Ebyte EO01C-MLO1S User manual

Table of contents

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(eo)

©

EBYTE

EO01C-MLO1S

User

Manual

Si24R1

2.4GHz

SPI

SMD

Wireless

Module

Chengdu

Ebyte

Electronic

Technology

Co.,Ltd.

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

CONTENTS

TLOVETVIEW

«

«oot

ttt

e

tite

ete

ee

ee ee

eee

ee

ee

2

1.1

Brief

Introduction

. . . .

«coo

2

T2

Features

.

«o.oo

2

T3APPLCAtION

. . .

«oo

2

2.

Specification

and

Parameter

. . .

.

...

oo...

tte

4

2.1

Limit

parameter

. . .

o.oo.

eee

4

2.2

Operating

Parameter

. . . .

..

oo.

outta

4

3.Sizeand

pin

definition

. .

.........L

5

4.BASIC

OPETALION

. «

«oo

oot

teeta

6

41

Hardware

desi@il

. .

...

oot

6

42 Software

editing

. . . .

o.oo

6

SCIrCWt

dIAGIAIM

. . .

o.oo

tt

eee

7

0.

FAQ

«a

7

6.1

Communication

range

Stoo

short...

LL...

7

62

Module

is

easy

to

damage

. .

....

o.oo

7

6.3

BER(BitError

Rate)ishigh

.

.......

7

7.50ldering

gUIdanCe

. . . .

«oot

7

7.1

Reflow

soldering

temperature

. . .

..

oo...

tt

8

72

Reflow

Soldering

CUIVE

. . .

o.oo

ee

ee

ee

8

8

Packing

method

for

bulk

order...

...

LL...

8

Revision

history

. .

«oo

9

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

1.0verview

1.1

Brief

introduction

EO01C-MLOIS

is

a

small

size

SMD

module

based

on

Si24R1,

operates

at

2.4Ghz

with

PCB

antenna,

using

industrial-grade

high-precision

16MHz

crystal

oscillator.

The

RF

performance

of

it

and

components

selection

during

R&D

are

all

in

accordance

with

industrial

grade

standards.

The

user

needs

to

use

the

MCU

driver

or

use

a

dedicated

SPI

debugging

tool

to

develop

EO1C-MLO1S.

1.2

Features

®

Small

size,

12x19mm;

®

Communication

distance

tested

is

up

to

300m;

®

The

maximum

transmit

power

is

SmW,

and

the

software

is

multi-level

adjustable;

®

Global

license-free

ISM

2.4GHz

frequency

band,

®

2Mbps,

1Mbps

and

250kbps

air

rate;

®

125

communication

channels

to

meet

application

requirements

such

as

multipoint

communication,

grouping,

and

frequency

hopping;

®

Connect

with

MCU

through

SPI

interface,

the rate

is

0~10Mbps;

®

2.0~3.6V

power

supply,

power

supply

greater

than

3.3V

can

guarantee

the

best

performance;

®

Industrial

standard

design

for

long-term

use

at

-40~+85°C;

®

Comes

with

PCB

onboard

antenna,

no

need

for

external

antenna;

®

Fully

compatible

with

EO1-MLOI1S

in

software,

hardware

and

packaging.

®

FE01C-MLO1S

has

obtained

ROHS

certification

1.3

Application

Wearable

device;

Smart

home

and

industrial

sensors;

Security

system,

positioning

system;

Wireless

remote

control,

drone;

Wireless

game

remote

control;

Healthcare

products;

Wireless

voice,

wireless

headset;

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

®

Automotive

industry

applications.

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

2.

Specification

and

parameter

2.1

Limit

parameter

.

Performance

Main parameter

-

Remark

Min.

Max.

Power

supply

(V)

0

36

Voltage

over

3.6V

will

cause

permanent

damage

to

module

Chances

of

burn

is

slim

when

modules

Blocking

power

(dBm)

10

are

used

in

short

distance

Operating

temperature

(°C)

-40

85

2.2

Operating parameter

Main

parameter

Performance

Remark

Min.

Typ.

Max.

Operating

voltage

(V)

2.0

33

3.6

>3.3V

ensures

output

power

Communication

level

(V)

33

Fors

py

at

risk

of

Operating

temperature

(°C)

-40

i

+85

Industrial

design

Operating

frequency

(MHz)

24

"

2.525

Support

ISM

band

Tx

current

12

0dBm

Power

Rx

current

15

consumption

Sleep current

0.7

Software

is

shut

down

Max

Tx

power

(dBm)

-

7

-

Receiving

sensitivity

(dBm)

"

-83

"

Air

data

rate

is

250kbps

Air

data

rate

(bps)

250k

-

2M

Controlled

via

user’s

programming

Main

parameter

Description

Remark

Do

ee

|

dwn

|

[on

dead

sa

wns

S01

ns

FIFO

32Byte

Max

length

transmitted

each

time

Crystal

frequency

16MHz

Modulation

GFSK

Package

SMD

Connector

1.27mm

Communication

interface

SPI

0-10Mbps

Size

12

*

19mm

Without

SMA

Antenna

PCB

antenna

500hm

impedance

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

3.

Size

and

pin

definition

12.0+0.1mm 1.63+0.1mm

1.27 1.56

BEE

allo

lolldlldlldllo

olldlldlldlldllolollo

8

7

6

5

4

3 2

1 1

2 3

4

5

6

7

8

19.0+0.1mm

0.7200

—

|—

ANT

0.60

0.60

Top

pad:

Bottom

pad

:

0.60

190

0.601]

1:80

0.90

0.90

Pad

quantity

:

8

Unit:

mm

Pin No.

Pin

item

Pin

direction

[Pin

application

1

VCC

Power

supply

must

be

2.0

~3.6V

CE

Input

Chip

Enable

CSN

Input

SPI

Chip

select

SCK

Input

SPI

clock

MISO

Output

SPI

master

input

slave

output

IRQ

Output

Interrupt

request.

GND

Ground

2

3

4

5

MOSI

Input

SPI

master

output

slave

input

6

7

8

ene

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

4.Basic

operation

4.1

Hardware

design

®

tis

recommended

to

use

a

DC

stabilized

power

supply.

The

power

supply

ripple

factor

is

as

small

as

possible,

and

the

module

needs

to

be

reliably

grounded;

®

Please

pay

attention

to

the

correct

connection

of

the

positive

and

negative

poles

of

the

power

supply.

Reverse

connection

may

cause

permanent

damage

to

the

module;

®

Please

check

the

power

supply

to

ensure

it

is

within

the

recommended

voltage

otherwise

when

it

exceeds

the

maximum

value

the

module

will

be

permanently

damaged,

®

Please

check

the

stability

of

the

power

supply,

the

voltage

can

not

be

fluctuated

frequently;

®

When

designing

the

power

supply

circuit

for

the

module,

it

is

often

recommended

to

reserve

more

than

30%

of

the

margin,

so

the

whole

machine

is

beneficial

for

long-term

stable

operation;

®

The

module

should

be

as

far

away

as

possible

from

the

power

supply,

transformers,

high-frequency

wiring

and

other

parts

with

large

electromagnetic

interference;

®

High-frequency

digital

routing,

high-frequency

analog

routing,

and

power

routing

must

be

avoided

under

the

module.

If

it

is

necessary

to

pass

through

the

module,

assume

that

the

module

is

soldered

to

the

Top

Layer,

and

the

copper

is

spread

on

the

Top

Layer

of

the

module

contact

part(well

grounded),

it

must

be

close

to

the

digital

part

of

the

module

and

routed

in

the

Bottom

Layer;

®

Assuming

the

module

is

soldered

or

placed

over

the

Top

Layer,

it

is

wrong

to

randomly

route

over

the

Bottom

Layer

or

other

layers,

which

will

affect

the

module's

spurs

and

receiving

sensitivity

to

varying

degrees;

®

It

is

assumed

that

there

are

devices

with

large

electromagnetic

interference

around

the

module

that

will

greatly

affect

the

performance.

It

is

recommended

to

keep

them

away

from

the

module

according

to

the

strength

of

the

interference.

If

necessary,

appropriate

isolation

and

shielding

can

be

done;

®

Assume

that

there

are

traces

with

large

electromagnetic

interference

(high-frequency

digital,

high-frequency

analog,

power

traces)

around

the

module

that

will

greatly

affect

the

performance

of

the

module.

It

is

recommended

to

stay

away

from

the

module

according

to

the

strength

of

the

interference.

If

necessary,

appropriate

isolation

and

shielding

can

be

done.

®

If

the

communication

line

uses

a

5V

level,

a

1k-5.1k

resistor

must

be

connected

in

series

(not

recommended,

there

is

still

a

risk

of

damage);

®

Try

to

stay

away

from

some

physical

layers

such

as

TTL

protocol

at

2.4GHz

,

for

example:

USB3.0;

®

The

mounting

structure

of

antenna

has

a

great

influence

on

the

performance

of

the

module.

It

is

necessary

to

ensure

that

the

antenna

is

exposed,

preferably

vertically

upward.

When

the

module

is

mounted

inside

the

case,

use

a

good

antenna

extension

cable

to

extend

the

antenna

to

the

outside;

®

The

antenna

must

not

be

installed

inside

the

metal

case,

which

will

cause

the

transmission

distance

to

be

greatly

weakened.

®

Conductors

or

other

sources

of

interference

should

be

avoided

around

the

onboard

PCB

antenna.

42

Software

editing

®

Insert

the

module

into

the

user

circuit

board,

use

the

microcontroller

to

communicate

with

the

module

by

SPI

or

serial

port,

and

operate

the

control

register

and

the

transceiver

buffer

through

the

SPI

command

to

complete

the

wireless

data

transmit

and

receive

function.

®

As

interrupt

pin

for

IRQ,

it

can

be

used

to

wake-up

MCU

and

achieve

fast

response;

But

the

user

can

get

the

interrupt

status

through

SPI

(not

recommended,

it

is

not

conducive

to

the

overall

power

consumption,

and with

low efficiency)

®

CE

pin

can

be

high

level

for

long-term,

but

it

needs

to

set

as

POWER

DOWN

mode

when

the

module

writes

registers,

and

itis

recommended

that

CE

is

controlled

by

MCU

pin;

LE

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

5

Circuit

diagram

STMSL

|

~

20

VCC

J

PC3

PER

——

FF

25

pCa PCI

oH

—

Lid

vee

—9

PAD PCO

O75

39

CE

—

PAI

SPI_SCK/PBS

[03

I

70

CSN

—=(

pA2

SPI_MISO/PB7

(O=

=

SCK

—=

PA3

SPI_MOSI/PB6

©

2

6

J

MOS!

=J

VSS

SP1_NSS/PB4

3

=i

MISO

—

04

VDD

PB3

5

rae

IRQ

—5C

PDO

PB2

07

[9

GND

—3

PBO

PBl

C———

ee

[oe

ai

i

2

EO1C-MLO1S

iN

6.

FAQ

6.1

Communication

range

is

too

short

The

communication

distance

will

be

affected

when

obstacle

exists.

Data

lose

rate

will

be

affected

by

temperature,

humidity

and

co-channel

interference.

The

ground

will

absorb

and

reflect

wireless

radio

wave,

so

the

performance

will

be

poor

when

testing

near

ground.

Sea

water

has

great

ability

in

absorbing

wireless

radio

wave,

so

performance

will

be

poor

when

testing

near

the

sea.

The

signal

will

be

affected

when

the

antenna

is

near

metal

object

or

put

in

a

metal

case.

Power

register

was

set

incorrectly,

air

data

rate

is

set as

too

high

(the

higher

the

air

data

rate,

the

shorter

the

distance).

The

power

supply

low

voltage

under

room

temperature

is

lower

than

2.5V,

the

lower

the

voltage,

the

lower

the

transmitting

power.

Due

to

antenna

quality

or

poor

matching

between

antenna

and

module.

6.2

Module

is

easy

to

damage

®

Please

check

the

power

supply

source,

ensure

it

is

2.0V~3.6V,

voltage

higher

than

3.6V

will

damage

the

module.

®

Please

check

the

stability

of

power

source,

the

voltage

cannot

fluctuate

too

much.

®

Please

make

sure

antistatic

measure

are

taken

when

installing

and

using,

high

frequency

devices

have

electrostatic

susceptibility.

®

Please

ensure

the

humidity

1s

within

limited

range,

some

parts

are

sensitive

to

humidity.

®

Please

avoid

using

modules

under

too

high

or

too

low

temperature.

6.3

BER(Bit

Error Rate)

is

high

®

There

are

co-channel

signal

interference

nearby,

please

be

away

from

interference

sources

or

modify

frequency

and

channel

to

avoid

interference;

®

Poor

power

supply

may

cause

messy

code.

Make

sure

that

the

power

supply

is

reliable.

®

The

extension

line

and

feeder

quality

are

poor

or

too long,

so

the

bit

error

rate

is

high;

7.Soldering

guidance

LE

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

7.1

Reflow

soldering

temperature

Lo.

Sn-Pb

Profile

Feature

Curve

characteristics

Pb-Free

Assembly

Assembly

Solder

Paste

Solder

paste

Sn63/Pb37

S1n96.5/Ag3/Cu0.5

Preheat

Temperature

min

(Tsmin)

Min

preheating

temp.

100°C 150°C

Preheat

temperature

max

(Tsmax)

Mx

preheating

temp.

150°C

200°C

Preheat

Time

(Tsmin

to

Tsmax)(ts)

Preheating

time

60-120

sec

60-120

sec

Average

ramp-up

rate(Tsmax

to

Tp)

Average

ramp-up

rate

3°C/second

max

3°C/second

max

Liquidous

Temperature

(TL)

Liquid

phase

temp.

183°C

217°C

Time

(tL)

Maintained

Above

(TL) Time

below

liquid

phase

line

60-90

sec

30-90

sec

Peak

temperature

(Tp)

Peak

temp.

220-235°C 230-250°C

Aveage

ramp-down

rate

(Tp

to

Tsmax)

Average

ramp-down

rate

6°C/second

max

6°C/second

max

Time

25°C

to

peak

temperature

Time

to

peak

temperature

for

25°C

6

minutes

max

8

minutes

max

7.2

Reflow

soldering

curve

Te

RE

hhh

5s;

Critical

Zone

TLto

Te

|

o

TSmax

I

I

|

©

a

g

L

3

BY

ee

xeapuii

tans

Preheat

25

t

257C

to

Peak

Time

=>

8

Packing

method

for

bulk

order

LE

Chengdu

Ebyte

Electronic

Technology

Co.,

Ltd

EO01C-MLOLS

User

Manual

{

3300.2

35801

|

36501

F

1

Ls

.

|

23401

7

x

|

19.4320

i

20.0

i i

13.7

Each

Tray

1000

pcs

Revision

history

Version

Date

Description

Issued

by

1.0

2020-06-19

Original

version

Ren

1.1

2020-06-29

Format

updated

Ren

12

2020-07-24

Ren

1.3

2022-5-23

Bug

fixes

Yan

About

us

Technical

support:

[email protected]

Documents

and

RF

Setting

download

link::

www.ebyte.com

Thank

you

for

using

Ebyte

products!

Please

contact

us

with

any

questions

or

suggestions:

info(@cdebyte.com

Official

hotline:028-61399028

Web:

www.ebyte.com

Address:

B5

Mould

Park,

199#

Xiqu

Ave,

High-tech

District,

Sichuan,

China

(on)

©

eEBY

TE

Chengdu

Ebyte

Electronic

Technology

Co.,Ltd.