JVC KD-AR5500 User manual
SERVICE MANUAL
COPYRIGHT © 2005 Victor Company of Japan, Limited No.MA140
2005/1
CD / SD RECEIVER
MA14020051
KD-AR5500,KD-LHX550
TABLE OF CONTENTS
1 PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22
5 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-33
Area suffix
J --------------- Northern America
KD-AR5500 LHX550
KD-LHX550
KD-AR5500
ARSENAL
Telephone muting
1-2 (No.MA140)
SPECIFICATION
Design and specifications are subject to change without notice.
AUDIO AMPLIFIER SECTION
Power Output 22 W RMS ×4 Channels at 4 Ωand [< or =] 1% THD+N
Signal to Noise Ratio 80 dBA (reference: 1 W into 4 Ω)
Load Impedance 4 Ω(4 Ωto 8 Ωallowance)
Equalizer Control Range Frequencies 60 Hz, 150 Hz, 400 Hz, 1 kHz, 2.4 kHz, 6 kHz, 12 kHz
Level ±10 dB
Frequency Response 40 Hz to 20 000 Hz
Line-Out Level/Impedance 5.0 V/20 kΩload (full scale)
Output Impedance 1 kΩ
Subwoofer-Out Level/Impedance 5.0 V/20 kΩload (full scale)
Other terminals LINE IN, CD changer, Steering wheel remote input
TUNER SECTION
Frequency Range FM 87.5 MHz to 107.9 MHz (with channel interval set to 200
kHz)
87.5 MHz to 108.0 MHz (with channel interval set to 50 kHz)
AM 530 kHz to 1 710 kHz (with channel interval set to 10 kHz)
531 kHz to 1 602 kHz (with channel interval set to 9 kHz)
[FM Tuner] Usable Sensitivity 11.3 dBf (1.0 µV/75 Ω)
50 dB Quieting Sensitivity 16.3 dBf (1.8 µV/75 Ω)
Alternate Channel Selectivity (400 kHz) 65 dB
Frequency Response 40 Hz to 15 000 Hz
Stereo Separation 35 dB
Capture Ratio 1.5 dB
[AM Tuner] Sensitivity 20 µV
Selectivity 65 dB
CD/SD PLAYER SECTION
Type Compact disc player
Signal Detection System Non-contact optical pickup (semiconductor laser)
Number of channels 2 channels (stereo)
Frequency Response 5 Hz to 20 000 Hz
Dynamic Range 98 dB
Signal-to-Noise Ratio 102 dB
Wow and Flutter Less than measurable limit
MP3 (MPEG Audio Layer 3) Max. Bit Rate 320 kbps
WMA (Windows Media Audio) Max. Bit Rate 192 kbps
Playable SD Card Format Fat 12/16
Storage Up to 512 MB
Playable Audio Format for SD Card MP3/WMA
GENERAL
Power Requirement Operating Voltage DC 14.4 V (11 V to 16 V allowance)
Grounding System Negative ground
Allowable Operating Temperature 0°C to +40°C (32°F to 104°F)
Dimensions (W ×H ×D) Installation Size (approx.) 182 mm ×52 mm ×159 mm (7-3/16" ×2-1/16" ×6-5/16")
Panel Size (approx.) 188 mm ×58 mm ×13 mm (7-7/16" ×2-5/16" ×9/16")
Mass (approx.) 1.9 kg (4.2 lbs) (excluding accessories)
(No.MA140)1-3
SECTION 1
PRECAUTIONS
1.1 Safety Precautions
!Burrs formed during molding may be left over on some parts of the chassis. Therefore,
pay attention to such burrs in the case of preforming repair of this system.
!Please use enough caution not to see the beam directly or touch it in case of an
adjustment or operation check.
1-4 (No.MA140)
1.2 Preventing static electricity
Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser
diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.
1.2.1 Grounding to prevent damage by static electricity
Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players.
Be careful to use proper grounding in the area where repairs are being performed.
(1) Ground the workbench
Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the
traverse unit (optical pickup) on it.
(2) Ground yourself
Use an anti-static wrist strap to release any static electricity built up in your body.
(3) Handling the optical pickup
• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical
pickup are shorted. After replacement, return the shorted parts to their original condition.
(Refer to the text.)
• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily
destroy the laser diode.
1.3 Handling the traverse unit (optical pickup)
(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.
(2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the
replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a
time when attaching it to the connector.
(3) Handle the flexible cable carefully as it may break when subjected to strong force.
(4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.
1.4 Attention when traverse unit is decomposed
*Please refer to "Disassembly method" in the text for the CD pickup unit.
• Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit.
(If the flexible wire is disconnected without applying solder, the CD pickup may be destroyed by static electricity.)
• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.
1M
(caption)
Anti-static wrist strap
Conductive material
(conductive sheet) or iron plate
CN601
Short sections
Flexible wire
Mechanism control board
(No.MA140)1-5
SECTION 2
SPECIFIC SERVICE INSTRUCTIONS
This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS.
1-6 (No.MA140)
SECTION 3
DISASSEMBLY
3.1 Main body section
3.1.1 Removing the front panel assembly
(See Fig.1)
(1) Push the detach button in the lower right part of the front
panel assembly.
(2) Remove the front panel assembly.
Fig.1
3.1.2 Removing the heat sink
(See Fig.2)
Reference:
Remove the front panel assembly as required.
(1) From the left side of the main body, remove the two screws
Aand three screws Battaching the heat sink.
(2) Remove the heat sink from the main body.
Fig.2
Front panel assembly
Detach button
Heat sink
AAB
(No.MA140)1-7
3.1.3 Removing the top chassis assembly
(See Figs.3 to 6)
• Prior to performing the following procedures, remove the heat
sink.
Reference:
Remove the front panel assembly as required.
(1) From the bottom side of the main body, remove the two
screws Cattaching the top chassis assembly to the bottom
chassis assembly. (See Fig.3.)
(2) From the both and rear sides of the main body, remove the
four screws Dattaching the top chassis assembly to the
bottom chassis assembly. (See Figs.4 to 6.)
(3) Remove the two screws Eattaching the IC heat sink. (See
Fig.5.)
(4) Lift the top chassis assembly in the direction of the arrow,
disconnect the connector CN503 on the mechanism con-
trol board from the connector CN721 on the main board.
(See Figs.4 to 6.)
(5) Take out the top chassis assembly from the bottom chassis
assembly.
Fig.3
Fig.4
Fig.5
Fig.6
Top chassis assembly
C
C
Bottom chassis assembly
Bottom chassis assembly
Top chassis assembly
D
CN503
CN721
Main board
Mechanism control board
Top chassis assembly
D
Bottom chassis assembly
Mechanism control board
E
IC heat sink
Top chassis assembly
Bottom chassis assembly Rear bracket
D
D
1-8 (No.MA140)
3.1.4 Removing the front chassis assembly
(See Figs.7 and 8)
• Prior to performing the following procedure, remove the front
panel assembly, heat sink and top chassis assembly.
(1) From the both sides of the top chassis assembly, remove
the two screws Fattaching the front chassis assembly.
(2) Remove the front chassis assembly from the top chassis
assembly.
Fig.7
Fig.8
3.1.5 Removing the CD mechanism assembly
(See Fig.9)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink and top chassis assembly.
Reference:
Remove the front chassis assembly as required.
(1) From the inside of the top chassis assembly, remove the
three screws Gattaching the CD mechanism assembly.
(2) Release the mecha heat sink from the joints aon the mech-
anism control board and remove the heat sink from the
main body.
(3) Take out the CD mechanism assembly from the top chas-
sis.
Fig.9
Top chassis assembly
Front chassis assembly
F
Top chassis assembly
Front chassis assembly
F
Top chassis
Mecha heat sink
G
G G
CD mechanism assembly
a
Mechanism control board
(No.MA140)1-9
3.1.6 Removing the main board
(See Figs.10 and 11)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink and top chassis assembly.
(1) From the rear side of the bottom chassis assembly, remove
the two screws Hattaching the rear bracket to the bottom
chassis assembly. (See Fig.10.)
(2) From the top side of the bottom chassis assembly, remove
the two screws Jattaching the main board to the bottom
chassis assembly. (See Fig.11.)
(3) Release the stopper of the connector CN701 on the main
board in an upward direction, disconnect the card wire from
the connector CN701. (See Fig.11.)
(4) Disconnect the wire from the connector of the front door
mechanism assembly. (See Fig.11.)
(5) Disconnect the wire from the connector CN991 on the main
board. (See Fig.11.)
Reference:
After connecting the wires, fix the wires with the wire
holders.
(6) Take out the main board from the bottom chassis assem-
bly.
Fig.10
Fig.11
Rear bracket
H
Bottom chassis assembly
Connector
Wire holders CN701
Stopper
Bottom chassis assembly
J
J
CN991
Wires
Main board
Card wire
Front door mechanism assembly
1-10 (No.MA140)
3.1.7 Removing the rear bracket
(See Fig.12)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink, top chassis assembly and main
board.
(1) From the rear side of the main board, remove the wires
from the rear bracket in the direction of the arrow.
(2) Remove the screw K, screw Land four screws Mattaching
the rear bracket to the main board.
Reference:
After attaching the rear bracket to the main board, pass the
wires through the wire holder and insert them into the slots of
the rear bracket.
Fig.12
3.1.8 Removing the front door mechanism assembly
(See Fig.13)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink, top chassis assembly and main
board.
(1) From the top side of the bottom chassis assembly, remove
the screw Nattaching the FPC guide to the bottom chassis.
(2) Remove the five screws Pattaching the front door mecha-
nism assembly to the bottom chassis.
Reference:
When attaching the screws Nand P, apply a locking
agent them.
(3) Take out the front door mechanism assembly from the bot-
tom chassis.
Fig.13
Rear bracket
M
M M
K
Main board
Wire holder
Slots
Rear bracket
Wires
L
Bottom chassis
PP
N
FPC guide
Front door mechanism assembly
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