD FREE SOLDER (PBF)........................................................ 6

SUGGESTED PB FREE SOLDER....................................................... 6

APPLICABLE SIGNALS............................................................................. 7

SERVICE HINTS ....................................................................................... 8

CHASSIS BOARD LAYOUT...................................................................... 9

SETTING INSPECTION............................................................................. 9

SELF-CHECK .......................................................................................... 10

POWER LED BLINKING TIMING CHART............................................... 11

SERVICE MODE FUNCTION.................................................................. 12

SERVICE ................................................................................................ 13

OPTION BYTES DESCRIPTION............................................................. 14

ADJUSTMENT METHOD ........................................................................ 15

WIRING DIAGRAM.................................................................................. 16

BLOCK DIAGRAMS................................................................................. 17

PARTS LOCATION.................................................................................. 20

REPLACEMENT PARTS LIST................................................................. 22

SCHEMATIC DIAGRAMS........................................................................ 42

AP-BOARD SCHEMATIC DIAGRAM................................................ 43

G-BOARD SCHEMATIC DIAGRAM................................................... 44

H-BOARD (1 OF 4) SCHEMATIC DIAGRAM..................................... 45

P-BOARD SCHEMATIC DIAGRAM................................................... 49

V-BOARD SCHEMATIC DIAGRAM ................................................... 50

DG-BOARD (1 OF 13) SCHEMATIC DIAGRAM................................ 51

CONDUCTOR VIEWS............................................................................. 64

Safety Precautions

General Guide Lines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated

or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.

4. Always ensure panel TKP0E16001 is correctly replaced before returning to customer (see Fig.1).

Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth

ground such as a water pipe, as shown in Fig. 2.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

Note:

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and

2.0 mA d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100

kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should

be repaired and rechecked before it is returned to the customer.

Fig. 2

PPLIANCES

EXPOSED

METAL PARTS

Resistance values in ohms (Ω)

R0=500

Ω

RS=1500

Ω

CS=0.22

10k

Ω

0.022

COLD

WATER PIPE

(EARTH GROUND)

V: Voltmetr or oscilloscope

(r.m.s. or peak reading)

Measuring network for TOUCH CURRENTS

Input resistance: ≥ 1M

Ω

Input capacitance: ≤ 200pF

Frequency range: 15Hz to 1MHz and d.c.respectively

NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms

U2(V)

Fig. 1

Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect

transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of

component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on

your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD

wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD

protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective

material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity

(ESD) sufficient to damage an ES device).

There are special components used in this equipment which are important for safety.

These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that

these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do

not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,

we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

•Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)

higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

•Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before

applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

•After applying PbF solder to double layered boards, please check the component side for excess solder which may

flow onto the opposite side. (see Fig.3)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)

Fig.3

Fig.4

Applicable signals

Signal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 ×400 @70 Hz 31.47 70.07

640 ×480 @60 Hz 31.47 59.94

640 ×480 @75 Hz 37.50 75.00

800 ×600 @60 Hz 37.88 60.32

800 ×600 @75 Hz 46.88 75.00

800 ×600 @85 Hz 53.67 85.06

852 ×480 @60Hz 31.44 59.89

1,024 ×768 @60Hz 48.36 60.00

1,024 ×768 @70Hz 56.48 70.07

1,024 ×768 @75Hz 60.02 75.03

1,024 ×768 @85Hz 68.68 85.00

1,280 ×1,024 @60Hz 63.98 60.02

1,366 ×768 @60Hz 48.39 60.04

Macintosh 13“ (640 ×480) 35.00 66.67

Macintosh 16“ (832 ×624) 49.73 74.55

Macintosh 21“ (1,152 ×870) 68.68 75.06

Note:

•Signals other than above may not be displayed properly.

•The above signals are reformatted for optimal viewing on your display.

•Applicable input signal for PC is basically compatible to VESA standard timing.

•PC signal is magnified or compressed for display, so that it may not be possible to show fine detail

with sufficient clarity.

Signal name COMPONENT HDMI

525 (480) / 60i * *

525 (480) / 60p * *

625 (576) / 50i * *

625 (576) / 50p * *

750 (720) / 60p * *

750 (720) / 50p * *

1,125 (1,080) / 60i * *

1,125 (1,080) / 50i * *

1,125 (1,080) / 60p *

1,125 (1,080) / 50p *

Component (Y, Pb, Pr), HDMI

PC (D-sub 15P)

Service Hints

How to remove the backcover

Remove the 18[16] fixing screws. (see Fig.5)

How to remove the Pedestal assembly

Lay the main unit face down. (see Fig.6)

Remove the 4 fixing screws and the pedestal assembly. (see Fig.7)

Fig.6

Fig.7

SCREWS

SCREWS SCREWS

Fig.5

Chassis Board Layout

Setting Inspection

Voltage Confirmation

Board Name Function

AP-Board Power Supply Regulator

DG-Board Global Core, HDMI, IDTV Processor, D/A Converter

G-Board Side AV Connector

H-Board AV Connector, TV tuner, AV Switch

P-Board Main Input, Power Supply, Main Switch

V-Board Remote Receiver, LED IR, Cats

V-BOARD

AP-BOARD

DG-BOARD

H-BOARD

P-BOARD

G-BOARD

AP board Normal mode

Test point Description Voltage

TP3805 Sub_5V 5,04V ± 0,25V

TP3802 Panel5/12V 12,13V ± 0,45V

TP3804 Sound_Vcc 15,10V ± 0,45V

TP3808 9V 8,93V ± 0,25V

TP3810 STBY_5V 5,0V ± 0,25V

Standby mode

TP3805 Sub_5V max 2V

TP3802 Panel5/12V max 2V

TP3804 Sound_Vcc max 2V

TP3808 9V 8,93V ± 0,25V

TP3810 STBY_5V 5,0V ± 0,25V

Active standby

TP3805 Sub_5V 5,04V ±0,25V

TP3802 Panel5/12V max 2V

TP3804 Sound_Vcc max 2V

TP3808 9V 8,93V ± 0,25V

TP3810 STBY_5V 5,0V ± 0,25V

P board Normal mode

Test point Description Voltage

TP852 24V 24,5V ± 1V

Standby mode

TP852 24V 24,5V ± 1V

Confirm the following voltages:

Self Check

Self-check is used to automatically check the bus lines and hexadecimal code of the TV set. To enter Self-Check mode, keep

pressing the down (-/v) button on the TV set and press the STATUS button on the remote control. To exit Self Check,

switch off the TV set at the power button.

Display Ref. No. Description P.C.B.

ADV IC4510 A/D CONVERTER DG-Board

VSW IC3001 AV SWITCH H-Board

ADAV IC2106 AUDIO PROCESSOR H-Board

ASW IC3101 AV SWITCH H-Board

TUN1 TU3200 ANALOG TUNER H-Board

GENX IC1100 MICROPROCESSOR DG-Board

MEM1 IC1101 EEPROM DG-Board

MEM2 IC8601 EEPROM DG-Board

D-TUN TU8301 DIGITAL TUNER DG-Board

OFDM IC8301 COFDM DEMODULATOR DG-Board

If the CCU

orts have been checked and found to be incorrect or not located then " - - " will a

ear in

lace of "O.K.".

SUM

OPTION 1

OPTION 2

OPTION 3

CHECK

MODEL ID

1896

03030000

00000002

186b

03090000

00000002

DV O.K.

VSW O.K.

DAV O.K.

SW O.K.

TUN1 O.K.

GENX O.K.

MEM1 O.K.

MEM2 O.K.

D-TUN O.K.

OFDM O.K.

PEAKS-SOFT 1.020

PEAKS-EEP 01.00.0022

GenX-SOFT 1.00.00

GenX-EEP 1.02.00

GenX-ROMCORR 1.01.00

Self Check Com

lete

26 Panasonic 2007LCD 26lsd70.dat:000055

1895

03030000

00000004

DV O.K.

VSW O.K.

DAV O.K.

SW O.K.

TUN1 O.K.

GENX O.K.

MEM1 O.K.

MEM2 O.K.

D-TUN O.K.

OFDM O.K.

PEAKS-SOFT 1.020

PEAKS-EEP 01.00.0021

GenX-SOFT 1.00.00

GenX-EEP 1.02.00

GenX-ROMCORR 1.01.00

SUM

OPTION 1

OPTION 2

OPTION 3

CHECK

MODEL ID

32 Self Check Complete

Panasonic 2007LCD 32lsd70.dat:000066

DV O.K.

VSW O.K.

DAV O.K.

SW O.K.

TUN1 O.K.

GENX O.K.

MEM1 O.K.

MEM2 O.K.

D-TUN O.K.

OFDM O.K.

2.020

02.00.0013

1.00.00

1.02.00

1.01.00

PEAKS-SOFT

PEAKS-EEP

GenX-SOFT

GenX-EEP

GenX-ROMCORR

SUM

OPTION 1

OPTION 2

OPTION 3

CHECK

MODEL ID

Self Check Complete

26 Panasonic 2007LCD 26lsd70.dat:000055

2.020

02.00.0012

1.00.00

1.02.00

1.01.00

186a

0309000

0000004

DV O.K.

VSW O.K.

DAV O.K.

SW O.K.

TUN1 O.K.

GENX O.K.

MEM1 O.K.

MEM2 O.K.

D-TUN O.K.

OFDM O.K.

PEAKS-SOFT

PEAKS-EEP

GenX-SOFT

GenX-EEP

GenX-ROMCORR

SUM

OPTION 1

OPTION 2

OPTION 3

CHECK

MODEL ID

32 Self Check Complete

Panasonic 2007LCD 32lsd70.dat:000066

TX-26LMD70

TX-32LMD70

TX-26LMD70F

TX-32LMD70F

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