HP Spectre x360 15 Assembly instructions

EL-MF877-00 Page 1

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Spectre x360 15 Convertible PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the

plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description

Notes

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button style

batteries

Li-Ion batteries. Include all Li-Ion batteries if more than

one is provided with the product (such as a detachable

notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[x] screws

[ ] snaps

[ ] adhesive

[ ] other. Explain

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater than

100 sq cm

Includes background illuminated displays with gas

discharge lamps 15.6”

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater

than 2.5 cm in diameter or height

External electrical cables and cords

DC Cable for External Power Supply

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

EL-MF877-00 Page 2

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity of

items

included in

product

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing refractory

ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

#00, #0, #1,T5,

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure:

1. Remove Base screw*2, Base rubber foot *2, screw*6, and Base sub-assy.*1

2. Pull out cable Antenna(WWAN)

3. Remove battery screw*6 and remove battery.

4. Remove front speaker screw *4 and remove front speaker*2.

5. RemoveThermal screw *6 and remove Thermal *1

6. Remove Fan screw *4 and remove Fan *2

7. Pull out FFC*8 (Touchpad, Keyboard membrane, Keyboard backlight, Power FFC, FPR FFC, IR FFC, SD FFC, Audio FFC)

8. Pull out cable*3 (LVDS, Camera, Antenna(WLAN))

9. Pull out SHIELDING CAN *1, and remove SSD screw *1 to remove SSD Card *1

10. Remove screw *3(SD DB screw*1, FPR BKT screw *2) and remove SD DB*1, FPR BKT*1, FPR DB*1

11. Remove screw *6(Audio DB*1, MB screw*4, Power DB*1) and remove Audio DB*1, MB*1, Power DB*1

12. Remove screw *4(IR DB*1, Touch-pad*3) and remove Touch-pad, IR DB

13. Remove DC Cable screw *1 and remove DC Cable*1

14. Remove rear speaker screw *4 and remove rear speaker*2

15. Remove Hinge screw*4 and LCD module assy

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the

product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.21 Total

3.22 Remove Rear side rubber, base screw and base assy.

3.23 Remove SSD SHIELDING CAN, SSD Card, Thermal, and battery, all screw.

EL-MF877-00 Page 4

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.24 Remove Touchpad, speaker, FPR BKT, FPR Board, MB board, Power Board, Audio Board, IR Board, SD Board,

Audio Board FFC, FPR FFC, IR Board FFC, Touchpad FFC, Power Board FFC, SD Board FFC, Bracket and all screw.

3.25 The LCD module is not disassembly

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