Intel E7500 Guide

Intel®E7500/E7505 Chipset

Thermal Design Guide

Intel®E7500/E7505 Chipset Memory Controller Hub (MCH) Thermal

and Mechanical Design Guidelines

November 2002

Document Number: 298647-002

2 Intel®E7500/E7505 Chipset MCH Thermal Design Guide

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL

DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR

WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,

COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining

applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel®E7500/E7505 chipset MCH may contain design defects or errors known as errata which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Intel Xeon and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and

other countries.

*Other names and brands may be claimed as the property of others.

Intel®E7500/E7505 Chipset MCH Thermal Design Guide 3

Contents

1Introduction ..........................................................................................................................7

1.1 Design Flow ............................................................................................................8

1.2 Definition of Terms..................................................................................................9

1.3 Reference Documents ..........................................................................................10

2Packaging Technology ......................................................................................................11

3Thermal Simulation............................................................................................................13

4Thermal Specifications ......................................................................................................15

4.1 Case Temperature and Thermal Design Power ...................................................15

4.2 Die Temperature...................................................................................................15

5Thermal Metrology.............................................................................................................17

5.1 Die Temperature Measurements ..........................................................................17

5.1.1 0° Angle Attach Methodology ................................................................17

5.2 Power Simulation Software...................................................................................19

6Reference Thermal Solutions ............................................................................................21

6.1 Operating Environment .........................................................................................21

6.2 Mechanical Design Envelope................................................................................21

6.3 Thermal Solution Assembly ..................................................................................23

6.3.1 Heatsink Orientations ............................................................................25

6.3.2 Extruded Heatsink Profiles ....................................................................26

6.3.3 Mechanical Interface Material ...............................................................27

6.3.4 Thermal Interface Material ....................................................................27

6.3.5 Heatsink Clip .........................................................................................27

6.3.6 Clip Retention Anchors..........................................................................28

6.3.7 Board Level Component Keep-out Dimensions ....................................28

6.4 Reliability Guidelines.............................................................................................30

Appendix A: Thermal Solution Component Suppliers ...............................................................................31

Appendix B: Mechanical Drawings............................................................................................................33

4 Intel®E7500/E7505 Chipset MCH Thermal Design Guide

Figures

Figure 1. Thermal Design Process ......................................................................................8

Figure 2. MCH Package Dimensions (Side View) .............................................................11

Figure 3. MCH Package Dimensions (Top View)..............................................................12

Figure 4. 0 Angle Attach Methodology (Top View) ............................................................18

Figure 5. 0° Angle Attach Heatsink Modifications..............................................................18

Figure 6. Thermal Solution Decision Flowchart.................................................................19

Figure 7. Reference Heatsink Volumetric Envelope for the MCH .....................................22

Figure 8. Reference Thermal Solution Assembly..............................................................23

Figure 9. Reference Thermal Solution Assembly (Side View)...........................................24

Figure 10. Reference Thermal Solution (Top View) ..........................................................24

Figure 11. Preferred Heatsink Orientation.........................................................................25

Figure 12. Extruded Heatsink Profile.................................................................................26

Figure 13. Alternate Tall Heatsink Profile ..........................................................................26

Figure 14. Heatsink Mechanical Gasket, Optional Two-Piece ..........................................27

Figure 15. Heatsink Retention Mechanism Layout............................................................28

Figure 16. Retention Mechanism Component Keep-out Zones ........................................29

Figure 17. MCH Heatsink Assembly..................................................................................34

Figure 18. MCH Heatsink Clip ...........................................................................................35

Tables

Table 1. Intel®E7500 Chipset MCH Thermal Specifications.............................................15

Table 2. Intel®E7505 Chipset MCH Thermal Specifications.............................................15

Table 3. Reliability Guidelines............................................................................................30

Table 4. Complete Thermal Solution Kits ..........................................................................31

Table 5. Extruded Heatsinks .............................................................................................31

Table 6. Interface Materials ...............................................................................................32

Table 7. Attach Hardware..................................................................................................32

Intel®E7500/E7505 Chipset MCH Thermal Design Guide 5

Revision History

Revision

Number

Description Date

-001 Initial Release as an Intel®E7500 chipset specific document February 2002

-002 • Added Intel®E7505 chipset specific information and re-titled

document

• Updated E7500/E7505 chipset MCH thermal specifications

• Removed 90°C Angle Attach Die Temperature Measurement

Methodology

• Updated Supplier Contact Information

• All reference to Tdie-hs changed to Tcase

November 2002

6 Intel®E7500/E7505 Chipset MCH Thermal Design Guide

This page is intentionally left blank.

Introduction

Intel®E7500/E7505 Chipset MCH Thermal Design Guide 7

1 Introduction

As the complexity of computer systems increase, so do the power dissipation requirements. Care

must be taken to ensure that the additional power is properly dissipated. Typical methods to

improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are:

• To specify the operating limits of the Intel®E7500/E7505 chipset MCH components.

• To describe a reference thermal solution that meets the thermal specifications of the

Intel®E7500/E7505 chipset MCH components.

Properly designed solutions provide adequate cooling to maintain the E7500/E7505 chipset MCH

die temperatures at or below thermal specifications. This is accomplished by providing a low

local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-

ambient thermal resistance. By maintaining the E7500/E7505 chipset MCH die temperature at or

below the specified limits, a system designer can ensure the proper functionality, performance, and

reliability of the chipset. Operation outside the functional limits can degrade system performance

and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method is to improve the inherent system cooling

characteristics through careful design and placement of fans, vents, and ducts. When additional

cooling is required, component thermal solutions may be implemented in conjunction with system

thermal solutions. The size of the fan or heatsink can be varied to balance size and space

constraints with acoustic noise.

This document addresses thermal design and specifications for the E7500/E7505 chipset MCH

components only. For thermal design information on other chipset components, refer to the

respective component datasheet. For the P64H2, refer to the Intel®PCI-64 Hub 2 (P64H2)

Thermal Design Guidelines. For the ICH3-S, refer to the Intel®82801CA I/O Controller Hub 3

(ICH3-S) Datasheet. For the ICH4, refer to the Intel® 82801DB I/O Controller Hub 4 (ICH4)

Datasheet.

Note: Unless otherwise specified, the term “MCH” refers to both the E7500 chipset MCH and E7505

chipset MCH.

Introduction

8 Intel®E7500/E7505 Chipset MCH Thermal Design Guide

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the

system designer. Figure 1 illustrates the design process implicit to this document and the tools

appropriate for each step.

Figure 1. Thermal Design Process

Step 1: Thermal Simulation

- Thermal Models

- Thermal Model Users

Guide

Step 2: Heatsink Selection

- Thermal Reference

- Mechanical Reference

Step 3: Thermal Validation

- Thermal Testing Software

- Software Users Guide

Therm_Design_Proc

Introduction

Intel®E7500/E7505 Chipset MCH Thermal Design Guide 9

1.2 Definition of Terms

Term Definition

BGA Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is

mounted, bonded and encapsulated in molding compound. The primary electrical

interface is an array of solder balls attached to the substrate opposite the die and

molding compound.

Intel®ICH3-S /

Intel®ICH4

I/O Controller Hub. The chipset component that contains the primary PCI interface,

LPC interface, USB, ATA-33, and other legacy functions.

MBGA Mini Ball Grid Array. A version of the BGA with a smaller ball pitch.

MCH Memory Controller Hub. The chipset component that contains the processor interface

and the memory interface.

FC-BGA Flip Chip Ball Grid Array. A package type defined by a resin-fiber substrate where a die

is mounted using an underfilled C4 (Controlled Collapse Chipset Connection) attach

style. The primary electrical interface is an array of solder balls attached to the

substrate opposite the die. The device arrives at the customer with solder balls

attached. This is the packaging technology used for the MCH.

Intel®P64H2 Bus Controller Hub. The chipset component that interfaces the PCI-X buses.

Tcase Maximum die temperature allows. This temperature is measured at the geometric

center of the top of the package die.

TDP Thermal Design Power. Thermal solutions should be designed to dissipate this target

power level.

Introduction

10 Intel®E7500/E7505 Chipset MCH Thermal Design Guide

1.3 Reference Documents

Document Document

Number

Intel®Xeon™ Processor Thermal Design Guidelines

http://www.intel.com/design/Xeon/guides/298348.htm

298348

Intel®PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines 298648

Intel®Xeon™ Processor with 512-KB L2 Cache and Intel®E7500 Chipset Platform

Design Guide

298649

Intel®E7500 Chipset: E7500 Memory Controller Hub (MCH) Datasheet 290730

Intel®Xeon™ Processor and Intel®E7505 Chipset Platform Design Guide 251934

Intel®E7505 Chipset Memory Controller Hub (MCH) Datasheet 251932

Intel®82801CA I/O Controller Hub 3 (ICH3-S) Datasheet 290733

Intel®82801DB I/O Controller Hub 4 (ICH4) Datasheet 290744

Intel®82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet 290732

BGA/OLGA Assembly Development Guide Note 1

Thermal Design Suggestions for various form factors

http://www.formfactors.org

NOTES:

1. Contact your Intel Field Sales representative.

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