CONTENT
1 DESCRIPTION AND OPERATION OF THE DEVICE AND ITS COMPONENTS.........................5
1.1 The purpose of the device...............................................................................................................5
1.2 Technical characteristics of the device ...........................................................................................5
1.3 Standard delivery set.......................................................................................................................7
1.4 Purpose of the probes......................................................................................................................7
1.5 Parts.................................................................................................................................................8
1.5.1 Ultrasonic Contact Impedance Probe U1 probe.....................................................................10
1.5.2 Leeb probe..............................................................................................................................10
1.6 Design and functioning.................................................................................................................11
1.6.1 Modes.....................................................................................................................................11
1.6.2 Leeb measurement principle (Leeb) ......................................................................................12
1.6.3 Ultrasonic Contact Impedance method..................................................................................12
1.7 Means of measurement, tools and accessories..............................................................................13
1.8 Marking and sealing......................................................................................................................13
1.9 Packing..........................................................................................................................................13
2 INTENDED USE.................................................................................................................................14
2.1 Operational limitations..................................................................................................................14
2.2 Preparing the device for use..........................................................................................................14
2.2.1 Visual inspection....................................................................................................................14
2.2.2 Installing the batteries............................................................................................................14
2.2.3 Connecting the Probe.............................................................................................................15
2.3 Using the device............................................................................................................................15
2.3.1 Preparing the object of testing ...............................................................................................15
2.3.2 Turning on..............................................................................................................................16
2.3.3 Charging the battery...............................................................................................................17
2.3.4 Measurements using Ultrasonic Contact Impedance Probe U1 probe...................................18
2.3.5 Measurements with the Rebound Leeb Probe........................................................................21
2.3.6 Measurement modes ..............................................................................................................24
2.3.7 Calibration..............................................................................................................................28
2.3.8 Settings...................................................................................................................................34
2.3.9 Archive...................................................................................................................................35
2.3.10 Memory card........................................................................................................................36
2.3.11 Information...........................................................................................................................36
2.3.12 Photo fixation of the measurements.....................................................................................37
2.3.13 Connecting to PC.................................................................................................................39
3 TECHNICAL MAINTENANCE OF THE PRODUCT AND ITS COMPONENTS .........................44
3.1 Security measures .........................................................................................................................44