Panasonic DMP-BD50EG User manual

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tion is a violation of law.

ORDER NO.DSD0806031CE

Blu-ray Disc Player

Model No. DMP-BD50EG

Vol. 1

Colour

(K).......................Black Type

TABLE OF CONTENTS PAGE PAGE

1 Safety Precautions -----------------------------------------------3

1.1. General guidelines-----------------------------------------3

2Warning--------------------------------------------------------------4

2.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatic Sensitive (ES) Devices---------------4

2.2. Precaution of Laser Diode -------------------------------5

2.3. Service caution based on legal restrictions----------6

3 Service Navigation------------------------------------------------7

3.1. Service Information----------------------------------------7

4 Specifications ------------------------------------------------------8

5 Location of Controls and Components--------------------9

6 Operating Instructions ----------------------------------------10

6.1. Taking out the Disc from BD Drive Unit when

the Disc cannot be ejected by OPEN/CLOSE

button--------------------------------------------------------10

7 Service Mode----------------------------------------------------- 11

7.1. Self-Diagnosis and Special Mode Setting---------- 11

8 Service Fixture & Tools ---------------------------------------21

9 Disassembly and Assembly Instructions---------------22

9.1. Unit-----------------------------------------------------------22

9.2. BD Drive----------------------------------------------------26

10 Measurements and Adjustments --------------------------31

10.1. Service Positions-----------------------------------------31

1 Safety Precautions

1.1. General guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage current cold check

1. Unplug the AC cord and connect a jumper between the

two prongs on the plug.

2. Measure the resistance value, with an ohmmeter,

between the jumpered AC plug and each exposed metal-

lic cabinet part on the equipment such as screwheads,

connectors, control shafts, etc. When the exposed metal-

lic part has a return path to the chassis, the reading

should be between 1MΩand 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be .

1.1.2. Leakage current hot check

(See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use

an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a

0.15μF capacitors, between each exposed metallic part

on the set and a good earth ground such as a water pipe,

as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-

tivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the volt-

age at each point.

5. Reverse the AC plug in the AC outlet and repeat each of

the above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a mea-

surement is outside of the limits specified, there is a pos-

sibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the cus-

tomer.

Figure 1

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive

(ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-

trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semi-

conductor chip components. The following techniques should be used to help reduce the incidence of component damage caused

by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-

ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient

to damage an ES device).

2.2. Precaution of Laser Diode

2.3. Service caution based on legal restrictions

2.3.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this

equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin

(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that

of the normal solder.

Definition of PCB Lead Free Solder being used

Service caution for repair work using Lead Free Solder (PbF)

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of PbF is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.

• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

Note

* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of PbF is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

3 Service Navigation

3.1. Service Information

4 Specifications

5 Location of Controls and Components

6 Operating Instructions

6.1. Taking out the Disc from BD Drive Unit when the Disc cannot be ejected

by OPEN/CLOSE button

6.1.1. Forcible Disc Eject

6.1.1.1. When the power can be turned off.

1. Turn off the power and press [SKIP FWD] and [PAUSE] keys on the front panel simultaneously for 5 seconds.

6.1.1.2. When the power can not be turned off.

1. Press [POWER] key on the front panel for over 10 seconds to turn off the power forcibly, and press [SKIP FWD] and [PAUSE]

keys on the front panel simultaneously for 5 seconds.

6.1.2. When the Forcible Disc Eject can not be done.

1. Turn off the power and pull out AC cord.

2. Remove the Top Cover and BD Drive.

3. Insert Eject Pin (JZS0484) into the hole on the bottom of BD Drive and slide the Eject Pin in the direction of the arrow to eject

tray slightly.

4. Pull out tray by hand.

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