Panasonic KX-TEA308NE User manual

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KX-TEA308NE

KX-TE82460NE

KX-TE82492NE

KX-TE82493NE

KX-A227X

(for Europe)

Advanced Hybrid System

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.

Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.

When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and how

it might be permissible to use Pb solder during service and repair work.

ORDER NO. KMS0507104CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4

1.1. SUGGESTED PbF SOLDER 4

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS

USED 5

2 FOR SERVICE TECHNICIANS 7

3 CAUTION 8

3.1. SAFETY PRECAUTIONS 8

3.2. INSULATION RESISTANCE TEST 8

3.3. BATTERY CAUTION 8

3.4. CAUTION 8

4 SPECIFICATIONS 9

4.1. GENERAL DESCRIPTION 9

4.2. CHARACTERISTICS 9

4.3. SYSTEM CAPACITY 9

5 SYSTEM OVERVIEW 10

5.1. SYSTEM COMPONENTS 10

5.2. SYSTEM CONNECTION DIAGRAM 11

6 NAMES AND LOCATIONS 12

7 CONNECTION 12

7.1. SERIAL INTERFACE CONNECTION 12

8 DISASSEMBLY INSTRUCTIONS 13

8.1. DISASSEMBLY INSTRUCTION 13

9 BLOCK DIAGRAM 15

9.1. SYSTEM BLOCK DIAGRAM 15

9.2. POWER BLOCK DIAGRAM 16

9.3. KX-TEA308NE MAIN BLOCK DIAGRAM 16

9.4. KX-TEA308NE CO BLOCK DIAGRAM 17

9.5. KX-TEA308NE POWER SUPPLY UNIT BLOCK

DIAGRAM 17

10 EXPLANATION OF BLOCK DIAGRAM 18

10.1. MAIN UNIT (KX-TEA308NE) 18

11 CIRCUIT OPERATION 20

11.1. POWER SUPPY CIRCUIT 20

11.2. CO INTERFACE CIRCUIT 21

11.3. CROSS POINT SWITCH CIRCUIT 26

11.4. INTERCOM CIRCUIT 28

11.5. POWER FAILURE THROUGH CALL SWITCHING

CIRCUIT 29

11.6. DATA COMMUNICATION CIRCUIT 29

11.7. CONTROL CIRCUIT 31

11.8. TONE GENERATOR CIRCUIT 31

11.9. DTMF GENERATOR CIRCUIT 32

11.10. DTMF RECEIVER CIRCUIT 32

11.11. INT CALLID INTERFACE CIRCUIT 33

11.12. MODEM INTERFACE CIRCUIT 33

11.13. USB INTERFACE CIRCUIT 34

11.14. OGM INTERFACE CIRCUIT 34

11.15. RINGING SIGNAL GENERATOR CIRCUIT 35

11.16. SMDR INTERFACE CIRCUIT 35

11.17. DOORPHONE CARD INTERFACE (KX-TE82460NE) 36

11.18. BUILT IN VOICE MESSAGE CARD INTERFACE (KX-

TE82492NE) 36

11.19. CALL ID CARD INTERFACE (KX-TE82493NE) 37

12 TROUBLESHOOTING GUIDE 38

12.1. NO OPERATION (Check POWER SUPPLY BOARD,

MAIN BOARD and 2AP BOARD) 38

12.2. NO DIAL TONE 39

12.3. CANNOT DIAL 40

12.4. CANNOT CALL EXTENSION 41

12.5. CANNOT USE PROPRIETARY TELEPHONE 41

12.6. CANNOT RECEIVE INCOMING CALL 41

12.7. CANNOT SEND DTMF DIALING 42

12.8. CANNOT RECEIVE CALL DIAL TONE 42

12.9. CANNOT SEND A HOLD ON MUSIC 43

13 IC DATA 44

13.1. IC700 44

13.2. IC7 46

13.3. IC8 46

14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES 47

15 HOW TO REPLACE A FLAT PACKAGE IC 48

15.1. PREPARATION 48

15.2. REMOVAL PROCEDURE 48

15.3. INSTALLATION PROCEDURE 48

15.4. REMOVING SOLDER FROM BETWEEN PINS 48

16 FIXTURES AND TOOLS 49

17 CABINET AND ELECTRICAL PARTS LOCATION 50

18 ACCESSORIES AND PACKING MATERIALS 51

19 REPLACEMENT PARTS LIST (KX-TEA308NE) 52

19.1. CABINET AND ELECTRICAL PARTS 52

19.2. ACCESSORIES AND PACKING MATERIALS 52

19.3. MAIN BOARD PARTS 52

19.4. CO BOARD PARTS 59

19.5. POWER SUPPLY BOARD PARTS 62

19.6. FIXTURES AND TOOLS 63

20 FOR THE SCHEMATIC DIAGRAM 64

21 SCHEMATIC DIAGRAM (KX-TEA308NE) 66

21.1. MAIN No.1 (Extention A-D Block) 66

21.2. MAIN No.2 (Extention E-H Block) 70

21.3. MAIN No.3 (Cross-Point Block) 74

21.4. MAIN No.4 (ASIC, Memory Block) 78

21.5. MAIN No.5 (CO Block) 82

21.6. POWER SUPPLY 86

22 PRINTED CIRCUIT BOARD (KX-TEA308NE) 87

22.1. MAIN BOARD 87

22.2. CO BOARD 89

22.3. POWER SUPPLY 91

23 KX-TE82460NE (2-PORT DOORPHONE CARD) 92

23.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS

USED 93

23.2. LOCATION OF OPTIONAL CARDS 94

CONTENTS

Page Page

KX-TEA308NE

23.3. DOORPHONE/DOOROPENER CARD BLOCK DIAGRAM

23.4. EXPLANATION OF BLOCK DIAGRAM/CIRCUIT

OPERATIONS 95

23.5. TROUBLESHOOTING GUIDE 96

23.6. IC DATA 97

23.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND

DIODES 98

23.8. ACCESSORIES AND PACKING MATERIALS 98

23.9. REPLACEMENT PARTS LIST (KX-TE82460NE) 99

23.10. FOR THE SCHEMATIC DIAGRAM 101

23.11. SCHEMATIC DIAGRAM (KX-TE82460NE) 102

23.12. PRINTED CIRCUIT BOARD (KX-TE82460NE) 104

24 KX-TE82492NE (2-CHANNEL VOICE MESSAGE CARD) 105

24.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS

USED 106

24.2. LOCATION OF OPTIONAL CARDS 107

24.3. BLOCK DIAGRAM 108

24.4. CIRCUIT OPERATIONS 109

24.5. TROUBLESHOOTING GUIDE 110

24.6. IC DATA 112

24.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND

DIODES 113

24.8. ACCESSORIES AND PACKING MATERIALS 113

24.9. REPLACEMENT PARTS LIST (KX-TE82492NE) 114

24.10. FOR THE SCHEMATIC DIAGRAM 115

24.11. SCHEMATIC DIAGRAM (KX-TE82492NE) 116

24.12. PRINTED CIRCUIT BOARD (KX-TE82492NE) 118

25 KX-TE82493NE (3-PORT CALLER ID CARD) 119

25.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS

USED 120

25.2. LOCATION OF OPTIONAL CARDS 121

25.3. BLOCK DIAGRAM 122

25.4. CIRCUIT OPERATIONS 122

25.5. TROUBLESHOOTING GUIDE 123

25.6. IC DATA 124

25.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND

DIODES 126

25.8. ACCESSORIES AND PACKING MATERIALS 126

25.9. REPLACEMENT PARTS LIST (KX-TE82493NE) 127

25.10. FOR THE SCHEMATIC DIAGRAM 129

25.11. SCHEMATIC DIAGRAM (KX-TE82493NE) 130

25.12. PRINTED CIRCUIT BOARD (KX-TE82493NE) 132

26 KX-A227X (BACK-UP BATTERY CABLE) 133

26.1. ACCESSORIES AND PACKING MATERIALS 134

26.2. REPLACEMENT PARTS LIST (KX-A227X) 135

KX-TEA308NE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that

contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),

Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair

work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

•

• •

• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please

be careful not to heat too long.

•

• •

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).

•

• •

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

and be sure that any remaining is melted prior to applying the Pb solder.

•

• •

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

1.1. SUGGESTED PbF SOLDER

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,

(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the

manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other

materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

KX-TEA308NE

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

KX-TEA308NE

2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on the worktable.

4. Do not touch IC or LSI pins with bare fingers.

KX-TEA308NE

3 CAUTION

3.1. SAFETY PRECAUTIONS

1. Before servicing, unplug the power cord to prevent an electric shock.

2. When replacing parts, use only the manufacturer´s recommended components for safety.

3. Check the condition of the power cord. Replace if wear or damage is evident.

4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.

5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent

the customer from being exposed to shock hazards.

3.2. INSULATION RESISTANCE TEST

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.

2. Turn on the power switch.

3. Measure the resistance value with ohmmeter between the jumpers AC plug and each exposed metal cabinet part, such as

screw threads, control shafts, handle brackets, etc.

Note:

Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired and

rechecked before it is returned to the customer.

3.3. BATTERY CAUTION

1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the

manufacturer. Dispose of used batteries according to the manufacturer’s Instructions.

2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location

when replacing it and soldering the replacement lithium battery in.

3.4. CAUTION

The power socket wall outlet should be located near this equipment and be easily accessible.

KX-TEA308NE

4 SPECIFICATIONS

4.1. GENERAL DESCRIPTION

Control Bus Original bus (16-bit, 24 MHz)

Switching Space Division CMOS Crosspoint Switch

Power Input 100 V AC to 240 V AC, 0.8A to 0.4A, 50 Hz/60Hz

External Battery +24 V DC (+12 V DC x 2)

Maximum Power Failure Tolerance 300 ms (without using backup batteries)

Memory Backup Duration 7 years

Dialling Outside (CO) Line Pulse (10 pps, 20 pps) or Tone (DTMF)

Extension Pulse (10 pps, 20 pps) or Tone (DTMF)

Intercom Path 3

Mode Conversion Pulse-DTMF

Ring Frequency 20 Hz/25 Hz (selectable)

Operating Environment Temperature 0°Cto40°C

Humidity 10 % to 90 % (non-condensing)

Conference Call Outside (CO) Line 2

Music on Hold (MOH) 1 port

Selectable MOH: Internal/External/Tone

Paging Internal 1

Extension 1 port

Serial Interface Port RS-232C 1

USB 1.1 1

Extension Connection Cable SLT 1 pair wire (T, R)

PT 2-pair wire (T, R, H, L)

DSS Console 1-pair wire (H, L)

Dimension 249 mm (W) x 316 mm (H) x 73 mm (D)

Weight (when fully expanded) Approx. 1.8 kg

4.2. CHARACTERISTICS

Terminal Equipment Loop Limit PT 40 Ω

SLT 600 Ωincluding set

Doorphone 20 Ω

Minimum Leakage Resistance 15000 Ωminimum

Maximum Number of Extension

Instruments per Line

1 PT or SLT in standard connection

1 PT and 1 SLT in parallel connection

Ring Voltage 65 Vrms at 20 Hz/25 Hz depending on the ringing load

Outside (CO) Line Loop Limit 1600 Ωmaximum

Hookswitch Flash/Recall Timing Range 24 ms-2032 ms

Door Opener Current Limit 30 V DC/30 V AC, 3 A maximum

Paging Terminal Impedance 600 Ω

MOH Terminal Impedance 10000 Ω

4.3. SYSTEM CAPACITY

4.3.1. System Capacity

KX-TEA308

Basic System Outside (CO) line 3

Extensions for PT/SLT 8

KX-TEA308NE

4.3.2. Maximum Cards Terminal Equipment

ltem KX-TEA308

PT 8

SLT 8

2-Port Doorphone Card 1

3-Port Caller ID Card 1

2-Channel Voice Message Card 1

Doorphone 2

Door Opener 2

Pager 1

Music on Hold (MOH) 1

DSS Console 2

4.3.3. System Data

ltem Max. Quantity

Operator 1

System Speed Dialling 100

One-touch Dialling 24 per extension (PT)

Personal Speed Dialling 10 per extension

Call Park Area 10

Absent Message 6

Toll Restriction (TRS) COS 5

Extension Group 8

Message Waiting 8 per extension

Message for Built-in Voice Message 125 messages (total 60 minutes)

5 SYSTEM OVERVIEW

5.1. SYSTEM COMPONENTS

Model Description

Main Unit KX-TEA308NE Advances Hybrid System: 3 Outside (CO) Line, 8 Hybrid Extentions

Optional Service Cards KX-TE82460NE

KX-TE82492NE

KX-TE82493NE

2-Port Doorphone Card

2-Channel Voice Message Card

3-Port Caller ID Card

Proprietary Equipment KX-T30865

KX-A227X

Doorphone

Backup Battery Cable

KX-TEA308NE

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