LG M2250D-PZM User manual
LCD MONITOR TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LD02D
MODEL : M2250D M2250D-PZM
M2250D-PCM
M2250D-PRM
North/Latin A erica http://aic.lgservice.co
Europe/Africa http://eic.lgservice.co
Asia/Oceania http://biz.lgservice.co
Internal Use Only
P/NO : MFL63642131(1012-REV00) Printed in Korea
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
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CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTIONS .........................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM...................................................................................21
EXPLODED VIEW .................................................................................. 22
SCHEMATIC CIRCUIT DIAGRAM...............................................................
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Ge eral Guida ce
An isolatio Tra sformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. se a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before retur i g the receiver to the customer,
always perform an AC leakage curre t check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Curre t Cold Check(A te a Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Curre t Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do ot use a li e Isolatio Tra sformer duri g this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Curre t Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
COND IT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 4 -
CA TION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. nless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
nless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures s ecified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Se sitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. se only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. se only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. se a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. se an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. se a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. se the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CA TION: Work quickly to avoid overheating the circuit
board printed foil.
6. se the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 5 -
IC Remove/Replaceme t
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Re lacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Sig al" Discrete Tra sistor
Removal/Replaceme t
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a " " shape the end of each of three leads remaining
on the circuit board.
3. Bend into a " " shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the " " with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Tra sistor Device
Removal/Replaceme t
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replaceme t
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse a d Co ve tio al Resistor
Removal/Replaceme t
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. ( se this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small " " in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
se the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Applicatio Ra ge.
This spec sheet is applied all of the LCD Monitor TV TV used
LD02D chassis.
2. Specificatio
Each part is tested as below without special appointment
2.1 Temperature : 25 °C ± 5 °C (77 °F ± 9 °F),
CST : 40 °C ± 5° C
2.2 Relative Humidity : 65 % ±10 %
2.3 Power Voltage : Standard input voltage
(100 V - 240 V ~, 50 / 60 Hz)
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 5 minutes prior to
the adjustment.
3.Test method
1) Performance :
LGE TV test method followed
2) Demanded other specification
- Safety : CE,IEC specification
- EMC : CE,IEC specification
4. Module Specificatio
4.1. General Features
Model Market Appliance
Safety : IEC/ EN60065
M2250D E EMI :EN55013
(PAL /DVB Market) EMS : EN55020
No Item Specification nit Remark
1 Panel Size 546.86mm(22.53 inches)
2 Panel Type TN
3 Operating Mode Normally White
4 Backlight nit White LED
5 Max Resolution 1920 x 1080
6 Pixel Pitch 0.248(H) x 0.248(V)
7 Interface LVDS 2Port
8 Color depth 16.7M (6bit+A FRC)
LGD/ LM215WF4-TLE1 ( P/ N : EAJ61747701), A O / LM215WF4-TLE1 ( P/ N : EAJ61349501)
No. Item Specification LGD-Min. LGD-Typ. A O-Min. A O-Typ.
1 Viewing Angle[CR>10] Right/Left 70/70 85/85 75/75 85/85
p/Down 60/70 75/85 70/70 80/80
2 Luminance Luminance (cd/m2) 200 250 200 250
Variation(%) 75 % 80 %
3 Contrst Ratio CR 700 1000 600 1000
4 Color Coordinates RED Rx- 0.637 -
Ry- 0.330 -
Green Gx- 0.310 -
Gy- 0.620 -
Blue Bx- 0.153 -
By- 0.067 -
White Wx- 0.313 -
Wy- 0.329 -
4.2. Optical Spec.
- 7 -
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
No Item Specification Remarks
- DTV & Analog (Total 36 countries)
- DTV (MPEG2/4, DVB-T) : 29 countries
(England/Italy/Germany/France/Spain/Sweden/Finland/
Netherlands/ Belgium/Luxemburg/ Greece/Denmark/Czech/
1 Market E (PAL Market-36Countries) Austria /Hungary/Swiss/Croatia/Turkey//Norway/Slovenia/
Poland/ kraine/Portugal/Ireland/Moroco/Latvia/Estonia/
Lithani/Rumania
- DTV (MPEG2/4, DVB-C): 2 countries (Sweden/Finland)
- Analog Only - 7 countries (Russia/Slovakia/Bosnia/Serbia/
Bulgaria/Albania/Kazakhstan
1) PAL-BG
2) PAL-DK
2 Broadcasting system 3) PAL-I/I’
4) SECAM L/L’
5) DVB-T/ C
3 Receiving system Analog : pper Heterodyne DVB-T
Digital : COFDM, QAM DVB-C
4 Scart Jack (1EA) PAL, SECAM Scart Jack is Full scart and support RF-O T(ATV)
5 Component Input (1EA) Y/Cb/Cr , Y/Pb/Pr
6 RGB Input RGB-PC Analog (D-S B 15Pin)
7 HDMI Input (2EA) HDMI1/2 Rear / HDMI version 1.3/ support PC
8 Audio Input (3EA) RGB Audio, Component, SCART L/R Input
9 SPDIF out (1EA) SPDIF out
10 Earphone out (1EA) Antenna, AV, Component, RGB, HDMI
11 SB (1EA) Picture, Music, Movie, SVC Software pdate + Picture + Music + Move
12 RS-232C (1EA) Commercial Mode
13 Local Key (Touch) INP T, MEN , OK,
F
VOL
G
,
E
PR
D
, POWER ON/OFF
5. Ge eral specificatio
5.1 TV
5.2 RGB(PC)
No Item Specification Remarks
1 Supported Sync. Type Separate Sync., Digital
2 Operating Frequency Analog Horizontal 30 ~ 83kHz
Vertical 56 ~ 75 Hz
Digital Horizontal 30 ~ 83kHz
Vertical 56 ~ 75 Hz
3 Resolution Analog Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
Digital Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
4 Operating Environment Temp : 10°C ~ 35°C
Humidity : 20 % ~ 80 %
5 Storage Environment Temp : -10°C~60°C non condensing
Humidity : 5 % ~ 90 % non condensing
- 8 -
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
No Item Min Typ Max Remark
1. C30:Cool White Balance,X axis 0.253 0.283 0.313 DQA :±0.03 Measurement Condition
(9300k) White Balance,Y axis 0.268 0.298 0.328 DQA :±0.03 PSM :Outgoing condition
2. 0: Medium White Balance,X axis 0.263 0.295 0.325 DQA :±0.03 Input signal : white pattern(85 IRE)
(8000k) White Balance,Y axis 0.275 0.305 0.335 DQA :±0.03 Pattern number : 78 (MSPG series)
3. W30: Warm White Balance,X axis 0.283 0.313 0.343 DQA :±0.03 Equipment : CA-210 (Ch. 14 WLED)
(6500k) White Balance,Y axis 0.299 0.329 0.359 DQA :±0.03 or equivalent device.
6. Optical Specificatio of SET
6.1 Color coordinate
** The W/B Tolerance is ±0.01 for Adjustment, but for DQA ± 0.03
6.2 Luminance and Contrast Ratio
- PC Mode
No. Item Luminance(cd/m2) C/R Remark
Min Typ Max Min Typ
- Measurement Condition(after 30min aging)
DFC : 5M:1 (Min: 4M:1)
- Picture setting : Outgoing condition
1 M19/22/23/24/2550D 180 200 - 800 1000 - Input signal : 100IRE White pattern
- (Pattern #4 :MSPG series)
- Equipment : CA-210 (Ch. 14 WLED) or
equivalent device.
* If input signal is 100 IRE full white pattern, the luminance and color coordinate will depend on the panel.
When testing DFC, please wait for at least 1 minutes after checking luminance at black pattern.
- AV Mode
No. Item Luminance(cd/m2) C/R Remark
Min Typ Max RF, AV, COMPONENT, HDM
1 M19/22/23/24/2550D 180 200 - 800 Measurement Condition(after 30min aging)
- Picture setting : Outgoing condition
- Input signal : 100IRE White pattern
- (Pattern #4 :MSPG series)
- Equipment : CA-210 (Ch. 14 WLED) or
equivalent device.
7. Power Co sumptio
1 Operating Condition Sync (H/V) Video LED Wattage Condition
Power S/W On On Typ. On/On Active On 35 W * Energy Saving Spec
mode Max. On/On Active On 40 W - Off : 100%
Sleep mode. On/On Active Breathing 1 W - Minimum : Below 90%
- Medium : Below 80%
Power S/W Off Off mode - Off Off 0.5W - Maximum : Below 70%
- 9 -
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
8. Timi g
8.1 RGB/ HDMI (PC)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1. 720*400 31.468 70.080 28.321
2. 640*480 31.469 59.940 25.175
3. 640*480 37.500 75.000 31.500
4. 800*600 37.879 60.317 40.000
5. 800*600 46.875 75.000 49.500
6. 1024*768 48.363 60.004 65.000
7. 1024*768 60.023 75.029 78.750
8. 1152*864 67.500 75.000 108.000
9. 1280*720 45.000 60.000 74.250
10. 1280*800 49.702 59.810 83.500
11. 1280*1024 63.981 60.020 108.000
12. 1280*1024 79.976 75.025 135.000
13. 1400*1050 65.317 59.978 121.750
14. 1440*900 55.935 59.887 106.500
15. 1600*900 60.000 60.000 108.000
16. 1680*1050 64.674 59.883 119.000
17. 1680*1050 65.290 59.954 146.250
18. 1920*1080 67.500 60.000 148.500
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720* 480 31.469 / 31.5 59.94 / 60 27.00/ 27.03 SDTV 480P
2. 720*576 31.25 50.00 27.864 SDTV 576P
3. 1280*720 37.50 50.00 74.250 HDTV 720P
4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P
5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I
6 1920* 1080 28.125 50.00 74.25 HDTV 1080I
7 1920* 1080 27.00 24 74.25 HDTV 1080P
8 1920* 1080 33.75 30.00 74.25 HDTV 1080P
9 1920* 1080 56.250 50 148.5 HDTV 1080P
10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P
8.2 HDMI (DTV)
- 10 -
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
No. Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel clock( MHz)
1. 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2. 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3. 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4. 720* 480 31.47 59.94 27.000 SDTV 480P
5. 720* 480 31.50 60.00 27.027 SDTV 480P
6. 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280* 720 44.96 59.94 74.176 HDTV 720P
8. 1280* 720 45.00 60.00 74.250 HDTV 720P
9. 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920* 1080 33.72 59.94 74.176 HDTV 1080I
11. 1920* 1080 33.75 60.00 74.250 HDTV 1080I
12. 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
13. 1920* 1080 56.25 50 148.5 HDTV 1080P
14. 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15. 1920* 1080 67.5 60.00 148.5 HDTV 1080P
8.3 Component
This manual suits for next models
3
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