Panasonic DMR-EH50EB User manual

ORDERNO.DSD0503040C2

DVDVideo Recorder

DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG

Vol.1

Colour

(K).......................Black Type

(S).......................Silver Type

SPECIFICATIONS

Unauthorized copying and distribution isaviolation of law.

1. Safety precautions

1.1. General guidelines

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.1.1. Leakage current coldcheck

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to the chassis,

the reading shouldbe between 1M and 5.2M . / When the

exposed metal does not have areturn path to the chassis, the

reading must be . Figure 1

1.1.2. Leakage current hot check / (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1.

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliampere. Incase ameasurement isoutside of the limits

specified, there isapossibilityof ashock hazard, and the

equipment shouldbe repaired and rechecked before itisreturned

to the customer.

2. Prevention of Electrostatic Discharge (ESD) to

Electrostatic Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostatic Sensitive (ES) Devices. Examples of typical ES

devices are integratedcircuits and some field-effect transistor-sand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as aluminum

foil, to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, aluminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricitysufficient to damage

an ES device).

3. Precaution of Laser Diode

4. Handling the Lead-free Solder

4.1. About lead free solder (PbF)

Distinction of PbF P.C.B.:

P.C.B.s (manufactured) using leadfree solderwill have a PbF stampon the P.C.B.

Caution:

-Pb free solder has ahigher melting point than standard solder;

Typicallythe melting point is50 -70°F (30 -40°C)higher. Please

use ahigh temperature soldering iron. Incase of the soldering

iron with temperature control, please set itto 700 ± 20°F (370 ±

10°C).

-Pb free solder will tend to splash when heated too high (about

1100°F/600°C).

-When soldering or unsoldering, please completelyremove all of

the solder on the pins or solder area, and be sure to heat the

soldering points with the Pb free solder until itmelts enough.

5. Each Button

6. New Feature

6.1. Quick start function(REC)

1. General

Afew seconds after tuning on the unit,you can start recording

to DVD-RAM,HDD.

You can switch the operation of thisfunction (ON/OFF) on the

menu screen. .

2. Quick start(REC)principle

Inthe power-off at Quick start, onlypower supplies for video

IC,tuner and storage mediaare cut off.

When the RECbutton ispushed afew second after the

power button ispushed, Audioand Video data are stored in

DDR SDRAMbefore astorage media(DVD-RAMor HDD)

preparation.

*Preparation time DVD-RAM: Fabout 8seconds

HDD:about 18seconds

After astorage media(DVD-RAMor HDD)

preparation,Audioand Video data are transfer from DDR SDRAM

to the storage media.

7. Taking out the Disc from RAM-Drive Unit when the

Disc cannot be ejected by OPEN/CLOSE button

7.1. ForcibleDisc Eject

7.1.1. When the powercan be turned off.

1. Turn off the power and press [STOP] [CH UP] keyson the front

panel simultaneouslyfor 5seconds.

7.1.2. When the powercan not be turned off.

1. Press [POWER]keyon the front panel for over 10 seconds to turn

off the power forcibly, and press [STOP] [CH UP] keyson the front

panel simultaneouslyfor 5seconds.

7.2. When the ForcibleDisc Eject can not be done.

1. Turn off the power and pull out AC cord.

2. Remove the Top Case.

3. Remove the Front Panel.

4. Remove 4screwsand Upper Base Unitfrom DVD-RAMDrive.

5. Take out the disc and put the Opener Roller on fullyposition for

direction of Arrow.

6. Put the Upper Base Unitso that the Opener Roller isinserted into

the groove.

7. Check Opener Roller isseen through the Opener position

Checking Hole, and tighten 4screws.

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