Huawei MU709 Series Installation instructions

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Issue

Date

2017-12-15

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HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

About This Document

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

About This Document

Revision History

Document

Version

Date

Chapter

Descriptions

2014-07-16

Creation

2014-09-11

All

Deleted the Description of RESIN_N pin.

3.4.3

Updated Section 3.4.3: Reset the Module.

2014-09-18

3.4.3

Updated Section 3.4.3: Reset the Module.

2015-02-05

All

Added the Description of MU709s-6 Module.

2015-05-20

3.3.2

Updated Section 3.3.2: Power Supply VBAT

Interface.

2015-11-30

3.2

Updated the description of PS_HOLD signal

in Table 3-1.

3.3.2

Updated Section 3.3.2: Power Supply VBAT

Interface.

3.14

Added the description of PS_HOLD signal in

Section 3.14 Test Points Design.

3.5

Updated Section 3.5: UART Interface

6.5

Updated Section: 6.5 Packaging

2016-09-07

Updated Table 2-1 Features

3.7.1

Updated Table 3-10 USIM card interface

signals

3.7.2

Updated Figure 3-15 Circuit of the USIM

card interface

3.7.2

Updated Figure 3-16 Connections of the

USIM_DET pin

5.6

Updated EMC and ESD Features

6.4

Updated Dimensions (Unit: mm)

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

About This Document

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

Document

Version

Date

Chapter

Descriptions

6.5

Updated Packaging

6.6.2

Updated Figure 6-4 LGA module Footprint

design (Unit: mm)

6.8.2

Updated Stencil Design

6.9.3

Updated Equipment used for rework

2017-06-28

8.13.1

Updated section 8.13.1 EU Regulatory

Conformance

2017-12-15

Deleted Privacy Policy

Added Software Update

Scope

MU709s-2

MU709s-6

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Contents

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

Contents

1 Introduction....................................................................................................................................8

2 Overall Description ......................................................................................................................9

2.1 About This Chapter........................................................................................................................... 9

2.2 Function Overview............................................................................................................................ 9

2.3 Circuit Block Diagram..................................................................................................................... 10

2.4 Application Block Diagram ............................................................................................................. 12

3 Description of the Application Interfaces..............................................................................13

3.1 About This Chapter......................................................................................................................... 13

3.2 LGA Interface ................................................................................................................................. 13

3.3 Power Interface.............................................................................................................................. 23

3.3.1 Overview................................................................................................................................ 23

3.3.2 Power Supply VBAT Interface............................................................................................... 24

3.3.3 Output Power Supply Interface ............................................................................................. 25

3.4 Signal Control Interface.................................................................................................................. 25

3.4.1 Overview................................................................................................................................ 25

3.4.2 Power-on/off Pin.................................................................................................................... 26

3.4.3 RESIN_N............................................................................................................................... 28

3.4.4 WAKEUP_IN Signal............................................................................................................... 29

3.4.5 WAKEUP_OUT Signal........................................................................................................... 30

3.4.6 SLEEP_STATUS Signal ........................................................................................................ 30

3.4.7 LED_MODE Signal................................................................................................................ 31

3.5 UART Interface............................................................................................................................... 32

3.5.1 Overview................................................................................................................................ 32

3.5.2 Circuit Recommended for the UART Interface...................................................................... 33

3.6 USB Interface................................................................................................................................. 34

3.7 USIM Card Interface ...................................................................................................................... 35

3.7.1 Overview................................................................................................................................ 35

3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 36

3.8 Audio Interface ............................................................................................................................... 38

3.9 General Purpose I/O Interface....................................................................................................... 40

3.10 JTAG Interface ............................................................................................................................. 41

3.11 RF Antenna Interface.................................................................................................................... 41

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Contents

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

3.12 Reserved Interface....................................................................................................................... 44

3.13 NC Interface................................................................................................................................. 44

3.14 Test Points Design........................................................................................................................ 45

4 RF Specifications.........................................................................................................................46

4.1 About This Chapter......................................................................................................................... 46

4.2 Operating Frequencies................................................................................................................... 46

4.3 Conducted RF Measurement......................................................................................................... 47

4.3.1 Test Environment................................................................................................................... 47

4.3.2 Test Standards....................................................................................................................... 47

4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 47

4.4.1 Conducted Receive Sensitivity.............................................................................................. 47

4.4.2 Conducted Transmit Power................................................................................................... 48

4.5 Antenna Design Requirements ...................................................................................................... 49

4.5.1 Antenna Design Indicators..................................................................................................... 49

4.5.2 Interference ........................................................................................................................... 52

4.5.3 Antenna Requirements.......................................................................................................... 52

5 Electrical and Reliability Features...........................................................................................54

5.1 About This Chapter......................................................................................................................... 54

5.2 Absolute Ratings ............................................................................................................................ 54

5.3 Operating and Storage Temperatures and Humidity...................................................................... 54

5.4 Power Supply Features.................................................................................................................. 55

5.4.1 Input Power Supply ............................................................................................................... 55

5.4.2 Power Consumption.............................................................................................................. 56

5.5 Reliability Features......................................................................................................................... 60

5.6 EMC and ESD Features................................................................................................................. 63

6 Mechanical Specifications.........................................................................................................65

6.1 About This Chapter......................................................................................................................... 65

6.2 Storage Requirement ..................................................................................................................... 65

6.3 Moisture Sensitivity ........................................................................................................................ 65

6.4 Dimensions and Interfaces............................................................................................................. 66

6.5 Packaging....................................................................................................................................... 66

6.6 Customer PCB Design................................................................................................................... 68

6.6.1 PCB Surface Finish............................................................................................................... 68

6.6.2 PCB Pad Design.................................................................................................................... 69

6.6.3 Solder Mask........................................................................................................................... 69

6.6.4 Requirements on PCB Layout............................................................................................... 69

6.7 Thermal Design Solution................................................................................................................ 70

6.8 Assembly Processes...................................................................................................................... 72

6.8.1 Overview................................................................................................................................ 72

6.8.2 Stencil Design........................................................................................................................ 72

6.8.3 Reflow Profile ........................................................................................................................ 72

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Contents

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

6.9 Rework ........................................................................................................................................... 74

6.9.1 Process of Rework ................................................................................................................ 74

6.9.2 Preparations of Rework......................................................................................................... 74

6.9.3 Removing of the Module........................................................................................................ 74

6.9.4 Welding Area Treatment........................................................................................................ 75

6.9.5 Module Installation................................................................................................................. 75

6.9.6 Specifications of Rework ....................................................................................................... 75

7 Certifications................................................................................................................................77

7.1 About This Chapter......................................................................................................................... 77

7.2 Certifications................................................................................................................................... 77

8 Safety Information......................................................................................................................78

8.1 Interference .................................................................................................................................... 78

8.2 Medical Device............................................................................................................................... 78

8.3 Area with Inflammables and Explosives......................................................................................... 78

8.4 Traffic Security................................................................................................................................ 79

8.5 Airline Security................................................................................................................................ 79

8.6 Safety of Children........................................................................................................................... 79

8.7 Environment Protection.................................................................................................................. 79

8.8 WEEE Approval.............................................................................................................................. 79

8.9 RoHS Approval............................................................................................................................... 79

8.10 Laws and Regulations Observance ............................................................................................. 80

8.11 Care and Maintenance................................................................................................................. 80

8.12 Emergency Call............................................................................................................................ 80

8.13 Regulatory Information................................................................................................................. 80

8.13.1 EU Regulatory Conformance .............................................................................................. 80

8.13.2 FCC Statement.................................................................................................................... 81

9 Appendix A Circuit of Typical Interface................................................................................82

10 Appendix B Acronyms and Abbreviations..........................................................................83

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Introduction

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

1 Introduction

This document describes the hardware application interfaces and air interfaces

provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ LGA module

(hereinafter referred to as the MU709 module).

This document helps hardware engineer to understand the interface specifications,

electrical features and related product information of the MU709 module.

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Overall Description

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the MU709 module and provides:

Function Overview

Circuit Block Diagram

Application Block Diagram

2.2 Function Overview

Table 2-1 Features

Feature

Description

Physical

Dimensions

Dimensions (L ×W ×H): 30 mm ×30 mm ×2.27 mm

Weight: about 5 g

Operating

Bands

MU709s-2:

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 8

GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

MU709s-6:

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5

GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

Operating

Temperature

Normal operating temperature: –20°C to +70°C

Extended operating temperature[1]: –40°C to +85°C

Storage

Temperature

–40°C to +85°C

Humidity

RH5% to RH95%

Power

Voltage

DC 3.3 V to 4.2 V (typical value is 3.8 V)

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Overall Description

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

Feature

Description

Commands

See the HUAWEI MU709 Series HSPA+ Module AT Command

Interface Specification.

Application

Interface

(145-pin LGA

interface)

One standard USIM (Class B and Class C) interface

Audio interface: PCM interface

USB 2.0 (High Speed)

UART interface:

8-wire UART0 x 1, up to 920 kbit/s

2-wire UART1 x 1 (This is only used for debugging)

GPIO

LED x 1

Power on/off interface

Hardware reset interface

JTAG interface

SLEEP_STATUS

WAKEUP_IN

WAKEUP_OUT

Antenna

Interface

WWAN MAIN antenna pad x1

WWAN AUX antenna pad x 1

SMS

New message alert

Management of SMS: read SMS, write SMS, send SMS, delete

SMS and list SMS

Supports MO and MT: Point-to-point

Data Services

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

[1]: When the MU709 module work in the range from –40°C to –20°C or +70°C to +85°C , NOT

all their RF performances comply with 3GPP specifications.

2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the MU709 module. The major

functional units of the MU709 module contain the following parts:

Power management

Baseband controller

Nand flash

RF Circuit

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