Hitachi H8/3062 User manual

Hitachi Single-Chip Microcomputer

H8/3062 Series

H8/3062

HD6433062

H8/3061

HD6433061

H8/3060

HD6433060

H8/3062F-ZTAT™

HD64F3062, HD64F3062R, HD64F3062A

H8/3064F-ZTAT™

HD64F3064

Hardware Manual

ADE-602-136B

Rev. 3.0

3/20/00

Hitachi, Ltd.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or

use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that

demands especially high quality and reliability or where its failure or malfunction may directly

threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear

power, combustion control, transportation, traffic, safety equipment or medical equipment for

life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,

consider normally foreseeable failure rates or failure modes in semiconductor devices and

employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi

product does not cause bodily injury, fire or other consequential damage due to operation of

the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

Preface

The H8/3062 Series is a series of high-performance single-chip microcontrollers that integrate

system supporting functions together with an H8/300H CPU core.

The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a

concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address

space.

The on-chip supporting functions include ROM, RAM, 16-bit timers, 8-bit timers, a

programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication

interface (SCI), an A/D converter, a D/A converter, I/O ports, and other facilities. The two-

channel SCI supports a smart card interface handling ISO/IEC7816-3 character transmission as an

expansion function. Functions have also been added to reduce power consumption in battery-

powered applications: individual modules can be placed in standby mode, and the frequency of the

system clock supplied to the chip can be divided under program control.

The address space is divided into eight areas. The data bus width and access cycle length can be

selected independently for each area, simplifying the connection of different types of memory.

Seven MCU operating modes (modes 1 to 7) are provided, offering a choice of initial data bus

width and address space size.

With these features, the H8/3062 Series enables easy implementation of compact, high-

performance systems.

In addition to its mask ROM versions, the H8/3062 Series has F-ZTAT™* versions with on-chip

flash memory that allows programs to be rewritten after the chip is mounted on a board. This

version offers flexibility in the development of new products to meet fast-changing market needs.

This manual describes the H8/3062 Series hardware. For details of the instruction set, refer to the

H8/300H Series Programming Manual.

Note: * F-ZTAT™ is a trademark of Hitachi, Ltd.

List of Items Revised or Added for This Version

Page Item Description

All — H8/3064F-ZTAT and

H8/3062F-ZTAT A-Mask

Version descriptions added

Product code descriptions

amended

2 Table 1.1 Features CPU Description amended

6 Figure 1.1 Block Diagram Notes amended

7 Table 1.2 Comparison of H8/3062 Series Pin

Arrangements Added

10 Figure 1.4 Pin Arrangement of H8/3064F-ZTAT and

H8/3062F-ZTAT A-Mask Version(FP-100B or TFP-

100B Package, Top View)

Added

11 Figure 1.5 Pin Arrangement of H8/3064F-ZTAT and

H8/3062F-ZTAT A-Mask Version(FP-100A Package,

Top View)

Added

12 to

15 1.3.2 Pin Functions

Table 1.3 Pin Functions Description added and

revised

19 Table 1.4 Pin Assignments in Each Mode Notes amended

20 1.4.1 Pin Arrangement Description added

22 Table 1.6 Differences between H8/3062F-ZTAT,

H8/3062F-ZTAT R-Mask Version, and On-Chip Mask

ROM Versions

Description added

22 1.5 Notes on H8/3064F-ZTAT and H8/3062F-ZTAT

A-Mask Version Added

22 1.5.1 Pin Arrangement Description revised

24, 25 1.5.3 VCL Pin Description added

24 Figure 1.6 H8/3062F-ZTAT A-Mask Version and

H8/3064F-ZTAT Description amended

25 Figure 1.7 Difference between 5 V and 3 V Operation

Models Description added

26 1.6 Setting Oscillation Settling Wait Time Added

26 1.7 Caution on Crystal Resonator Connection Description added

27, 28 2.1.1 Features Description added

37 2.6.1 Instruction Set Overview Total number of instructions

amended

Page Item Description

44, 45 Table 2.7 Bit Manipulation Instructions Function descriptions added

49, 50 2.6.5 Notes on Use of Bit Manipulation Instructions Description added

54 Table 2.13 Effective Address Calculation No. 1 Addressing Mode and

Instruction Format amended

65 Table 3.1 Operating Mode Selection Table amended

66 3.1.1 Operating Mode Selection Description added

70 3.4.5 Mode 5 Description added

72 3.6.1 Comparison of H8/3062 Series Memory Maps Added

80 Figure 3.4 H8/3064F-ZTAT Memory Map in Each

Operating Mode Added

80, 81 Figure 3.4 H8/3064F-ZTAT Memory Map in Each

Operating Mode Addresses revised

132 6.2.5 Bus Control Register(BCR) Bit 1

Note added

136,

137 Figure 6.3 Memory Map in 16-Mbyte Mode Description added

153 Figure 6.17 Example of Wait State Insertion Timing Amended

205 to

207 Table 7.21 Port A Pin Functions (Modes 1 to 7) Description added

212,

213 Table 7.23 Port B Pin Functions (Modes 1 to 5) Description added

214,

215 Table 7.24 Port B Pin Functions (Modes 6 and 7) Description amended

217 to

279 Section 8 16-Bit Timer Register names amended

242 8.2.11 Timer Output Level Setting Register C (TOLR) Description added

281 to

318 Section 9 8-Bit Timers Register names amended

285 Table 9.2 8-Bit Timer Registers Initial value amended

(8TCSR2)

288 9.2.3 Time Constant Registers B (TCORB) Note added

290,

291 9.2.4 Timer Control Register (8TCR) Descriptions of bits 4 to 0

amended

292 to

296 9.2.5 Timer control/status register Description added and

amended

298 Figures 9.5 and 9.7 8TCNT Access Operations Amended

Page Item Description

302 to

306 9.4.4 Timing of Status Flag Setting

9.4.5 Operation with Cascaded Connection

9.4.6 Input Capture Setting

Description amended

307 9.5.1 Interrupt Sources Description amended

308 9.6 8-Bit Timer Application Example Amended

315 9.7.7 Contention between 8TCNT Byte Write and

Increment in 16-Bit Count Mode (Cascaded

Connection)

Figure 9.24 Contention between 8TCNT Byte Write

and Increment in 16-Bit Count Mode

Description amended

379 Table 12.3 Examples of Bit Rates and BRR Settings in

Asynchronous Mode 25 MHz added

380 Table 12.4 Examples of Bit Rates and BRR Settings in

Synchronous Mode 25 MHz added

382 Table 12.5 Maximum Bit Rates for Various

Frequencies (Asynchronous Mode) 25 MHz added

383 Table 12.6 Maximum Bit Rates with External Clock

Input (Asynchronous Mode) 25 MHz added

384 Table 12.7 Maximum Bit Rates with External Clock

Input (Synchronous Mode) 25 MHz added

391 Figure 12.5 Sample Flowchart for Transmitting Serial

Data Description added

417 13.1 Overview Description amended

430 Table 13.5 Bit Rates (bits/s) for Various BRR Settings

(When n=0) 25 MHz added

Note amended

431 Table 13.6 BRR Settings for Typical Bit Rates

(bits/s)(When n=0) 25 MHz added

Table 13.7 Maximum Bit Rates for Various

Frequencies (Smart Card Interface Mode) 20 MHz and 25 MHz added

438 Figure 13.10 Procedure for Stopping and Restarting

the Clock Amended

441 13.4 Usage Notes Description added

443 14.1 Overview Description added

14.1.1 Features High-speed conversion

25 MHz added

471 Table 16.1 H8/3062 Series On-Chip RAM

Specifications Added

Page Item Description

486 Table 17.6 On-Board Programming Mode Setting Note amended

509 Table 17.10 H8/3062F-ZTATand H8/3062F-ZTATR-

Mask Version SocketAdapterProduct Codes Added

513 to

515 17.9 Flash Memory Programming and Erasing

Precautions 9 added

513 17.9 Flash Memory Programming and Erasing

Precautions Note added

516 Figure 17.19 ROM Block Diagram (H8/3062 Mask

ROM Version) Amended

517 17.11 Notes on Ordering Mask ROM Version Chips 4 added

518 17.12 Notes when Converting the F-ZTAT Application

Software to the Mask-ROM Versions Description added

519 to

567 Section 18 Flash Memory [H8/3064F-ZTAT] Added

569 to

618 Section 19 Flash Memory [H8/3062F-ZTAT] Added

620 20.2.1 Connecting a Crystal Resonator

Table 20.1(1) Damping Resistance Value

Table 20.1(2) External Capacitance Values

Description added and

revised

621 Table 20.2 Crystal Resonator Parameters 25 MHz added

623 Table 20.3 (1) Clock Timing for On-Chip Flash

Memory Versions Table amended

Table 20.3 (2) Clock Timing for On-Chip Mask ROM

Versions Table added

626 Table 20.5 Comparison of H8/3062 Series Operating

Frequency Ranges Revised

635 21.4.3 Selection of Waiting Time for Exit from

Software Standby Mode When Using External Clock

Amendment and addition of 1

and 2

636 Table 21.3 Clock Frequency and Waiting Time for

Clock to Settle 25 MHz added

638 21.4.6 Cautions on Clearing the software Standby

Mode of F-ZTAT Version Addition of (3) Comparison of

products in H8/3062 Series

643 Table 22.1 Electrical Characteristics of H8/3062

Series Products Added

650 Table 22.3 DC Characteristics (2) Current dissipation typ value

amended

Page Item Description

653 Table 22.3 DC Characteristics (3) Current dissipation typ value

amended

658 Table 22.6 Control Signal Timing Description added

669 Table 22.12 DC Characteristics (1) Note 4 added

672 Table 22.12 DC Characteristics (2) Note 4 added

676 Table 22.15 Control Signal Timing Description added

688 to

709 22.3 Electrical Characteristics of H8/3064F-ZTAT Added

710 to

731 22.4 Electrical Characteristics of H8/3062F-ZTAT A-

Mask Version Added

738 Figure 22.19 Basic Bus Cycle: Three-State Access

with One Wait State Amended

768 Table B.1 Comparison of H8/3062 Series Internal I/O

779 to

788 B.2 Address List (H8/3064F-ZTAT) Table added

789 to

798 B.3 Address List (H8/3062F-ZTAT A-Mask Version) Table added

799 to

873 B.4 Functions Amendments and additions

Note added

912 Table F.1 H8/3062 Series H8/3064F-ZTAT and

H8/3062F-ZTAT A-mask

version added

919 H.1 Differences between H8/3067 and H8/3062

Series, H8/3048 Series, H8/3007 and H8/3006, and

H8/3002

A/D converter conversion

states added

923 Table H.1 Pin Arrangement of Each Product Note amended

Comparison of H8/3062 Series Product Specifications

There are seven members of the H8/3062 Series: the H8/3062F-ZTAT, H8/3062F-ZTAT R-mask

version, H8/3062F-ZTAT A-mask version, and H8/3064F-ZTAT (all with on-chip flash memory),

and the H8/3062 mask ROM version, H8/3061 mask ROM version, and H8/3060 mask ROM

version.

The specifications of these products are compared below.

H8/3062F-ZTAT H8/3062F-ZTAT

R-Mask Version

H8/3062 Mask

ROM Version,

H8/3061 Mask

ROM Version,

H8/3060 Mask

ROM Version H8/3064F-ZTAT H8/3062F-ZTAT

A-Mask Version

Product

specifica-

tions

On-chip single-

power-supply

flash memory

H8/3062F-ZTAT

version with

address output

functions added

Mask ROM

version On-chip large-

capacity single-

power-supply flash

memory

Internal step-down

circuit

H8/3062 F-ZTAT

high-speed

operation version

Product

code HD64F3062 HD64F3062R HD6433062

HD6433061

HD6433060

HD64F3064 HD64F3062A

arrange-

ment

See figures 1.2

and 1.3, Pin

Arrangement, in

section 1

See figures 1.2

and 1.3, Pin

Arrangement, in

section 1

See figures 1.2

and 1.3, Pin

Arrangement, in

section 1

5 V operation

model has VCL pin,

and requires

connection of

external capacitor

See figures 1.4

and 1.5, Pin

Arrangement, in

section 1

5 V operation

model has VCL pin,

and requires

connection of

external capacitor

See figures 1.4

and 1.5, Pin

Arrangement, in

section 1

RAM size 4 kbytes 4 kbytes H8/3062:

4 kbytes

H8/3061:

4 kbytes

H8/3060:

2 kbytes

8 kbytes 4 kbytes

ROM size 128 kbytes 128 kbytes H8/3062:

128 kbytes

H8/3061:

96 kbytes

H8/3060:

64 kbytes

256 kbytes 128 kbytes

H8/3062F-ZTAT H8/3062F-ZTAT

R-Mask Version

H8/3062 Mask

ROM Version,

H8/3061 Mask

ROM Version,

H8/3060 Mask

ROM Version H8/3064F-ZTAT H8/3062F-ZTAT

A-Mask Version

Address

output

functions

Compatible with

previous H8/300H

Series

Address update

mode 1 or 2

selectable

See 6.3.5,

Address Output

Method,

in section 6

Address update

mode 1 or 2

selectable

See 6.3.5,

Address Output

Method,

in section 6

Address update

mode 1 or 2

selectable

See 6.3.5,

Address Output

Method,

in section 6

Address update

mode 1 or 2

selectable

See 6.3.5,

Address Output

Method,

in section 6

Flash

memory See section 17,

ROM See section 17,

ROM — See 18.1.1,

Differences

between

H8/3062F-ZTAT

and H8/3062F-

ZTAT R-Mask

Version,

in section 18

See 19.1.1,

Differences

between

H8/3062F-ZTAT

and H8/3062F-

ZTAT R-Mask

Version,

in section 19

Electrical

charac-

teristics

(operating

frequency)

See table 22.1,

Comparison of

H8/3062 Series

Electrical

Characteristics,

in section 22

See table 22.1,

Comparison of

H8/3062 Series

Electrical

Characteristics,

in section 22

See table 22.1,

Comparison of

H8/3062 Series

Electrical

Characteristics,

in section 22

See table 22.1,

Comparison of

H8/3062 Series

Electrical

Characteristics,

in section 22

See table 22.1,

Comparison of

H8/3062 Series

Electrical

Characteristics,

in section 22

1 to 20 MHz 1 to 20 MHz 1 to 20 MHz 2 to 25 MHz 2 to 25 MHz

Registers See table B.1,

Comparison of

H8/3062 Series

Internal I/O

Specifications,

in appendix B

See table B.1,

Comparison of

H8/3062 Series

Internal I/O

Specifications,

in appendix B

See table B.1,

Comparison of

H8/3062 Series

Internal I/O

Specifications,

in appendix B

See table B.1,

Comparison of

H8/3062 Series

Internal I/O

Specifications,

in appendix B

See table B.1,

Comparison of

H8/3062 Series

Internal I/O

Specifications,

in appendix B

See appendix B.1,

Address List See appendix B.1,

Address List See appendix B.2,

Address List See appendix B.3,

Address List

Usage

notes See 1.4,

H8/3062F-ZTAT

R-Mask Version

Usage Note, in

section 1

See 1.4,

H8/3062F-ZTAT

R-Mask Version

Usage Note, in

section 1

See 1.4,

H8/3062F-ZTAT

R-Mask Version

Usage Note, in

section 1

See 1.5,

H8/3064F-ZTAT

and H8/3062F-

ZTAT A-Mask

Version Usage

Note, in section 1

See 1.5,

H8/3064F-ZTAT

and H8/3062F-

ZTAT A-Mask

Version Usage

Note, in section 1

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