Dell E2222H User manual
DELL E2222H Teardown Instruction
1
1. Remove Rear Cover Screw and Stand
Screws
a. Remove screws “1~6” on rear cover with
electric screwdriver
b. Torque: 12. +/- .5Kgf/cm, Phillips
screwdriver
4. Remove VGA screw
a. Remove screws “1~2” with electric
screwdriver
b. Torque: 12. +/- .5Kgf/cm, hex screwdriver
2. Remove Rear Cover
a. Pry off the back cover of the machine
with the aid of the dismantling fixture, in
the sequence of “Bottom->Left/Right-
>Top”
5. Remove Chassis Screw
a. Remove screws “1~2” with electric
screwdriver
b. Torque: 3.5 +/- .5Kgf/cm, Phillips
screwdriver
b. Remove Light Bar and Keypad Cable:
a.
Remove acetate cloth tape marked with
“1”, then remove light bar (grasp on Pin
then pull outwards to remove)
b.
Remove Keypad cable “2”
6. Remove Aluminium Foil and LVDS Cable
a. Remove aluminium tape then remove LVDS
cable (Pinch on clips on the sides)
Start
DELL E2222H Teardown Instruction
2
7. Remove PCBA 1
a. Remove mylar (squared in red in the
upper picture)
b. Remove grounding screw “1” then
locking screws marked “2~5” with
electric screwdriver
c. Torque: 5.5 +/- .5Kgf/cm, Phillips
screwdriver
1 .
Remove Keypad
a. Remove keypad from front cover
(loosen hook circled in red first)
8. Remove PCBA 2
a. Remove PI board and IF board
b. Separate PI board from IF board
11. Remove Components on PI Board 1
a. Remove electrolyte capacitor >25mm height
(squared in red) from printed circuit boards
b. Cut the glue between bulk cap and PCBA with
knife – ensure cutting path within the glue,
don’t touch bulk cap and PCBA
9.
Remove LVDS Cable and Light Bara
a. Remove light bar from PI board (grasp
on Pin then pull upwards to remove)
b. Remove LVDS cable from IF board (lift
cover before remove)
12. Remove Components on PI Board 2
a. Take out the capacitor pin solder with
soldering iron
b. Lift the bulk capacitor away from power
board
S7 S1
DELL E2222H Teardown Instruction
3
1. Product Material Information
The following substances, preparation, or components should be disposed of or recovered separately
from other WEEE in compliance with Article 4 of EU Council Directive 75/422/EEC.
Capacitors / Condensers (containing PCB/PCT) Not used
Mercury containing components Not used
Batteries Not used
Printed circuit boards (with surface greater than 1
square cm)
Product has printed circuit boards (with surface
greater than 1 square cm)
Component contain toner, ink and liquids Not used
Plastic containing BFR
Component and waste contain asbestos Not used
CRT Not used
Component contain CFC, HCFC, HGC and HC Not used
Gas discharge lamps Not use
LCD display > 1 cm2 Product LCD greater than 1 cm2
External electric cable Product has external cables
Component contain refractory ceramic fibers Not used
Component contains radio-active substances Not used
Electrolyte capacitors (height > 25mm,
diameter >25mm)
Product has electrolyte capacitors (height > 25mm)
2. Tools Required
List the type and size of the tools that would typically can be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description:
-Screwdriver (Philip head with Φ5 mm & Φ3 mm)
-Screwdriver (Hexagonal to remove VGA connectivity)
-Soldering iron
-Knife
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