Panasonic B01 User manual

ACCTF34E

2017.10 industrial.panasonic.com/ac/e/

B01

/ B02

High Current

Connectors

Operation manual

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

Contents

01.Introduction.............................................................................................2

02.Precautions for product design...............................................................3

03.Precautions for mounting and reflow soldering.....................................13

04.Precautions for mating and unmating ...................................................20

Points which particularly need to be confirmed before designing products

are bold and underlined.

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

01. Introduction

Our B2B connector for battery is designed for a high-performance and quick battery

charging of mobile device and a high electrical current of 6A(B01) or 10A(B02) is available.

Furthermore, the shape is ultra-small and low-profile design .

B01：stacking height of 0.6mm / 0.8mm , width of 2.4mm

B02：stacking height of 0.7mm , width of 2.2mm

This connector is designed for a high electrical current. Therefore, use the connector properly

on the basis of the connector’s specifications.

This connector is also designed with the durability and workability in mind.

However, the thickness of the molded part has been further reduced. Accordingly,

pay attention when using the connector and read this document before designing a product

and starting production.

B01 / B02 A35US

Application For Battery(Power) connect For Signalconnect

Space-saving

Excellent

Width:

B01:2.4mm

B02:2.2mm

Excellent

Width:

2.2mm

Low profile Excellent

Mated height

B01: 0.6mm/0.8mm

B02: 0.7mm

Excellent

Mated height

0.6mm

Wiring underneath Good

Exposed metal

part on the

rear face

Exposed

metal part

Good

Exposed metal

part on the

rear face

Exposed

metal part

Contact reliability Excellent Excellent

Drop resistance Very good Bellows-type

contact

With a thin plastic part Very good Bellows-type

contact

With a thin plastic part

Mountability Excellent

Header needs

special nozzle

Excellent

Header needs

special nozzle

Clicking feedback Excellent Excellent

2.2mm

0.6mm

Header

pickup

space:

0.8mm-

wide

bottom

Header

pickup

space:

0.7mm-

wide

bottom

B01：2.4mm

B02：2.2mm

B01：0.6mm

B02：0.7mm

/0.8mm

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

02. Precautions for product design

02-1. Considerations in mechanical design

1) Prevention of problems during use

(1)The connectors have a simple locking structure, but make sure to consider

preventive measures against the detachment of mated connectors during

practical use.

- Make sure to eliminate any gaps between the casing and board.

- We recommend that the holding force is set greater than the insertion force of

the connector.

- Select an appropriate cushioning material with a suitable shape and dimensions,

and hold down the connector at the center. (If the holding position is off the

center, it may cause detachment of mated connectors.)

Cushioning material

Casing

Sub-board

(flexible board)

Connector

Reinforcing plate

Motherboard

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

(2)If the board is insufficiently fixed as in the following drawing, the inertial

load applied to the connector may damage it. Pay attention to the following

points.

When an impact such as dropping as shown in the

drawing is applied:

(1) If both boards are not sufficiently fixed,

the connector will be damaged due to the

impact applied to the connector.

(2) In particular, if there is no gap between

the casing and sub-board (A<B), the sub-

board side will hit the casing wall first.

This impact may damage the connector.

Securely fix both the motherboard and sub-board.

(1) Fixing motherboard

(Prevents inertial movement by drop impact

by fixing the side with a greater mass.)

(2) Hold down the sub-board to prevent it from

moving using a rubber cushioning material,

etc.

(3) It is safer if board gaps are set to A≥B so as

to prevent shearing damage on deviation of

the board by impact.

A<B

○

≥

Sub-board

(FPC)

Connector

Casing

Motherboard

(not fixed)

Connector

Casing

Motherboard

(not fixed)

Holding cushion

Sub-board (FPC)

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

(3)To facilitate the mating of connectors, we recommend that you pay attention

to the following points when designing the motherboard.

- Provide a reference mark.

- Design a layout that allows easy-checking of the connector mating condition.

Examples of reference mark

Flexible board

Reinforcing plate

Motherboard

Provide a reference

mark:

-Silk printing

-Pattern (copper foil)

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

02-2. Precautions for board design

1) Circuit design

(1)When designing the terminal foot pattern, check the latest specifications and

examine the recommended foot pattern and dimensions of the metal mask opening.

The current recommendations are indicated on pages 12 to 15.

(2) The power terminal consists of 4 pins. When designing, in order to prevent an

excessive temperature rise, use 2 terminals for each positive terminal and negative

terminal of battery.

Pin assignment example（B01）

Pin assignment example（B02）

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

(3)This connector is provided with soldering metals for preventing solder from

peeling off the terminal.

Make sure to design a foot pattern for the holding metal.

(4)Pay attention to the following point as a pattern

peeling preventive measure when removing the

connector.

- Make the foot pattern length longer than the

coverlay opening.

In general, at least 0.3 mm.

(5)Foot pattern dimensions indicated in the drawings are

intended to achieve the minimum area on the premise

that the reflow-soldering process is used. For manual

soldering or for ensuring solder reworkability, make

a longer pattern at the terminal tip.

Soldering terminal

Socket

Header

- Secure space for applying the soldering

iron tip.

Terminal looseness and unwanted

solder creep are preventable by

applying the soldering iron tip here.

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

2) FPC board design

(1)Positions of connectors on the FPC

The FPC board is made by laminating a polyimide layer, copper foil, and adhesive

layers. Since each material has slightly different heat-shrinkable properties,

warpage may occur typically due the reflow heat in the following cases. This may

cause poor soldering. Make sure to arrange the board in a direction that minimizes

warpage.

■Example of the Assist carrier (ShinEtsu Polymer)

In case of a one-sided FPC board, warpage is

more likely to occur if a pattern is laid in a line,

or if the copper foil is applied over the entire

FPC board for noise-prevention purposes.

Since the FPC is soft, it is

difficult to keep it flat.

●Typical transfer jigs for the board

mounting process

- Magic resin (Daisho Denshi)

- Keiju board (Mitsubishi Resin)

- Assist carrier (ShinEtsu Polymer)

To keep the FPC board flat during

mounting, we recommend the use of a

“Sticky transfer jig” for the wiring board

mounting process.

Workpiece

(FPC board, etc.)

Elastomer

(Weak adhesive layer)

Elastomer

(Strong adhesive layer)

Substrate

Workpiece (FPC, etc.)

Assist carrier

Layout pin

STEP 1:

Provisional fixing of workpiece

STEP 2:

Mounting complete

STEP 3:

Removal of

workpiece

Removal pin

Operation manual for “High Current connectors B01/B02”

©Panasonic Corporation 2017 ACCTF34E 201710

Panasonic Corporation

Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

(2)FPC board specifications

Control the thicknesses of the coverlay and adhesive to prevent poor

soldering.

This connector has no stand-off.

Therefore, minimize the thickness of the coverlay, etc. so as to prevent the

occurrence of poor soldering.

If poor soldering occurs frequently, check the actual thickness of each insulation

layer. Generally, the coverlay thickness is set to about 30 μm, including the

adhesive. If the thickness exceeds 30 μm, design the board so as to remove the

coverlay under the connector.

(3)This connector is often used for connecting the motherboard and FPC board. In

this case, if the FPC board is too short, a load that causes deviation will be applied

to the connector.

Make sure to create a design that provides some allowance in the FPC board.

Connector

terminal

Solder

Molded part of the connector

Coverlay (polyimide)

Adhesive (epoxy adhesive recommended)

Copper foil

Base material (polyimide)

Reinforcing plate + Adhesive

(epoxy adhesive recommended)

NG: Too long

Fixed

Connector

NG: Too short

Positional deviation Motherboard

Part where FPC board

is fixed

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