MitraStar MIO-6706 User manual
Table of Contents
MIO-6706 User’s Guide
2
Table of Contents
Table of Contents .................................................................................................................................2
Chapter 1
Introduction...........................................................................................................................................3
1.1 MIO-6706 Overview ............................................................................................................................3
Chapter 2
The Development Kit ............................................................................................................................4
2.1 The Dimensions ..................................................................................................................................4
2.2 Connecting the Boards and Powering Up ...........................................................................................4
2.3 Connecting to a Computer and Starting Up ........................................................................................4
2.4 Other Information ................................................................................................................................7
2.5 Regulations/Certifications ...................................................................................................................8
Chapter 3
Wi-SUN Module Specifications............................................................................................................9
3.1 Wi-SUN Module PCB Size ..................................................................................................................9
3.2 Specifications ......................................................................................................................................9
3.3 Other Information ..............................................................................................................................10
3.4 Power Tree ........................................................................................................................................10
3.5 GPIO for Sub-1G TX/RX Switching ...................................................................................................10
3.6 Regulation/Certifications ...................................................................................................................10
MIO-6706 Quick Start Guide
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Chapter 1
Introduction
1.1 MIO-6706 Overview
The Wi-SUN (Wireless Smart Ubiquitous Network) Module Development Kit lets you try out the
MIO-6706 Wi-SUN Module.
The MIO-6706 is a Wi-SUN Module designed to be integrated with IoT sensors and gateways for
data transfer. The Wi-SUN network technology follows IEEE 802.15.4g/e and supports most
available sub-GHz frequencies. The Wi-SUN solution provides the advantages of long range
applications, low power, higher speed, hybrid mesh, and cost effectiveness. It provides open-
standards based secure, interoperable communications for large scale IoT, Smart Utility, and Smart
City networks.
MIO-6706 Quick Start Guide
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Chapter 2
The Development Kit
2.1 The Dimensions
The fixture board PCB size is 55 x 40 mm. The IO board PCB size is 75 x 70 mm.
2.2 Connecting the Boards and Powering Up
1Connect the fixture board and the IO board. Connect the included antenna to the IO board’s
antenna connector.
2Connect the Micro-USB port of the Development Kit to the included Micro-USB adapter.
3Connect the adapter to a proper power source to power up the Development Kit.
2.3 Connecting to a Computer and Starting Up
Follow the steps below to connect the Development Kit to a computer and start it up.
1Power up the Development Kit by following the steps in Section 2.2 on page 4.
2Connect the 4-pin UART port of the Development Kit to your computer’s USB port with an RS232
cable. Make sure the computer is powered on.
3You can access the Development Kit via various command tools in Linux and Windows
environments. The following example uses Windows 10 and Tera Term.
4In Windows, open Device Manager and check for a new COM port. COM8 is used in this example.
Chapter 2 The Development Kit
MIO-6706 Quick Start Guide
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Figure 1 New COM Port
5Open Tera Term and click Setup > Serial port....
Figure 2 Tera Term: Setup > Serial port...
Chapter 2 The Development Kit
MIO-6706 Quick Start Guide
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6Select the new COM port in the Port field.
Figure 3 Select Port
7Set the baud rate in the Speed field to 115200. Click OK to save the settings.
Figure 4 Set Speed
8The following screen appears. You can now start using commands for the Development Kit.
Chapter 2 The Development Kit
MIO-6706 Quick Start Guide
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Figure 5 Setup Complete
2.4 Other Information
Table 1 Other Information
1Environmental
Requirements
• Operating Temp: -20°C~+70°C
• Storage Temp: -30°C~+85°C
• Operating Humidity: 10% to 90% Non-Condensing
• Storage Humidity: 10% to 95% Non-Condensing
2 Other Requirements • Timer function
• Heat resistance and fireproofing
Chapter 2 The Development Kit
MIO-6706 Quick Start Guide
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2.5 Regulations/Certifications
Regulations (draft report only)
Table 2 Regulations/Certifications
COUNTRY/
REGION CERTIFICATION STANDARD FREQUENCY BAND BOM
U.S.A. FCC FCC Part 15C
§15.247
902 - 928 MHz 902 - 928 MHz
Taiwan NCC LP0002 §5.8 Taiwan, Asia Regions 920 - 925 MHz
MIO-6706 Quick Start Guide
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Chapter 3
Wi-SUN Module Specifications
3.1 Wi-SUN Module PCB Size
The Wi-SUN PCB size is 18 x 32 mm.
3.2 Specifications
Table 3 Wi-SUN Module Specifications
Frequency Band FCC: 902~928 MHz, NCC: 920~925MHz
Maximum Power
Consumption
400 mW
Link Rate Maximum is 300 kbps
Also support 50 kbps, 100 kbps, 150 kbps
TX FCC maximum peak conducted output power:
18.95 dBm at 50 kbps
18.96 dBm at 100 kbps
19.02 dBm at 150 kbps
18.99 dBm at 300 kbps
NCC maximum peak conducted output power:
18.98 dBm at 50 kbps
18.92 dBm at 100 kbps
11.28 dBm at 150 kbps
8.37 dBm at 300 kbps
RX Sensitivity in Wi-SUN mode:
-98 dBm at 50 kbps
-96 dBm at 100 kbps
-94 dBm at 150 kbps
-91 dBm at 300 kbps
Antenna Defined by customer
Chapter 3 Wi-SUN Module Specifications
MIO-6706 Quick Start Guide
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3.3 Other Information
3.4 Power Tree
The I O board provides + 3.3V power t o t he syst em .
3.5 GPIO for Sub-1G TX/RX Switching
Figure 6 Trut h Table
3.6 Regulation/Certifications
Regulat ions ( EVT Test on ly, no cert if icat e)
Table 4 Other Information
1Environmental
Requirem ent s
• Operat ing Tem p: - 2 0° C~ + 70° C
• St orage Tem p: - 3 0° C~ + 85° C
• Operat ing Hum idit y: 10% t o 90% Non - Con den sin g
• St orage Hum idit y: 10% to 95% Non- Condensing
2 Ot her Requirem ent s • Tim er funct ion
• Heat resist ance and fireproofing
Table 5 Regulations
CERTIFICATION STANDARD
FCC FCC Part 15C § 15.247
NCC LP0002 §5.8.
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