HP Sangoma 2 Installation instructions

EL-MF877-00 Page 1

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Product End-of-Life Disassembly Instructions

Product Category:

Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

Sangoma 2 Port FXO2 Port FXS Voice Card / J9518A

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0

Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm 5

Batteries All types including standard alkaline and lithium coin

or button style batteries 0

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 0

External electrical cables and cords 2

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants 0

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Slotted Screw Driver

Phillips Screw Driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the 12V power cable. Refer to Pic.1

2. Remove the fax sync cable. Refer to Pic 2

3. Snap off the 2 rivets attaching the insulator pad. Using slotted screw driver, remove the nylon screw attaching the

insulator pad to the PCA. Refer to Pic.3

4. Remove the insulator pad

5. Using the slotted screw driver, remove the 3 stand-offs that connects the 2 main PCAs

6. Remove the low profile bracket by removing the 2 screws securing the bracket onto the PCA. Remove the screws

using Phillips screw driver.

7. Remove the 2 small PCAs (1 green and 1 red) from 1 of the main PCA

8. Using Phillips screw driver, unscrew the 2 screws which attached the smallest PCA to the PCA which does not has

any RJ ports.

10.

11.

12.

13.

14.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Pic Illustration

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